Polyamide resin and polyamide molded body using same

Patent metadata

Field	Value
Publication number	US-9796814-B2
Application number	US-201415037501-A
Country	US
Kind code	B2
Filing date	Nov 19, 2014
Priority date	Nov 26, 2013
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A polyamide resin, according to the present invention, is formed through polycondensation of a monomer comprising 1,4-cyclohexanedicarboxylic acid, 1,10-decanediamine, and 1,12-dodecanediamine, wherein the molar ratio of 1,10-decanediamine and 1,12-dodecanediamine is approximately 10:90 to approximately 65:35. As a result, the polyamide resin capable of enabling high durability and color stability in the polyamide molded body can be provided.

First claim

The invention claimed is:

1. A polyamide resin obtained through polycondensation of monomers comprising: 1,4-cyclohexanedicarboxylic acid; and 1,10-decanediamine and 1,12-dodecanediamine,
wherein a mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 10:90 to about 65:35.

2. The polyamide resin according to claim 1 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 30:70 to about 50:50.

3. The polyamide resin according to claim 1 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 35:65 to about 45:55.

4. A polyamide molded article produced by molding the polyamide resin according to claim 1 at about 320° C. or less.

5. The polyamide molded article according to claim 4 , produced by molding the polyamide resin according to claim 1 at about 320° C. or less under a non-oxidative atmosphere.

6. A method of preparing the polyamide resin according to claim 1 , comprising:
preparing a low-order condensate through polycondensation of the monomers; and
solid-polymerizing the low-order condensate.

7. A method of manufacturing a polyamide molded article, comprising:
molding the polyamide resin according to claim 1 at about 320° C. or less.

8. The method of manufacturing a polyamide molded article according to claim 7 , wherein the molding is performed under a non-oxidative atmosphere.

9. The polyamide molded article according to claim 4 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 30:70 to about 50:50.

10. The polyamide molded article according to claim 4 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 35:65 to about 45:55.

11. The method of preparing the polyamide resin according to claim 6 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 30:70 to about 50:50.

12. The method of preparing the polyamide resin according to claim 6 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 35:65 to about 45:55.

13. The method of manufacturing a polyamide molded article according to claim 7 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 30:70 to about 50:50.

14. The method of manufacturing a polyamide molded article according to claim 7 , wherein the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 35:65 to about 45:55.

15. A method of manufacturing a polyamide molded article, comprising:
molding the polyamide resin prepared by the method according to claim 6 at about 320° C. or less.

16. The method of manufacturing a polyamide molded article according to claim 15 , wherein the molding is performed under a non-oxidative atmosphere.

17. The polyamide resin according to claim 1 , wherein the polyamide resin has a yellowness index (YI) of 7.4 or less after heating a molded article formed of the polyamide resin at 170° C. for 8 hours.

18. The polyamide resin according to claim 17 , wherein the polyamide resin has a YI of 4.3 or less.

19. The polyamide resin according to claim 1 , comprising:
repeat units derived from a dicarboxylic acid component comprising about 75 mol % or more 1,4-cyclohexanedicarboxylic acid, based on the total mole percent of the dicarboxylic acid component; and
repeat units derived from a diamine component comprising about 90 mol % or more of 1,10-decanediamine and 1,12-dodecanediamine, based on the total mole percent of the diamine component.

20. The polyamide resin according to claim 19 , wherein the dicarboxylic acid component comprises 100 mol % 1,4-cyclohexanedicarboxylic acid.

21. The polyamide resin according to claim 1 , wherein the polyamide has a melting point of about 285° C. to 305° C.

22. The polyamide resin according to claim 1 , wherein:
the polyamide resin comprises repeat units derived from a dicarboxylic acid component comprising 100 mol % 1,4-cyclohexanedicarboxylic acid; and repeat units derived from a diamine component comprising 100 mol % of 1,10-decanediamine and 1,12-dodecanediamine;
the mole ratio of the 1,10-decanediamine to the 1,12-dodecanediamine ranges from about 35:65 to about 45:55; and
the polyamide resin has a yellowness index (YI) of 3.1 to 4.3 after heating a molded article formed of the polyamide resin at 170° C. for 8 hours and a melting point of about 285° C. to about 295° C.

Assignees

• Samsung Sdi Co Ltd
• Lotte Advanced Mat Co Ltd

Inventors

• Kanda Tomomichi
• Shimoda Tomoaki

Classifications

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08G69/26 Primary

  derived from polyamines and polycarboxylic acids · CPC title

• C08G69/28

  Preparatory processes · CPC title

• C08J5/00

  Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00) · CPC title

• C08G69/30

  Solid state polycondensation · CPC title