Resin composition, resist film using same, resist-coated mask blank, resist pattern forming method, and photo mask

Patent metadata

Field	Value
Publication number	US-9798234-B2
Application number	US-201615212552-A
Country	US
Kind code	B2
Filing date	Jul 18, 2016
Priority date	Feb 25, 2014
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

An actinic ray sensitive or radiation sensitive resin composition contains a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b), a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation, and a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher:
(a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and (b) the glass transition temperature (Tg) is 140° C. or higher.

First claim

What is claimed is:

1. An actinic ray sensitive or radiation sensitive resin composition comprising:
a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b);
a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation; and
a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher:
(a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and
(b) the glass transition temperature (Tg) is 140° C. or higher,
wherein the crosslinking agent (C) contains
two or more crosslinking groups of at least one selected from the group consisting of hydroxymethyl groups and alkoxymethyl groups,
two or more benzene rings, and
a cyclic aliphatic hydrocarbon group, and
the ratio of the number of crosslinking groups to the number of benzene rings is 1.0 or less.

2. The actinic ray sensitive or radiation sensitive resin composition according to claim 1 ,
wherein the polymer compound (A) further satisfies the following (c):
(c) the dispersity (Mw/Mn) is 1.2 or less.

3. The actinic ray sensitive or radiation sensitive resin composition according to claim 1 ,
wherein the polymer compound (A) has
a repeating unit having a phenolic hydroxyl group, and
a repeating unit having a group formed by substituting a hydrogen atom of a hydroxyl group in a phenolic hydroxyl group with a substituent.

4. The actinic ray sensitive or radiation sensitive resin composition according to claim 1 ,
wherein the polymer compound (A) has a repeating unit represented by Formula (II) below in an amount of 10 mol % to 90 mol % with respect to the all repeating units of the polymer compound (A),

wherein in the formula, R 2 represents a hydrogen atom, a methyl group which may have a substituent, or a halogen atom, B′ represents a single bond or a divalent organic group, Ar′ represents an aromatic ring group, and m represents an integer of 1 or more.

5. A resist film that is formed by using the actinic ray sensitive or radiation sensitive resin composition according to claim 1 .

6. The resist film according to claim 5 ,
wherein the film thickness thereof is 10 nm to 150 nm.

7. A resist-coated mask blank comprising:
a mask blank; and
the resist film according to claim 5 which is formed on the mask blank.

8. A resist pattern forming method comprising:
exposing the resist film according to claim 5 ; and
developing the exposed film.

9. A resist pattern forming method comprising:
exposing the resist-coated mask blank according to claim 7 ; and
developing the exposed resist-coated mask blank.

10. The resist pattern forming method according to claim 8 ,
wherein the exposure is performed using an electron beam or extreme-ultraviolet rays.

11. A photo mask that is obtained by exposing and developing the resist-coated mask blank according to claim 7 .

Assignees

• Fujifilm Corp

Inventors

• Tsuchimura Tomotaka
• Yamaguchi Shuhei
• Yokokawa Natsumi

Classifications

• G03F7/70691

  Handling of masks or workpieces · CPC title

• G03F7/004 Primary

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• C09D125/18

  Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen · CPC title

• C08F212/32

  containing two or more rings · CPC title

• C08F212/12

  Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical · CPC title