Apparatus for bonding separators in electrical devices

US9793571B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9793571-B2
Application numberUS-201414913548-A
CountryUS
Kind codeB2
Filing dateOct 2, 2014
Priority dateOct 3, 2013
Publication dateOct 17, 2017
Grant dateOct 17, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, includes a transmission unit configured to generate ultrasonic oscillations, an amplifier unit configured to amplify the generated oscillations, an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other, and separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other, the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, comprising: a transmission unit configured to generate ultrasonic oscillations; an amplifier unit configured to amplify the generated oscillations; an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other; and separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other, the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed. 2. The apparatus for bonding separators in electrical devices according to claim 1 , wherein the abutting part comprises multiple contact portions configured to contact the separators, and is configured to rotate around a rotational axis that is parallel to the direction in which the abutting part and the transmission unit are arranged. 3. The apparatus for bonding separators in electrical devices according to claim 1 , further comprising a holding unit configured to hold the abutting part, the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed. 4. The apparatus for bonding separators in electrical devices according to claim 1 , wherein the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed. 5. The apparatus for bonding separators in electrical devices according to claim 4 , wherein the contact portion is one of multiple contact portions disposed on the main body portion, and the multiple contact portions are configured to be replaceable. 6. The apparatus for bonding separators in electrical devices according to claim 5 , wherein the main body portion is configured to be rotatable, and the contact portion is configured to be replaced by rotating the main body portion. 7. The apparatus for bonding separators in electrical devices according to claim 6 , further comprising: a holding unit configured to hold the abutting part, the holding unit comprises an abutting member configured to protrude and retract with respect to the abutting part, and the holding unit is configured to switch between rotating and fixing the main body portion by switching between contacting and not contacting the abutting member to abutting part. 8. The apparatus for bonding separators in electrical devices according to claim 1 , wherein the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair, the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws, the first and second pairs are arranged on respective sides of the separators in a width direction, and fastening directions of the screws of the first and second pairs are the same. 9. The apparatus for bonding separators in electrical devices according to claim 1 , wherein the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair, the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws, the first and second pairs are arranged on respective sides of the separators in a width direction, and fastening directions of the screws of the first and second pairs are different. 10. The apparatus for bonding separators in electrical devices according to claim 1 , wherein the separator conveyance unit comprises a conveyance drum configured to convey separators, and the abutting part is disposed further outward than the conveyance drum in a width direction of the separators to be conveyed. 11. The apparatus for bonding separators in electrical devices according to claim 2 , further comprising a holding unit configured to hold the abutting part, the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed. 12. The apparatus for bonding separators in electrical devices according to claim 10 , further comprising a holding unit configured to hold the abutting part, the abutting part being disposed closer to a position in which the separators are superposed than the holding unit in the direction in which the separators are conveyed. 13. The apparatus for bonding separators in electrical devices according to claim 2 , wherein the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed. 14. The apparatus for bonding separators in electrical devices according to claim 3 , wherein the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed. 15. The apparatus for bonding separators in electrical devices according to claim 10 , wherein the abutting part comprises a contact portion configured to contact the separators and a main body portion on which is disposed the contact portion, and the contact portion is disposed at an end of the main body portion in a direction that intersects the direction in which the separators are conveyed. 16. The apparatus for bonding separators in electrical devices according to claim 2 , wherein the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair, the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws, the first and second pairs are arranged on respective sides of the separators in a width direction, and fastening directions of the screws of the first and second pairs are different. 17. The apparatus for bonding separators in electrical devices according to claim 4 , wherein the amplifier unit is a first amplifier, the abutting part is a first abutting part, and the first amplifier unit and the first abutting part form a first pair, and a second amplifier unit and a second abutting part form a second pair, the first amplifier unit and the first abutting part are fastened by screws, and the second amplifier unit and the second abutting part are fastened by screws, the first and second pairs are arranged on respective sides of the separators in a width direction, and fastening directions of the screws of the

Assignees

Inventors

Classifications

  • Moulding; Embossing; Cutting · CPC title

  • of discontinuously moving sheets or webs · CPC title

  • characterised by the composition of the plastics material of the parts to be joined (welding bar compositions B29C65/125) · CPC title

  • Casing-in, i.e. enclosing an element between two sheets by an outlined seam (for bookbinding B42C11/06; for packaging B65B; by laminating B32B37/00; enclosing tubular articles between substantially flat elements B29C66/53261) · CPC title

  • making use of vibrations, e.g. ultrasonic welding · CPC title

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What does patent US9793571B2 cover?
An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, includes a transmission unit configured to generate ultrasonic oscillations, an amplifier unit configured to amplify the generated oscillations, an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other, and sep…
Who is the assignee on this patent?
Nissan Motor
What technology area does this patent fall under?
Primary CPC classification H01M10/0404. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).