Abrasive material regeneration method and regenerated abrasive material

Patent metadata

Field	Value
Publication number	US-9796894-B2
Application number	US-201214367136-A
Country	US
Kind code	B2
Filing date	Dec 5, 2012
Priority date	Dec 22, 2011
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Abrasive material regeneration method regenerates a cerium oxide abrasive material from a used abrasive material slurry containing the cerium oxide abrasive material and resulting from grinding a grinding subject having silicon as the primary component, characterized by regenerating the abrasive material containing cerium oxide through: a slurry recovery step (A) for recovering an abrasive material slurry discharged from a grinder; an isolation/concentration step (B) for adding a magnesium salt as an inorganic salt to the recovered abrasive material slurry, aggregating the abrasive material under the condition that the pH value of the mother liquor converted to 25 DEG C is at least 6.5 and less than 10.0, and thus isolating and concentrating the abrasive material from the mother liquor; and an abrasive material recovery step (C) for recovering the isolated and concentrated abrasive material.

First claim

The invention claimed is:

1. A method for regenerating a cerium-oxide-containing abrasive from a used abrasive-containing slurry that was used in polishing an object mainly composed of silicon, the method comprising:
(A) collecting an abrasive-containing slurry discharged from an abrasive device;
(B) separating the cerium-oxide-containing abrasive from a mother liquid and concentrating the cerium-oxide-containing abrasive by adding a magnesium salt as an inorganic salt to the collected abrasive-containing slurry, separating the cerium-oxide-containing abrasive from a component derived from the polished object and aggregating the cerium-oxide-containing abrasive when the mother liquid has a pH ranging from 6.5 to less than 10.0 at 25° C.; and
(C) collecting the separated and concentrated cerium-oxide-containing abrasive,
wherein the cerium-oxide-containing abrasive consists of one or a plurality of rare-earth materials, and
wherein a first abrasive-containing slurry that contains washing water and a second abrasive-containing slurry that was used in polishing are collected in the step (A) such that the second abrasive-containing slurry is pooled to enable recirculation for polishing before being collected.

2. The method of claim 1 , further comprising:
(D) adjusting sizes of particles of the collected abrasive.

3. The method of claim 2 , wherein
in the step (C), the collecting is conducted through separation by decantation utilizing spontaneous sedimentation.

4. The method of claim 2 , wherein
in the step (D), a dispersing agent is added to a liquid of the collected abrasive, and thereafter dispersion is conducted using an ultrasonic disperser or a bead mill disperser to control the sizes of the particles of the regenerated abrasive.

5. The method of claim 4 , wherein
the disperser used in the step (D) is the ultrasonic disperser.

6. The method of claim 4 , wherein
the dispersing agent comprises a poly-carboxylic acid-based polymer.

7. The method of claim 1 , wherein
the first abrasive-containing slurry and the second abrasive-containing slurry collected in the step (A) are mixed before the steps (B) and (C).

8. The method of claim 1 , wherein
the first abrasive-containing slurry and the second abrasive-containing slurry collected in the step (A) are separately subjected to the steps (B) and (C).

9. A method for regenerating a cerium-oxide-containing abrasive from a used abrasive-containing slurry that was used in polishing an object mainly composed of silicon, the method comprising:
(A) collecting an abrasive-containing slurry discharged from an abrasive device;
(B) separating the cerium-oxide-containing abrasive from a mother liquid and concentrating the cerium-oxide containing abrasive by adding a magnesium salt as an inorganic salt to the collected abrasive-containing slurry, separating the cerium-oxide-containing abrasive from a component derived from the polished object and aggregating the cerium-oxide-containing abrasive when the mother liquid has a pH ranging from 6.5 to less than 10.0 at 25° C.; and
(C) collecting the separated and concentrated cerium-oxide-containing abrasive,
wherein:
a first abrasive-containing slurry that contains washing water and a second abrasive-containing slurry that was used in polishing are collected in the step (A), and the first abrasive-containing slurry and the second abrasive-containing slurry collected in the step (A) are mixed before the steps (B) and (C) such that the second abrasive-containing slurry is pooled to enable recirculation for polishing before being collected.

10. A method for regenerating a cerium-oxide-containing abrasive from a used abrasive-containing slurry that was used in polishing an object mainly composed of silicon, the method comprising:
(A) collecting an abrasive-containing slurry discharged from an abrasive device;
(B) separating the cerium-oxide-containing abrasive from a mother liquid and concentrating the cerium-oxide-containing abrasive by adding a magnesium salt as an inorganic salt to the collected abrasive-containing slurry, separating the cerium-oxide-containing abrasive from a component derived from the polished object and aggregating the cerium-oxide-containing abrasive when the mother liquid has a pH ranging from 6.5 to less than 10.0 at 25° C.; and
(C) collecting the separated and concentrated cerium-oxide-containing abrasive,
wherein:
a first abrasive-containing slurry that contains washing water and a second abrasive-containing slurry that was used in polishing are collected in the step (A), and the first abrasive-containing slurry and the second abrasive-containing slurry collected in the step (A) are separately subjected to the steps (B) and (C) such that the second abrasive-containing slurry is pooled to enable recirculation for polishing before being collected.

Assignees

• Konica Minolta Inc

Inventors

• Takahashi Atsushi
• Nagai Yuuki
• Maezawa Akihiro

Classifications

• C02F1/66

  by neutralisation; pH adjustment (for degassing C02F1/20; using ion-exchange C02F1/42; for flocculation or precipitation of suspended impurities C02F1/52; for removing dissolved compounds C02F1/58) · CPC title

• B24B57/02 Primary

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• C09K3/1409 Primary

  Abrasive particles per se (preparation of diamond C01B32/25) · CPC title

• B24B57/00 Primary

  Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (for abrasive blasting B24C1/00, B24C7/00) · CPC title

• C02F2101/10

  Inorganic compounds · CPC title