Anisotropic conductive adhesive film and electronic device

Patent metadata

Field	Value
Publication number	US-9796884-B2
Application number	US-201314101661-A
Country	US
Kind code	B2
Filing date	Dec 10, 2013
Priority date	Dec 14, 2012
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.

First claim

What is claimed is:

1. An anisotropic conductive adhesive film comprising:
a base film; and
microcapsule structures set on the base film, with each of the microcapsule structures comprising a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, with an adhesive glue adhered to the external surface of the microcapsule wall,
wherein the normal-temperature curable macromolecular polymer comprises bisphenol A epoxy resin and a room-temperature fast curing agent, the room-temperature fast curing agent is a curing agent that provides a fast cure for bisphenol A epoxy under the action of a trace amount of aqueous vapor in the air, and the room-temperature fast curing agent comprises ethyl α-cyanoacrylate.

2. The anisotropic conductive adhesive film according to claim 1 , wherein the microcapsule structure is in the shape of a drum, and the plane of the drum shape rests on the base film.

3. The anisotropic conductive adhesive film according to claim 1 , wherein a layer of reticular macromolecular polymer is set on the base film, and the microcapsule structure is set on the reticular macromolecular polymer.

4. The anisotropic conductive adhesive film according to claim 1 , further comprising a protective film covering the microcapsule structure.

5. The anisotropic conductive adhesive film according to claim 1 , wherein the material constituting the base film includes polyethylene terephthalate.

6. The anisotropic conductive adhesive film according to claim 1 , wherein the metallic conductive particle is made of a metal, and the diameter of the metallic conductive particle is in the range of from 1 μm to 20 μm.

7. The anisotropic conductive adhesive film according to claim 1 , wherein the metallic conductive particle is made of gold, nickel or copper.

8. The anisotropic conductive adhesive film according to claim 1 , wherein the material constituting the microcapsule wall includes epoxy resin, paraffin, gelatin or polyurethane.

9. The anisotropic conductive adhesive film according to claim 3 , wherein the reticular macromolecular polymer includes silane crosslinked polyethylene.

10. An electronic device, wherein electrical connection between different components in the electronic device is achieved by pressfitting microcapsule structures in an anisotropic conductive adhesive film, wherein the anisotropic conductive adhesive film comprising:
a base film; and
microcapsule structures set on the base film, with each of the microcapsule structures comprising a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, with an adhesive glue adhered to the external surface of the microcapsule wall,
wherein the normal-temperature curable macromolecular polymer consists of bisphenol A epoxy resin and a room-temperature fast curing agent, the room-temperature fast curing agent is a curing agent that provides a fast cure for bisphenol A epoxy under the action of a trace amount of aqueous vapor in the air, and the room-temperature fast curing agent comprises ethyl α-cyanoacrylate.

11. An anisotropic conductive adhesive film comprising:
a base film; and
microcapsule structures set on the base film, with each of the microcapsule structures comprising a metallic conductive particle, a normal-temperature curable macromolecular polymer encapsulating the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, with an adhesive glue adhered to the external surface of the microcapsule wall,
wherein the normal-temperature curable macromolecular polymer comprises a mixture of bisphenol A epoxy resin and ethyl α-cyanoacrylate.

12. The electronic device according to claim 10 , wherein the microcapsule structure is in a shape of a drum, and a plane of the drum shape rests on the base film.

13. The electronic device according to claim 10 , wherein a layer of reticular macromolecular polymer is set on the base film, and the microcapsule structure is set on the reticular macromolecular polymer.

14. The electronic device according to claim 10 , further comprising a protective film covering the microcapsule structure.

15. The electronic device according to claim 10 , wherein the material constituting the base film includes polyethylene terephthalate.

16. The electronic device according to claim 10 , wherein the metallic conductive particle is made of a metal, and the diameter of the metallic conductive particle is in the range of from 1 μm to 20 μm.

17. The electronic device according to claim 10 , wherein the metallic conductive particle is made of gold, nickel or copper.

18. The electronic device according to claim 10 , wherein the material constituting the microcapsule wall includes epoxy resin, paraffin, gelatin or polyurethane.

19. The electronic device according to claim 13 , wherein the reticular macromolecular polymer includes silane crosslinked polyethylene.

Assignees

• Boe Technology Group Co Ltd
• Chengdu Boe Optoelect Tech Co

Inventors

• He Wei
• Bao Junping
• Li Xinghua
• Park Seung Yik

Classifications

• H10W72/354

  comprising polymers · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• H01L2924/00

  Electricity · mapped topic

• C09J2205/102

  Chemistry & Metallurgy · mapped topic