Multi-axis force sensing soft artificial skin

US9797791B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9797791-B2
Application numberUS-201314438792-A
CountryUS
Kind codeB2
Filing dateOct 22, 2013
Priority dateOct 27, 2012
Publication dateOct 24, 2017
Grant dateOct 24, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor including a layer having viscoelastic properties, the layer comprising a void, the void filled with a fluid; and optionally, a more rigid sensing element embedded within the layer. When a force is applied to a surface of the sensor, the shape of the void changes, causing the electrical resistance of the fluid in the void to change. When included, the more rigid sensing element can bear upon the void to cause the electrical resistance of the fluid in the void to change. A direction and intensity of the force can be determined by measuring the change of the electrical resistance of different voids positioned about the sensing element. The layer can be an elastomer, preferably silicone rubber. The fluid can be a conductive liquid, preferably Eutectic Gallium Indium. The sensing element can be plastic and can have a “Joystick” shape. The voids can take the form of channels or microchannels having a predefined pattern and/or shape.

First claim

Opening claim text (preview).

We claim: 1. A multi-axis sensor comprising: a layer of flexible material having a defined thickness and a contact surface; one or more substantially rigid sensing elements embedded within the flexible material, each sensing element including a substantially planar portion and at least one projecting portion extending substantially perpendicular to the planar portion, the planar portion being oriented substantially parallel to at least a portion of the contact surface; at least one microchannel in the flexible material extending near the planar portion of at least one of the rigid sensing elements, such that a force applied to the contact surface causes the rigid sensing element to move relative to the microchannel and cause the microchannel to change in a cross-sectional dimension; and a conductive fluid disposed in the at least one microchannel, wherein electrical resistance of the conductive fluid in the at least one microchannel changes as a function of the change in orientation of the rigid sensing element. 2. The multi-axis sensor according to claim 1 wherein the conductive fluid include Eutectic Gallium Indium. 3. The multi-axis sensor according to claim 1 wherein the projecting portion of at least the rigid sensing element extends along a first axis and the flexible material includes a plurality of microchannels arranged around the first axis adjacent the planar portion of the at least one rigid sensing element such that a force applied to the contact surface causes the rigid sensing element to move relative to the microchannel and cause the microchannel to change in a cross-sectional dimension. 4. A sensor comprising: a layer having viscoelastic properties, the layer comprising a void, the void filled with a fluid; and a solid structure embedded within the layer, wherein, when a force is applied to a top surface of the layer, the solid structure presses into the void, changes the shape of the void and causes a pressure of the fluid to change, and wherein a direction and intensity of the force is determined by measuring a change of the pressure of the fluid. 5. The sensor of claim 4 , wherein the layer comprises an elastomer. 6. The sensor of claim 4 , wherein the layer comprises silicone rubber. 7. The sensor of claim 4 , wherein the fluid is a conductive liquid. 8. The sensor of claim 7 , wherein the conductive liquid is Eutectic Gallium Indium. 9. The sensor of claim 4 , wherein the solid structure comprises plastic. 10. The sensor of claim 4 , wherein the solid structure comprises a lower portion having a width greater than a height of the lower portion and an upper portion having a height greater than a width of the upper portion, wherein the upper portion has a vertical axis that is parallel to or close to a vertical axis of the lower portion and wherein the upper and lower portion have horizontal cross sectional shapes that are circular or rounded. 11. The sensor of claim 4 , wherein the void comprises a plurality of microchannels radiating from a central axis. 12. The sensor of claim 11 , wherein the plurality of microchannels are continuously interconnected. 13. The sensor of claim 11 , wherein one of the plurality of microchannels terminates in a pad region adapted for connection to a lead. 14. The sensor of claim 11 , wherein two of the plurality of microchannels are connected to each other through a connecting region, wherein a size of the connecting region is greater than a size of each of the plurality of microchannels. 15. The sensor of claim 11 , wherein the void consists of twenty-four microchannels radiating from a central axis, wherein at least one microchannel of the twenty-four microchannels is connected to a first terminating region having a predefined shape, wherein at least one microchannel of the twenty-four microchannels is connected to a second microchannel of the twenty-four microchannels through a first connecting region having a predefined shape, wherein at least one microchannel of the twenty-four microchannels is connected to a third microchannel of the twenty-four microchannels through a second connecting region having the predefined shape, and wherein at least one microchannel of the twenty-four microchannels is connected to a second terminating region having a predefined shape. 16. The sensor of claim 15 , wherein the first terminating region has an area larger than the second terminating region. 17. A method of forming a sensor, the method comprising: forming a layer having viscoelastic properties, the layer comprising a void, the void filled with a fluid; forming a solid structure; and embedding the solid structure within the layer, wherein, when a force is applied to a top surface of the layer, the solid structure presses into the void, changes the shape of the void and causes a pressure of the fluid to change, and wherein a direction and intensity of the force is determined by measuring the change of the pressure of the fluid. 18. The method of claim 17 , wherein the layer comprises an elastomer. 19. The method of claim 17 , wherein the layer comprises silicone rubber. 20. The method of claim 17 , wherein the fluid is a conductive liquid. 21. The method of claim 20 , wherein the conductive liquid is Eutectic Gallium Indium. 22. The method of claim 17 , wherein the solid structure comprises plastic. 23. The method of claim 17 , wherein the solid structure comprises a lower portion having a width greater than a height of the lower portion and an upper portion having a height greater than a width of the upper portion, wherein the upper portion has a vertical axis that is parallel to or close to a vertical axis of the lower portion and wherein the upper and lower portion have horizontal cross sectional shapes that are circular or rounded. 24. The method of claim 17 , wherein the void comprises a plurality of microchannels radiating from a central axis. 25. The method of claim 24 , wherein the plurality of microchannels are continuously interconnected. 26. The method of claim 24 , wherein one of the plurality of microchannels terminates in a pad region adapted for connection to a lead. 27. The method of claim 24 , wherein two of the plurality of microchannels are connected to each other through a connecting region, wherein a size of the connecting region is greater than a size of each of the plurality of microchannels. 28. The method of claim 24 , wherein the void consists of twenty-four microchannels radiating from a central axis, wherein at least one microchannel of the twenty-four microchannels is connected to a first terminating region having a predefined shape, wherein at least one microchannel of the twenty-four microchannels is connected to a second microchannel of the twenty-four microchannels through a first connecting region having a predefined shape, wherein at least one microchannel of the twenty-four microchannels is connected to a third microchannel of the twenty-four microchannels through a second connecting region having a predefined shape, and wherein at least one microchannel of the twenty-four microchannels is connected to a second terminating region having a predefined shape. 29. The method of claim 28 , wherein the first terminating region has an area larger than the second terminating region. 30. The method of claim 17 , wherein

Assignees

Inventors

Classifications

  • Strain gauges · CPC title

  • G01L5/161Primary

    using variations in ohmic resistance · CPC title

  • G01L1/20Primary

    by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids (of piezo-resistive materials G01L1/18); by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress · CPC title

  • by hydraulic or pneumatic means · CPC title

  • the sensor is mounted in or on a conformable substrate or carrier · CPC title

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What does patent US9797791B2 cover?
A sensor including a layer having viscoelastic properties, the layer comprising a void, the void filled with a fluid; and optionally, a more rigid sensing element embedded within the layer. When a force is applied to a surface of the sensor, the shape of the void changes, causing the electrical resistance of the fluid in the void to change. When included, the more rigid sensing element can bear…
Who is the assignee on this patent?
Harvard College
What technology area does this patent fall under?
Primary CPC classification G01L5/161. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).