Method for manufacturing solar cell with interconnection sheet, method for manufacturing solar cell module, solar cell with interconnection sheet, and solar cell module
US-9224880-B2 · Dec 29, 2015 · US
US9793420B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9793420-B2 |
| Application number | US-201213261697-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2012 |
| Priority date | Feb 4, 2011 |
| Publication date | Oct 17, 2017 |
| Grant date | Oct 17, 2017 |
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Sputtered zinc oxide layer is used to improve and control the crystalline properties of a molybdenum back contact used in photovoltaic cells. Optimum thicknesses for the zinc oxide layer are identified.
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The invention claimed is: 1. A substrate bearing a stack of layers as the back contact in a molybdenum photovoltaic device, said back contact comprising in order from the substrate: a barrier layer comprising at least one of: Si x N y , SiO 2 , SnO 2 , SiCO and TiO 2 ; a primer layer; a layer of ZnO; and a layer of molybdenum, wherein the molybdenum is deposited directly on the layer of ZnO; the ZnO layer having a thickness, t, of 0 nm<t<50 nm; wherein the ZnO layer is deposited directly on the primer layer; and the primer layer is deposited directly on the barrier layer and comprises TiO 2 or ZnSnO x . 2. The substrate according to claim 1 , wherein the primer layer has a thickness of between 5 and 50 nm. 3. The substrate according to claim 1 , wherein the substrate is glass. 4. The substrate according to claim 1 , wherein the barrier layer comprises a sodium barrier layer. 5. The substrate according to claim 4 , wherein the barrier layer has a thickness of between 5 and 200 nm. 6. The substrate according to claim 1 , wherein the barrier layer comprises SiO 2 . 7. The substrate according to claim 6 , wherein 8 nm<t<30 nm. 8. The substrate according to claim 7 , wherein 12 nm<t<18 nm. 9. The substrate according to claim 1 , wherein the barrier layer comprises Si x N y . 10. The substrate according to claim 9 , wherein 0 nm<t<30 nm. 11. The substrate according to claim 10 , wherein 0 nm<t<15 nm. 12. The substrate according to claim 11 , wherein 2 nm<t<8 nm. 13. The substrate according to claim 1 , wherein the primer layer comprises a layer of ZnSnO x having a thickness of between 5 and 30 nm. 14. The substrate according to claim 1 , wherein the ZnO layer comprises a component of Al. 15. The substrate according to claim 1 , incorporated in a photovoltaic cell. 16. A substrate bearing a stack of layers as the back contact in a molybdenum photovoltaic device, said back contact comprising in order from the substrate: a barrier layer; a layer of ZnO; and a layer of molybdenum, wherein the molybdenum is deposited directly on the layer of ZnO; the ZnO layer having a thickness, t, of 0 nm<t<50 nm; wherein the ZnO layer is deposited directly on the barrier layer; and the barrier layer comprises at least one of: SnO 2 , SiCO and TiO 2 . 17. The substrate according to claim 16 , incorporated in a photovoltaic cell. 18. A method of controlling the crystal orientation of a molybdenum layer on a substrate comprising the steps of: depositing a barrier layer comprising at least one of: Si x N y , SiO 2 , SnO 2 , SiCO and TiO 2 on the substrate, depositing a primer layer comprising TiO 2 or ZnSnO x directly on the barrier layer, depositing a layer of ZnO directly on the primer layer, and depositing a layer of molybdenum directly on the layer of ZnO; wherein a thickness, t, for the ZnO layer is selected according to the desired crystal orientation wherein 0 nm<t<50 nm. 19. The method according to claim 18 , wherein the primer layer has a thickness of between 0 and 50 nm. 20. The method according to claim 18 , wherein the substrate is glass. 21. The method according to claim 20 , wherein the barrier layer comprises a sodium barrier layer on the glass prior to deposition of any other layer. 22. The method according to claim 21 , wherein a thickness is selected for the barrier layer of between 5 and 200 nm. 23. The method according to claim 21 , wherein the barrier layer is deposited by chemical vapour deposition. 24. The method according to claim 18 , wherein the barrier layer comprises a layer of SiO 2 . 25. The method according to claim 24 , wherein 8 nm<t<30 nm. 26. The method according to claim 25 , wherein 12 nm<t<18 nm. 27. The method according to claim 18 , wherein the barrier layer comprises a layer of Si x N y . 28. The method according to claim 27 , wherein 0 nm<t<30 nm. 29. The method according to claim 28 , wherein 0 nm<t<15 nm. 30. The method according to claim 29 , wherein 2 nm<t<8 nm. 31. The method according to claim 18 , wherein the primer layer comprises a layer of ZnSnO x having a thickness of between 5 and 30 nm. 32. The method according to claim 18 , wherein the ZnO layer comprises a component of Al.
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