Structural handling film
US-2016229965-A1 · Aug 11, 2016 · US
Panel edge enclosures
US9796891B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9796891-B2 |
| Application number | US-201514823258-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 11, 2015 |
| Priority date | Aug 11, 2014 |
| Publication date | Oct 24, 2017 |
| Grant date | Oct 24, 2017 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: i) forming a panel structure having at least one edge; ii) heating and applying a reformable epoxy resin material onto the at least one edge; iii) contacting the reformable epoxy resin material within 10 minutes of applying the reformable epoxy resin material, wherein the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact; and wherein the reformable epoxy resin material is adapted to be removed by addition of heat above its glass transition temperature; and wherein after heating and applying, the reformable epoxy resin material is heated again above its glass transition temperature so that the panel structure is debonded and the at least one edge is open and no longer sealed. 2. The method according to claim 1 , wherein the reformable epoxy resin material is below its glass transition temperature post-heating in less than 10 minutes. 3. The method according to claim 1 , wherein the reformable epoxy resin material is below its glass transition temperature post-heating in less than 5 minutes. 4. The method according to claim 1 , wherein the reformable epoxy resin material is below its glass transition temperature post-heating in less than 2 minutes. 5. The method according to claim 4 , wherein the reformable epoxy resin material is extruded onto the at least one edge with a hot-melt gun. 6. The method according to claim 1 , wherein the reformable epoxy resin material is extruded onto the at least one edge with a hot-melt gun. 7. The method according to claim 1 , wherein the reformable epoxy resin material is below its glass transition temperature at ambient temperature. 8. The method according to claim 1 , wherein the panel structure is a furniture panel. 9. The method according to claim 1 , wherein the panel structure is an automotive or aerospace panel. 10. The method according to claim 1 , wherein the method is free of use of any liquid paste material. 11. The method according to claim 1 , wherein the method is free of storing the panel structure after heating so that the reformable epoxy resin material falls below its glass transition temperature. 12. The method according to claim 1 , wherein the contacting step includes sanding the reformable epoxy resin material. 13. The method according to claim 1 , wherein the reformable epoxy resin material is applied as an adhesive film. 14. A method comprising: i) forming a panel structure having at least one edge; ii) applying a reformable epoxy resin material consisting essentially of bisphenol A diglycidyl ether (BADGE) and monoethanolamine onto the at least one edge by extruding through a hot-melt gun; iii) lowering temperature of the reformable epoxy resin material so that the temperature of the reformable epoxy resin material is below its glass transition temperature, wherein the temperature of the reformable epoxy resin material is lowered upon exposure to ambient temperature; iv) contacting the reformable epoxy resin material within 10 minutes of applying the reformable epoxy resin material, wherein the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact and; v) wherein after applying, the reformable epoxy resin material is heated again above its glass transition temperature so that the panel structure is debonded and the at least one edge is open and no longer sealed. 15. The method according to claim 14 , wherein the panel structure is a furniture panel. 16. The method according to claim 14 , wherein the panel structure is an automotive or aerospace panel. 17. The method according to claim 14 , wherein the method is free of use of any liquid paste material. 18. The method according to claim 14 , wherein the contacting step includes sanding the reformable epoxy resin material.
Assignees
Inventors
Classifications
- B32B43/00Primary
Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor · CPC title
- C09J163/00Primary
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title
involving the assembly of discrete sheets or panels only · CPC title
Furniture · CPC title
Vehicles · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9796891B2 cover?
- The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin materia…
- Who is the assignee on this patent?
- Zephyros Inc
- What technology area does this patent fall under?
- Primary CPC classification B32B43/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).