Electronic device and method for manufacturing the electronic device

Patent metadata

Field	Value
Publication number	US-9795053-B2
Application number	US-201414392135-A
Country	US
Kind code	B2
Filing date	Jun 17, 2014
Priority date	Jun 28, 2013
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.

First claim

The invention claimed is:

1. An electronic device comprising:
a substrate that has a first surface and a second surface opposite to the first surface;
an electronic component that is mounted on the first surface of the substrate; and
a molding resin that is disposed on the first surface of the substrate and seals the electronic component, wherein
the substrate has an air vent at a position covered with the molding resin, the air vent passing through the substrate from the first surface to the second surface,
the second surface of the substrate is covered with a solder resist that has an opening portion at a position corresponding to the air vent, and
the solder resist surrounds a periphery of the air vent, wherein

the second surface of the substrate has a conductor pattern that entirely surrounds the periphery of the air vent,
the solder resist has a covering portion that covers the conductor pattern and a non-covering portion that does not cover the conductor pattern, and
the covering portion of the solder resist has a greater height from the second surface of the substrate than the non-covering portion.

2. An electronic device comprising:
a substrate that has a first surface and a second surface opposite to the first surface;
an electronic component that is mounted on the first surface of the substrate; and
a molding resin that is disposed on the first surface of the substrate and seals the electronic component, wherein
the substrate has an air vent at a position covered with the molding resin, the air vent passing through the substrate from the first surface to the second surface,
the second surface of the substrate is covered with a solder resist that has an opening portion at a position corresponding to the air vent, and
the solder resist surrounds a periphery of the air vent, wherein

the solder resist has a groove portion that connects to the opening portion.

3. The electronic device according to claim 1 , wherein the solder resist entirely surrounds the periphery of the air vent.

4. An electronic device comprising:
a substrate that has a first surface and a second surface opposite to the first surface;
an electronic component that is mounted on the first surface of the substrate; and
a molding resin that is disposed on the first surface of the substrate and seals the electronic component, wherein
the substrate has an air vent at a position covered with the molding resin, the air vent passing through the substrate from the first surface to the second surface,
the second surface of the substrate is covered with a solder resist that has an opening portion at a position corresponding to the air vent, and
the solder resist surrounds a periphery of the air vent, wherein

the second surface of the substrate has a conductor pattern that surrounds the periphery of the air vent with a cutout at a part,
the solder resist has a covering portion that covers the conductor pattern and a portion corresponding to the cutout of the conductor pattern, and
the covering portion of the solder resist has a greater height from the second surface of the substrate than the portion corresponding to the cutout of the conductor pattern.

5. The electronic device according to claim 4 , wherein
the solder resist entirely surrounds the periphery of the air vent.

Assignees

• Denso Corp

Inventors

• Sanada Yuki
• Kashiwazaki Atsushi

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/016

  using moulds · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title