Under layer film-forming composition for imprints and method of forming pattern

Patent metadata

Field	Value
Publication number	US-9796803-B2
Application number	US-201414549068-A
Country	US
Kind code	B2
Filing date	Nov 20, 2014
Priority date	Jun 18, 2012
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

An under layer film having excellent surface planarity is provided. In one aspect, the under layer film-forming composition for imprints includes a (meth)acrylic resin (A) containing an ethylenic unsaturated group (P) and a nonionic hydrophilic group (Q), and having a weight average molecular weight of 1,000 or larger; and a solvent (B), the resin (A) having an acid value of smaller than 1.0 mmol/g. In another aspect, the under layer film-forming composition for imprints includes a (meth)acrylic resin (A2) containing an ethylenic unsaturated group (P), and containing, as a nonionic hydrophilic group (Q), a cyclic substituent (Q2) having a carbonyl group in the cyclic structure thereof, with a weight average molecular weight of 1,000 or larger; and a solvent (B).

First claim

What is claimed is:

1. A method of forming a pattern comprising:
applying an under layer film-forming composition for imprints onto a surface of a substrate to thereby form a under layer film; and
applying a curable composition for imprints onto a surface of the under layer film,
said method further comprising, after applying the under layer film-forming composition for imprints onto the surface of the substrate, allowing a part of the under layer film-forming composition for imprints to cure through heat or photo-irradiation, and applying onto the surface thereof the curable composition for imprints,
and still further comprising irradiating light onto the curable composition for imprints and the under layer, while holding them between the substrate and a mold with fine patterns, to thereby cure the curable composition for imprints, and separating the mold,
wherein the under layer film-forming composition for imprints comprises a (meth)acrylic resin (A) and a solvent (B),
wherein the (meth)acrylic resin (A) contains an ethylenic unsaturated group (P) and a nonionic hydrophilic group (Q), has a weight average molecular weight of 1,000 or larger and an acid value of smaller than 1.0 mmol/g, and contains a repeating unit represented by the formula (I) below:

wherein R 1 represents a hydrogen atom, a methyl group or a hydroxymethyl group, L 1 represents a trivalent linking group, P represents an ethylenic unsaturated group, and Q represents a nonionic hydrophilic group which is an alcoholic hydroxy group.

2. A method of manufacturing a semiconductor device comprising the method of forming a pattern described in claim 1 .

3. The method of forming a pattern of claim 1 , wherein the resin (A) further contains a repeating unit represented by the formula (II) below

wherein R 2 represents a hydrogen atom, a methyl group or a hydroxymethyl group, L 2a represents a single bond or divalent linking group, L 2b represents a single bond, divalent linking group or trivalent linking group, P represents an ethylenic unsaturated group, Q represents a nonionic hydrophilic group, and n represents 1 or 2.

4. The method of forming a pattern of claim 1 , wherein the resin (A) further contains a repeating unit represented by the formula (III) below and/or a repeating unit represented by the formula (IV) below:

wherein each of R 3 and R 4 independently represents a hydrogen atom, a methyl group or a hydroxymethyl group, each of L 3 and L 4 independently represents a single bond or divalent linking group, Q represents a nonionic hydrophilic group, and R 5 represents a C 1-12 aliphatic group, a C 3-12 alicyclic group or a C 6-12 aromatic group.

5. The method of forming a pattern of claim 4 , wherein the resin (A) further contains a repeating unit represented by the formula (II) below

wherein R 2 represents a hydrogen atom, a methyl group or a hydroxymethyl group, L 2a represents a single bond or divalent linking group, L 2b represents a single bond, divalent linking group or trivalent linking group, P represents an ethylenic unsaturated group, Q represents a nonionic hydrophilic group, and n represents 1 or 2.

6. The method of forming a pattern of claim 4 ,
wherein the ethylenic unsaturated group (P) is a (meth)acryloyloxy group.

7. The method of forming a pattern of claim 4 ,
wherein the nonionic hydrophilic group (Q) in Formula (III) represents an alcoholic hydroxy group or urethane group.

8. The method of forming a pattern of claim 1 ,
wherein the ethylenic unsaturated group (P) is a (meth)acryloyloxy group.

9. The method of forming a pattern of claim 1 ,
wherein the (meth)acrylic resin (A) is a copolymer containing 20 mol % or more of a repeating unit having an ethylenic unsaturated group (P), and 40 mol % or more of a repeating unit having a nonionic hydrophilic group.

10. The method of forming a pattern of claim 1 ,
wherein the (meth)acrylic resin (A) has an acid value of smaller than 0.3 mmol/g.

11. The method of forming a pattern of claim 1 ,
wherein the solvent (B) contains at least one solvent selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethoxyethyl propionate, cyclohexanone, 2-heptanone, γ-butyrolactone, butyl acetate, propylene glycol monomethyl ether, and ethyl lactate.

Assignees

• Fujifilm Corp

Inventors

• Kitagawa Hirotaka
• Hattori Akiko
• Enomoto Yuichiro

Classifications

• H10P14/6544

  to change the morphology of the insulating materials, e.g. transformation of an amorphous layer into a crystalline layer · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F7/00

  Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

• C08F20/26

  Esters containing oxygen in addition to the carboxy oxygen · CPC title

• B29C59/02

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title