Wiring thin plate having aerial wiring portion and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9795029-B2
Application number	US-201615138040-A
Country	US
Kind code	B2
Filing date	Apr 25, 2016
Priority date	Apr 24, 2015
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Provided is a wiring thin plate capable of suppressing deterioration of an electric characteristic and variation in thickness of an aerial wiring portion while advancing reduction of rigidity of the aerial wiring portion. The wiring thin plate includes an aerial wiring portion including wiring traces and passing over an airspace, aerial base layers provided at the respective wiring traces in the aerial wiring portion and being apart from each other, and an aerial cover layer provided in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers to interspaces between adjacent aerial base layers of said aerial base layers.

First claim

What is claimed is:

1. A wiring thin plate comprising:
a supporting layer made of metal;
an insulating base layer provided on a top face of the supporting layer;
a wiring part having a plurality of wiring traces provided on a top face of the base layer;
an insulating cover layer covering the wiring traces;
an airspace defined by the supporting layer;
an aerial wiring portion that is a part of the wiring part passing over the airspace;
aerial base layers provided to the base layer at the respective wiring traces in the aerial wiring portion and being apart from each other; and
an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers and through interspaces between adjacent aerial base layers of said aerial base layers to bridge the interspaces between the adjacent aerial base layers.

2. The wiring thin plate according to claim 1 ,
wherein each one aerial base layer of said aerial base layers has a same width as a corresponding wiring trace formed on said each one aerial base layer.

3. The wiring thin plate according to claim 1 , further comprising:
a link provided to the aerial cover layer so that the link extends to the supporting layer in a direction along which the wiring traces are arranged side by side.

4. A flexure using the wiring thin plate according to claim 1 , further comprising:
outriggers provided to the supporting layer, and
a tongue supported with the outriggers and on which a slider is attached,
wherein the airspace is defined on one of first and second sides of each one outrigger of said outriggers, the first side being proximal to the tongue and the second side being distal to the tongue.

5. A method of manufacturing the wiring thin plate according to claim 1 , comprising:
laminating a metal layer as the supporting layer, a first insulating layer as the base layer, and a conductive layer as the wiring part in this order to form a base material;
partly removing the conductive layer of the base material to shape the wiring part and form a first intermediate material;
partly removing the first insulating layer of the first intermediate material to shape the base layer with the aerial base layers and form a second intermediate material;
covering the wiring part and the aerial base layers of the second intermediate material with a second insulating layer for the aerial cover layer to form a third intermediate material; and
partly removing the metal layer of the third intermediate material to shape the supporting layer with the airspace and finish the wiring thin plate.

6. A wiring thin plate comprising:
a supporting layer made of metal;
an insulating base layer provided on a top face of the supporting layer,
a wiring part having a plurality of wiring traces provided on a top face of the base layer;
an insulating cover layer covering the wiring traces;
an airspace defined by the supporting layer;
an aerial wiring portion that is a part of the wiring part passing over the airspace;
aerial base layers provided to the base layer at the respective wiring traces in the aerial wiring portion and being apart from each other;
an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers and through interspaces between adjacent aerial base layers of said aerial base layers to bridge the interspaces between the adjacent aerial base layers;
openings formed through the aerial cover layer to open respective top faces of the wiring traces of the aerial wiring portion, thereby to form top-face-exposed portions on the respective wiring traces of the aerial wiring portion; and
plated layers covering the respective wiring traces in the top-face-exposed portions.

7. A method of manufacturing the wiring thin plate according to claim 6 , comprising:
laminating a metal layer as the supporting layer, a first insulating layer as the base layer, and a conductive layer as the wiring part in this order to form a base material;
partly removing the conductive layer of the base material to shape the wiring part and form a first intermediate material;
partly removing the first insulating layer of the first intermediate material to shape the base layer with the aerial base layers and form a second intermediate material;
covering the wiring part and the aerial base layers of the second intermediate material with a second insulating layer for the aerial cover layer and forming the openings to shape the top-face-exposed portions and form a third intermediate material; and
partly removing the metal layer of the third intermediate material to shape the supporting layer with the airspace and forming the plated layers on the top-face-exposed portions to cover the respective wiring traces and finish the wiring thin plate.

8. The wiring thin plate according to claim 6 ,
wherein each one aerial base layer of said aerial base layers has a same width as a corresponding wiring trace formed on said each one aerial base layer.

9. The wiring thin plate according to claim 6 , further comprising:
a link provided to the aerial cover layer so that the link extends to the supporting layer in a direction along which the wiring traces are arranged side by side.

10. A wiring thin plate comprising:
a supporting layer made of metal;
an insulating base layer provided on a top face of the supporting layer;
a wiring part having a plurality of wiring traces provided on a top face of the base layer;
an insulating cover layer covering the wiring traces;
an airspace defined by the supporting layer;
an aerial wiring portion that is a part of the wiring part passing over the airspace;
an extended airspace defined by the base layer in the aerial wiring portion to open back faces of the wiring traces in the aerial wiring portion, thereby to form on the respective wiring traces of the aerial wiring portion back-face-exposed portions facing the airspace;
an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through interspaces between adjacent wiring traces of said wiring traces of the aerial wiring portion to bridge the interspaces between the adjacent aerial base layers; and
plated layers covering the respective wiring traces in the back-face-exposed portions.

11. The wiring thin plate according to claim 10 ,
wherein the aerial cover layer joins the adjacent wiring traces of the aerial wiring portion together.

12. A method of manufacturing the wiring thin plate according to claim 10 , comprising:
laminating a metal layer as the supporting layer, a first insulating layer as the base layer, and a conductive layer as the wiring part in this order to form a base material;
partly removing the conductive layer of the base material to shape the wiring part and form a first intermediate material;
partly removing the metal layer of the first intermediate material to shape the supporting layer with the airspace and form a second intermediate material;
covering the wiring part of the second intermediate material with a second insulating layer for the aerial cover layer and partly removing the first insulating layer of the second intermediate material to shape the base layer, the extended airspace and the back-face-exposed portions and form a third intermediate material; and
forming the plated layers on the respective back-face-exposed portions of the third intermediate material to cover the wiring traces and finish the wir

Assignees

• Nhk Spring Co Ltd

Inventors

• Yamada Yukie

Classifications

• G11B5/486

  with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly · CPC title

• H05K2203/0323

  Working metal substrate or core, e.g. by etching, deforming · CPC title

• G11B5/60

  Fluid-dynamic spacing of heads from record-carriers · CPC title

• G11B5/4853

  Constructional details of the electrical connection between head and arm · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title