Multilayered ceramic capacitor with improved lead frame attachment

Patent metadata

Field	Value
Publication number	US-9799449-B2
Application number	US-201414498514-A
Country	US
Kind code	B2
Filing date	Sep 26, 2014
Priority date	Oct 28, 2011
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

First claim

The invention claimed is:

1. A method for forming a capacitor comprising the steps of:
providing a monolith comprising parallel conductive internal electrodes of alternating polarity with a dielectric between said conductive internal electrodes;
applying a first copper undercoat in direct electrical contact with said conductive internal electrodes having a first polarity;
applying a second copper undercoat in direct electrical contact with said conductive internal electrodes having a second polarity wherein said first copper undercoat or said second copper undercoat has a total copper film thickness of at least 1 microns to no more than 100 microns;
forming a flexible termination wherein said forming of said flexible termination comprises forming a solderable silver layer wherein said solderable silver layer comprises conductive adhesive;
soldering a first lead frame to said solderable silver layer in electrical contact with said first copper undercoat;
and
soldering a second lead frame in electrical contact with said second copper undercoat; and
wherein said forming said solderable silver layer comprises applying a solution with a solids content of 30-60 wt %.

2. The method of forming a capacitor of claim 1 wherein said flexible termination comprises silver particles in a polymeric matrix.

3. The method for forming a capacitor of claim 1 wherein said forming of said solderable silver layer comprises applying said solution with a viscosity of 1-10 Pa-S at 25° C.

4. The method for forming a capacitor of claim 1 wherein said first copper undercoat or said second copper undercoat has an surface oxide content of less than 1 percent.

5. The method for forming a capacitor of claim 1 wherein said first copper undercoat or said second copper undercoat has a surface glass content of about 5 to about 20 wt. percent.

6. The method for forming a capacitor of claim 5 wherein said first copper undercoat or said second copper undercoat has a surface glass content of about 5 to about 8 wt. percent.

7. The method for forming a capacitor of claim 1 wherein said first copper undercoat or said second copper undercoat has a total copper film thickness of at least 10 microns to no more than 100 microns.

8. The method for forming a capacitor of claim 1 further comprising surface treating of said copper.

9. The method for forming a capacitor of claim 8 further wherein said surface treating is acid cleaning or plasma cleaning.

10. The method for forming a capacitor of claim 1 wherein said applying a first copper undercoat comprises applying a solution with a viscosity of 20-50 Pa-S at 25° C.

11. The method for forming a capacitor of claim 1 wherein said applying a first copper undercoat comprises applying a paste comprising about 75-90 wt % copper and about 5-20 wt % glass frit.

12. The method for forming a capacitor of claim 11 wherein said applying a first copper undercoat comprises applying a paste comprises about 5-8 wt % glass frit.

13. The method for forming a capacitor of claim 11 wherein said glass frit is cadmium and bismuth free.

14. The method for forming a capacitor of claim 1 wherein said internal electrodes comprise a base metal.

15. The method for forming a capacitor of claim 14 wherein said base metal is selected from nickel, copper, titanium, tungsten and molybdenum.

16. The method of forming a capacitor of claim 15 wherein said internal electrodes comprise an alloy of nickel.

17. The method of forming a capacitor of claim 16 wherein said alloy comprises at least one material selected from the group consisting of Cu, Si, Ba, Ti, Mn, Cr, Co, and AI.

18. The method of forming a capacitor of claim 17 wherein said alloy comprises at least 95 wt % nickel.

19. The method of forming a capacitor of claim 1 wherein said lead frame comprises a material selected from phosphor bronze alloy 510, nickel iron alloy 42, and copper iron alloy 194.

20. The method of forming a capacitor of claim 1 wherein said lead frame has a thickness of 76-500 microns.

21. The method of forming a capacitor of claim 1 wherein said soldering a first lead frame comprises soldering with a material which is lead free.

22. The method of forming a capacitor of claim 21 wherein said solder comprises 5-30 wt % antimony.

23. A method for forming a capacitor comprising the steps of:
providing a monolith comprising parallel conductive internal electrodes of alternating polarity with a dielectric between said conductive internal electrodes wherein said conductive internal electrodes comprise a precious metal;
applying a first silver undercoat in direct electrical contact with said conductive internal electrodes having a first polarity;
applying a second silver undercoat in direct electrical contact with said conductive internal electrodes having a second polarity;
applying a first flexible layer on said first silver undercoat;
applying a first solderable silver layer on said first flexible layer wherein said first solderable silver layer comprises conductive adhesive;
applying a second flexible layer on said second silver undercoat;
applying a second solderable silver layer on said second flexible layer wherein said second solderable silver layer comprises conductive adhesive;
soldering a first lead frame in electrical contact with said first silver solderable silver layer;
soldering a second lead frame in electrical contact with said second silver solderable layer;
further comprising forming said solderable silver layer after said forming said flexible layer and prior to said soldering a first lead frame; and
wherein said forming a solderable silver layer comprises applying a solution with a solids content of 30-60 wt %.

24. The method of forming a capacitor of claim 23 wherein said first flexible layer comprises silver particles in a polymeric matrix.

25. The method of forming a capacitor of claim 23 wherein said first flexible layer is formed by applying a paste and drying said paste.

26. The method of forming a capacitor of claim 25 wherein said paste comprises 77-79 wt % silver particles and 10-15 wt % organic resin in an organic solvent.

27. The method of forming a capacitor of claim 25 wherein said paste has a viscosity of at least 5 Pa-S to no more than about 50 Pa-S at 25° C.

28. The method of forming a capacitor of claim 27 wherein said paste has a viscosity of at least 7 Pa-S to no more than about 15 Pa-S at 25° C.

29. The method for forming a capacitor of claim 23 wherein said forming a solderable silver layer comprises applying said solution with a viscosity of 1-10 Pa-S at 25° C.

30. The method for forming a capacitor of claim 23 wherein said first silver undercoat or said second silver undercoat has a total silver film thickness of at least 1 micron to no more than 100 microns.

31. The method for forming a capacitor of claim 30 wherein said first silver undercoat or said second silver undercoat has a total silver film thickness of at least 10 micron to no more than 100 microns.

32. The method for forming a capacitor of claim 23 wherein said applying said first silver undercoat comprises applying a paste and drying said paste.

33. The method for forming a capacitor of claim 23 wherein conductive internal electrodes comprises a material selected f

Assignees

• Kemet Electronics Corp

Inventors

• Hill R Allen
• Lessner Philip M
• Phillips Reggie
• Brown Keith
• Byrd James B

Classifications

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• Y10T29/43

  Electric condenser making · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title