Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

Patent metadata

Field	Value
Publication number	US-9793456-B2
Application number	US-201214344075-A
Country	US
Kind code	B2
Filing date	Sep 26, 2012
Priority date	Sep 30, 2011
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

First claim

The invention claimed is:

1. A molded resin body for surface-mounted light-emitting device, comprising:
a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at a bottom portion of the concave portion,
wherein a ten-point average roughness (Rz) of an opening surface of the concave portion is 1 μm or more and 10 μm or less,
a glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and
an optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and an optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more,
wherein the opening surface of the concave portion is a surface where the concave portion opens in a thickness direction of the molded resin body, and
the cured resin body is a cured substance of a thermosetting resin composition (X) containing (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with an SiH group in one molecule, (B) a compound containing at least two SiH groups in one molecule, (C) a hydrosilylation catalyst, (D) a silicone compound containing (i) a skeleton formed by a Si—O—Si bond, (ii) at least one group selected from the group consisting of an alkyl group, an aryl group, an alkoxy group, and a hydroxyl group, as a substituent to be bonded to a skeleton, and (iii) at least one carbon-carbon double bond having reactivity with an SiH group in one molecule, and (E) an inorganic filler.

2. The molded resin body for surface-mounted light-emitting device according to claim 1 , wherein at least one peak top in a solid 13 C-nuclear magnetic resonance spectrum of the cured resin body is present in a range of −1 ppm to 2 ppm and 13 ppm to 18 ppm.

3. The molded resin body for surface-mounted light-emitting device according to claim 1 , wherein at least one of the plurality of leads has a metal layer on a surface thereof, the metal layer has an outermost surface layer on a surface side thereof, and the outermost surface layer is an Au layer, an Au alloy layer, or a glossy Ni layer having a thickness of 0.003 to 0.05 μm.

4. The molded resin body for surface-mounted light-emitting device according to claim 3 , wherein the metal layer has the outermost surface layer and a second metal layer provided between the surface of the at least one of the plurality of leads and the outermost surface layer, and the second metal layer is an Ag layer, a Pd layer, or a laminated body of an Ag layer and a Pd layer.

5. The molded resin body for surface-mounted light-emitting device according to claim 3 , wherein the metal layer is a plating layer.

6. The molded resin body for surface-mounted light-emitting device according to claim 1 , wherein
the concave portion has a bottom surface which is a surface of the plurality of leads exposed at the bottom portion,
an inner wall surface of the concave portion has a second inclined surface which is continuous to the bottom surface and rises from a periphery of the bottom surface and has an inclination angle to the bottom surface of 45° to 90° and a first inclined surface which is continuous to the second inclined surface and rises from a periphery of the second inclined surface towards the opening surface and has an inclination angle to the bottom surface of more than 0° and 45° or less, and a boundary of the first inclined surface and the second inclined surface is located at a position where a height from the bottom surface to the boundary of the first inclined surface and the second inclined surface is more than 0 μm and 100 μm or less.

7. The molded resin body for surface-mounted light-emitting device according to claim 1 , wherein
the plurality of leads include a first lead and a second lead which are disposed in such a manner as to be separated from each other,
the cured resin body contains an insulation portion which is provided between the first lead and the second lead and insulates the leads, and the insulation portion is exposed to the bottom portion of the concave portion in a state where the insulation portion is sandwiched between the first lead and the second lead.

8. The molded resin body for surface-mounted light-emitting device according to claim 7 , wherein the first lead contains a first inner lead portion exposed to the bottom portion of the concave portion and a first outer lead portion in contact with the cured resin body and the second lead contains a second inner lead portion exposed to the bottom portion of the concave portion and a second outer lead portion in contact with the cured resin body.

9. The molded resin body for surface-mounted light-emitting device according to claim 8 , wherein at least one of the first outer lead portion or the second outer lead portion is projecting beyond a side surface of the cured resin body.

10. The molded resin body for surface-mounted light-emitting device according to claim 8 , wherein a side surface of the cured resin body and a side surface of the first outer lead portion and/or the second outer lead portion integrally form a plane surface on a side surface of the molded resin body.

11. The molded resin body for surface-mounted light-emitting device according to claim 8 , wherein the first inner lead portion and the second inner lead portion have a metal layer on surfaces thereof and the first outer lead portion and the second outer lead portion do not have a metal layer on the surfaces thereof.

12. The molded resin body for surface-mounted light-emitting device according to claim 1 , wherein the (D) silicone compound is straight chain polysiloxane having a vinyl group at both ends of the skeleton formed by the Si—O—Si bond.

13. A surface-mounted light-emitting device, comprising:
the molded resin body for surface-mounted light-emitting device according to claim 1
a light-emitting element which is mounted on the bottom portion of the concave portion of the molded resin body and is connected to the plurality of leads in such a manner that electricity can be conducted therebetween, and
a transparent resin that fills the concave portion and thereby seals the light-emitting element.

14. The surface-mounted light-emitting device according to claim 13 , wherein the light-emitting element comprises a plurality of light-emitting elements, and the plurality of light-emitting elements are mounted on the bottom portion of the concave portion.

Assignees

• Kaneka Corp

Inventors

• Tozawa Tomokazu
• Iwahara Takahisa
• Ogoshi Hiroshi
• Hirabayashi Kazuhiko
• Ozaki Shuhei
• Iba Satoaki
• Kanai Kazuaki
• Kakehashi Yasushi
• Manabe Takao
• Hori Mitsuhiro
• Narita Ryoichi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/0198

  batch processes · CPC title

• H01L2924/15747

  Electricity · mapped topic