Piezoelectric vibration module

Patent metadata

Field	Value
Publication number	US-9793463-B2
Application number	US-201414227263-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Mar 29, 2013
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Disclosed herein is a piezoelectric vibration module capable of improving adhesion between a piezoelectric element and an external electrode disposed on the piezoelectric element, the piezoelectric vibration module, including: a piezoelectric element printing patterns of a first internal electrode and a second internal electrode therein and having a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode on an external surface thereof, wherein the first external electrode and the second external electrode are made of silver (Ag) and are formed on the external surface of the piezoelectric element.

First claim

What is claimed is:

1. A piezoelectric vibration module comprising:
a piezoelectric element including printed patterns of a first internal electrode and a second internal electrode therein and having a first external electrode and a second external electrode formed on an external surface thereof, the first external electrode being electrically connected to the first internal electrode, and the second external electrode being electrically connected to the second internal electrode,
wherein the first external electrode and the second external electrode are made of silver (Ag) and are formed on the external surface of the piezoelectric element, and
wherein the first external electrode and the second external electrode additionally contain filler in silver (Ag).

2. The piezoelectric vibration module as set forth in claim 1 , wherein the filler is made of a metal selected from a group consisting of copper (Cu), palladium (Pd), and a combination thereof.

3. The piezoelectric vibration module as set forth in claim 1 , further comprising:
the piezoelectric element generating vibration force by repeatedly performing expansion and compression deformation by external power applied thereto;
an upper case opening a lower surface thereof and forming an internal space;
a lower case coupled to the lower surface of the upper case to shield the internal space of the upper case;
a vibration plate including a flat lower plate having the piezoelectric element mounted thereon and a pair of upper plates standing in a vertical upward direction at the center of both sides of the lower plate, and disposed in the upper case and the lower case to be vertically driven; and
a flexible printed circuit board having one side end portion contacting the piezoelectric element and the other side end portion drawn to the outside of the piezoelectric vibration module.

4. The piezoelectric vibration module as set forth in claim 3 , wherein the vibration plate has a weight body additionally disposed between the pair of upper plates in order to increase the vibration force of the piezoelectric element.

5. The piezoelectric vibration module as set forth in claim 4 , further comprising a second buffering member below both sides of the weight body.

6. The piezoelectric vibration module as set forth in claim 3 , wherein the lower, case and the lower plate are spaced apart from each other by a predetermined interval.

7. The piezoelectric vibration module as set forth in claim 3 , further comprising a first buffering member between the vibration plate and the upper case.

8. The piezoelectric vibration module as set forth in claim 3 , further comprising a third buffering member between the vibration plate and the lower case.

9. The piezoelectric vibration module as set forth in claim 3 , wherein the flexible printed circuit board (FPCB) has terminals so as to apply power to the first and second external electrodes of the piezoelectric element.

10. The piezoelectric vibration module as set forth in claim 9 , wherein the first external electrode and the second external electrode are electrically connected to the respective terminals of the flexible printed circuit board through soldering parts.

11. The piezoelectric vibration module as set forth in claim 3 , wherein the lower case has coupling ends protruded in a vertical upward direction at both end portions thereof.

12. The piezoelectric vibration module as set forth in claim 11 , wherein the coupling ends form a guide groove.

Assignees

• Samsung Electro Mech
• Mplus Co Ltd

Inventors

• Son Yeon Ho
• Kim Jae Kyung
• Choi Jun Kun

Classifications

• H01L41/0906

  Electricity · mapped topic

• H01L41/083

  Electricity · mapped topic

• H01L41/0475 Primary

  Electricity · mapped topic

• H10N30/50

  having a stacked or multilayer structure · CPC title

• H10N30/875 Primary

  Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins · CPC title