Pressure-less ozonated di-water (DIO3) recirculation reclaim system

US9796603B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9796603-B2
Application numberUS-201715423267-A
CountryUS
Kind codeB2
Filing dateFeb 2, 2017
Priority dateNov 8, 2012
Publication dateOct 24, 2017
Grant dateOct 24, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides, in one aspect, a system for recirculating ozonated liquid. The system includes a contactor including at least two inlets and at least two outlets. The contactor is in fluid communication with a first liquid source at a first contactor inlet and a second liquid source at a second contactor inlet, and the second contactor inlet receives gas that purges at least a portion of gas from liquid received at the first contactor inlet. The purged gas exits the contactor at a first contactor outlet. The contactor is in fluid communication with the second liquid source at a second contactor outlet, and the contactor drains at least a portion of the liquid in the contactor, the drained liquid exiting the contactor at the second contactor outlet. The contactor includes a third inlet in fluid communication with the first liquid source, the third inlet allowing the first liquid source to release liquid at an ambient pressure.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for recirculating ozonated liquid in a semiconductor manufacturing process, comprising: a contactor including at least two inlets and at least two outlets, the contactor being in fluid communication with a first liquid source comprising a tool at a first contactor inlet and a second liquid source at a second contactor inlet, the tool being configured to perform the semiconductor manufacturing process, the second contactor inlet receiving gas that purges at least a portion of gas from the ozonated liquid received at the first contactor inlet from the tool of the first liquid source, the purged gas exiting the contactor at a first contactor outlet, wherein the contactor is in fluid communication with the second liquid source at a second contactor outlet, the contactor draining at least a portion of the purged ozonated liquid in the contactor, the drained liquid exiting the contactor at the second contactor outlet for supply to the second liquid source connected to the tool. 2. The system of claim 1 , wherein at least a portion of the ozonated liquid received at the first contactor inlet comprises at least a portion of the liquid drained from the contactor via the second contactor outlet. 3. The system of claim 1 , wherein the contactor includes a third inlet in fluid communication with a third liquid source, the third inlet receiving fresh liquid from the third liquid source that replaces at least a portion of the liquid drained from the contactor. 4. The system of claim 1 , wherein the contactor comprises any of a packed column, plate column, or bubble column. 5. The system of claim 1 , further comprising a first pump in fluid communication with the contactor via a) at least one inlet of the first pump being in fluid communication with the second outlet of the contactor, and b) an outlet of the first pump being in fluid communication with the second liquid source. 6. The system of claim 5 , wherein the outlet of the first pump is in fluid communication with the contactor via a third inlet of the contactor. 7. The system of claim 5 , where in the first pump comprises a centrifugal pump. 8. The system of claim 1 , further comprising a destruct component that includes at least an inlet, the inlet of the destruct component in fluid communication with the first contactor outlet. 9. The system of claim 8 , wherein the inlet of the destruct component receives at least a portion of the gas purged by the contactor. 10. The system of claim 9 , wherein the gas received at the inlet of the destruct component is heated or diluted with clean dry air (CDA) or other inert gas. 11. The system of claim 9 , wherein an outlet of the destruct component exhausts at least a portion of the purged gas received at the inlet of the destruct component. 12. The system of claim 11 , wherein the gas flow at the outlet of the destruct component is measured and the information is used for system control. 13. The system of claim 11 , wherein the destruct component uses a catalyst to convert the received gas into oxygen and exhausts the oxygen via the outlet of the destruct component. 14. The system of claim 13 , wherein the catalyst comprises any of (i) manganese-oxide based product or (ii) a carbon-based product. 15. The system of claim 1 , wherein any of the liquid (i) received at the first inlet of the contactor or (ii) drained from the second outlet of the contactor comprises ozonated deionized water (DIO 3 ). 16. The system of claim 1 , wherein the gas received at the second inlet of the contactor comprises (i) O 3 , (ii) O 2 , (iii) CO 2 , (iv) N 2 , (iv) Clean Dry Air (CDA), (v) inert gas, (vi) doping gas, (vii) off-gas, (viii) off-gas from the second liquid source, or any combination thereof. 17. The system of claim 1 , wherein the portion of gas purged from the liquid comprises (i) O 3 , (ii) O 2 (iii) CO 2 , or any combination thereof. 18. The system of claim 17 , wherein the gas received at the second inlet of the contactor is the off-gas from the second liquid source. 19. The system of claim 1 , wherein a temperature of the ozonated liquid is measured and a temperature of the ozonated liquid is controlled via a heat exchanger or by liquid discarding. 20. The system of claim 1 , wherein the second liquid source comprises a DIO 3 water delivery system. 21. The system of claim 5 , further comprising a second pump being in fluid communication with any of (i) the first outlet of the first pump, or (ii) a second outlet of the first pump. 22. The system of claim 21 , wherein the second pump comprises a jet pump. 23. The system of claim 1 , further comprising a second contactor in fluid communication with the contactor, the second contactor configured to receive at a first inlet at least a portion of the drained ozonated liquid from the contactor, purge a second portion of gas from the drained ozonated liquid, and release at a first outlet the drained ozonated liquid having the second portion of gas purged to the contactor.

Assignees

Inventors

Classifications

  • by wet cleaning only (H10P70/52 takes precedence) · CPC title

  • Recirculation with an external loop · CPC title

  • C02F1/20Primary

    by degassing, i.e. liberation of dissolved gases (degasification of liquids in general B01D19/00; arrangement of degassing apparatus in boiler feed supply F22D) · CPC title

  • containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds · CPC title

  • Regulation, control including valves and floats (for construction and details of valves F16K) · CPC title

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What does patent US9796603B2 cover?
The invention provides, in one aspect, a system for recirculating ozonated liquid. The system includes a contactor including at least two inlets and at least two outlets. The contactor is in fluid communication with a first liquid source at a first contactor inlet and a second liquid source at a second contactor inlet, and the second contactor inlet receives gas that purges at least a portion o…
Who is the assignee on this patent?
Mks Instr, Mks Instr Inc
What technology area does this patent fall under?
Primary CPC classification C02F1/20. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).