Solid state drive apparatus

Patent metadata

Field	Value
Publication number	US-9798361-B2
Application number	US-201615130026-A
Country	US
Kind code	B2
Filing date	Apr 15, 2016
Priority date	Aug 25, 2015
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Provided is a solid state drive apparatus having improved reliability. The solid state drive apparatus includes: a substrate on which at least one non-volatile memory device is mounted; a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case; a bumper case mounted in the accommodating portion of the main body case; and an shock-absorbing member connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein the main body case and the bumper case form an exterior of the solid state drive apparatus as adjacent portions of the main body case and the bumper case are located on a same plane with the separation distance therebetween.

First claim

What is claimed is:

1. A solid state drive apparatus, comprising:
a substrate on which at least one non-volatile memory device is mounted;
a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case;
a bumper case mounted in the accommodating portion; and
a pair of shock-absorbing members connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein a first one of the pair of shock-absorbing members has a first orientation, and a second one of the pair of shock-absorbing members has a second orientation that is different from the first orientation,
wherein the main body case and the bumper case form an exterior of the solid state drive apparatus, and wherein adjacent portions of the main body case and the bumper case are substantially co-planar.

2. The solid state drive apparatus of claim 1 , wherein the main body case comprises an upper case and a lower case, wherein the upper case comprises an upper depressed portion at the corner of the main body case, wherein the lower case comprises a lower depressed portion at the corner of the main body case, wherein the upper and lower depressed portions define the accommodating portion, and wherein the substrate is installed in an internal accommodation space between the upper case and the lower case.

3. The solid state drive apparatus of claim 2 , wherein the bumper case comprises an upper bumper case mounted in the upper depressed portion and a lower bumper case mounted in the lower depressed portion.

4. The solid state drive apparatus of claim 2 , wherein the bumper case is mounted in the accommodating portion over the upper and lower depressed portions.

5. The solid state drive apparatus of claim 1 , wherein each of the pair of shock-absorbing members comprises at least one of an elastic member, a stopper, a damper, and an elastic spring.

6. The solid state drive apparatus of claim 1 , wherein the bumper case is rounded at a corner of the exterior of the solid state drive apparatus.

7. The solid state drive apparatus of claim 1 , wherein the bumper case has a triangular shape, a square shape, an arc shape or a L-shape.

8. The solid state drive apparatus of claim 1 , wherein the accommodating portion is formed over two adjacent corners of the main body case and a side between the two corners.

9. The solid state drive apparatus of claim 8 , wherein the bumper case has a linear shape or a U-shape.

10. The solid state drive apparatus of claim 1 , wherein the main body case and the bumper case are formed of copper, aluminum, or stainless steel, or a clad metal including at least one of copper, aluminum, and stainless steel.

11. The solid state drive apparatus of claim 1 , wherein the at least one non-volatile memory device and the main body case thermally contact each other via a thermal interface material (TIM).

12. A solid state drive apparatus, comprising:
a substrate in which at least one non-volatile memory device is mounted;
a main body case comprising an accommodation portion at each of four corners of the main body case, wherein the substrate is accommodated in the main body case;
a bumper case mounted in each accommodation portion; and
a respective pair of shock-absorbing members connecting the main body case and each bumper case, wherein each of the shock-absorbing members is configured to ensure that a separation distance between the main body case and a respective bumper case does not decrease beyond a set value when an impact is applied to the respective bumper case, wherein a first shock-absorbing member in each pair of shock-absorbing members has a first orientation, and wherein a second shock-absorbing member in each pair of shock-absorbing members has a second orientation that is different from the first orientation,
wherein adjacent portions of the main body case and each bumper case are substantially co-planar.

13. The solid state drive apparatus of claim 12 , wherein the main body case comprises an upper case and a lower case, and wherein the substrate is accommodated in an internal accommodation space between the upper case and the lower case.

14. The solid state drive apparatus of claim 13 , wherein the upper case comprises a depressed portion, wherein the lower case comprises a depressed portion, and wherein a portion of the substrate is inserted into a substrate accommodation space formed between the depressed portions of the upper case and the lower case.

15. A solid state drive apparatus, comprising:
a substrate on which at least one non-volatile memory device is mounted;
a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case;
a bumper case mounted in the accommodating portion; and
a pair of shock-absorbing members connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein a first one of the pair of shock-absorbing members has a first orientation, and a second one of the pair of shock-absorbing members has a second orientation that is different from the first orientation, and wherein the shock-absorbing members are configured to ensure that the separation distance does not decrease beyond a set value when an impact is applied to the bumper case.

16. The solid state drive apparatus of claim 15 , wherein each one of the pair of shock-absorbing members comprises a device configured to restrict movement of the respective shock-absorbing member.

17. The solid state drive apparatus of claim 15 , wherein each one of the pair of shock-absorbing members comprises at least one of an elastic member, a stopper, a damper, and an elastic spring.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Jung-Hoon

Classifications

• G06F1/182 Primary

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• G06F1/187

  Mounting of fixed or removable disk drives · CPC title

• H05K5/0256 Primary

  of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms · CPC title