Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

Patent metadata

Field	Value
Publication number	US-9793144-B2
Application number	US-201113220903-A
Country	US
Kind code	B2
Filing date	Aug 30, 2011
Priority date	Aug 30, 2011
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.

First claim

The invention claimed is:

1. A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising:
a base arrangement mounted to a wall of the vacuum wafer treatment chamber, said base arrangement having an essentially planar surface the outer periphery thereof being bordered by a protruding circular rim surface about a center of said essentially planar surface, wherein said essentially planar surface and said protruding circular rim surface are heat reflector surfaces;
a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially planar surface, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said essentially planar surface with respect to said base arrangement, said protruding circular rim surface curving outwards and upwards away from said essentially planar surface toward a bottom surface of said metal circular wafer carrier plate;
a heater compartment commonly defined by the bottom surface of said metal circular wafer carrier plate, said essentially planar surface, and said protruding circular rim surface, the heater compartment comprising a multitude of heater tubes mounted to said base arrangement between said essentially planar surface and said bottom surface of said metal circular wafer carrier place, said heater tubes being directly exposed to said bottom surface of said metal circular wafer carrier plate and to said essentially planar surface of said base arrangement; and
a wafer retaining arrangement operationally coupled to said metal circular wafer carrier plate.

2. The wafer holder and temperature conditioning arrangement of claim 1 , further comprising an electric power control unit controlling power to said multitude of heater tubes and configured to operate said multitude of heater tubes to establish along a top surface of said metal circular wafer carrier plate, opposite said bottom surface thereof, a temperature of at least 800° C., averaged over said top surface.

3. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said multitude of heater tubes consist of a multitude of equal heater tubes, mounted in said heater compartment equally oriented with respect to a radial direction from said center of said essentially planar surface to said circular rim surface.

4. The wafer holder and temperature conditioning arrangement of claim 3 , wherein a length extent direction of said heater tubes is angularly offset from said radial direction.

5. The wafer holder and temperature conditioning arrangement of claim 1 , wherein a position of at least a part of said heater tubes in said heater compartment is adjustable.

6. The wafer holder and temperature conditioning arrangement of claim 1 , further comprising a gas outlet- and dispensing-arrangement through and along a top surface of said metal circular wafer carrier plate.

7. The wafer holder and temperature conditioning arrangement of claim 1 , further comprising a piping arrangement in the base arrangement conceived to flow a liquid herein.

8. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said wafer retaining arrangement is a weight-ring dimensioned so as to reside on a periphery of a wafer to be processed.

9. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said heater tubes have a thickness that fills said heater compartment without contacting said essentially planar surface or said bottom surface of said metal circular wafer carrier plate.

10. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said metal circular wafer carrier plate is electrically isolated from said base arrangement.

11. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said wafer carrier plate is configured to carry one of:
a 100 mm diameter wafer and said multitude of heater tubes consists of four 500 W halogen heater tubes;
a 150 mm diameter wafer and said multitude of heater tubes consists of five 500 W halogen heater tubes; and
a 200 mm diameter wafer and said multitude of heater tubes consists of ten 250 W halogen heater tubes.

12. The wafer holder and temperature conditioning arrangement of claim 8 , wherein said weight-ring is configured to be electrically connected to an electric bias source.

13. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said essentially planar surface and said protruding circular rim surface are high gloss polished.

14. The wafer holder and temperature conditioning arrangement of claim 10 , wherein said metal circular wafer carrier plate is configured to be electrically connected to an electric biasing source.

15. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said heater tubes are along said bottom surface of said metal circular wafer carrier plate.

16. The wafer holder and temperature conditioning arrangement of claim 1 , wherein said protruding circular rim surface is circular about a central axis of the essentially planar surface.

17. The wafer holder and temperature conditioning arrangement of claim 1 , wherein the heater compartment is formed as a closed bin between the bottom surface of said metal circular wafer carrier plate, the essentially planar surface of the base arrangement, and the protruding circular rim surface of the base arrangement.

18. The wafer holder and temperature conditioning arrangement of claim 17 , wherein a depth of the bin corresponds to a thickness of the heater tubes relative to the geometric axis of the essentially planar surface.

19. The wafer holder and temperature conditioning arrangement of claim 1 , wherein the essentially planar surface and the protruding circular rim surface reflect heat generated by the heater tubes directly toward the metal circular wafer carrier plate.

20. The wafer holder and temperature conditioning arrangement of claim 1 , wherein the bottom surface of the metal circular wafer carrier plate forms a top wall of, and closes, the heater compartment throughout a duration of a wafer processing.

21. The wafer holder and temperature conditioning arrangement of claim 1 , further comprising a gas feed system for establishing, in operation, a cushion of back gas at a pressure larger than an operating vacuum pressure in a processing space of the vacuum wafer treatment chamber.

22. The wafer holder and temperature conditioning arrangement of claim 1 , further comprising a driver shaft coaxial to the geometric axis and operationally connected to a motor, wherein the driver shaft and the metal circular wafer carrier plate are electrically isolated from the base arrangement and from the wall of the vacuum processing chamber.

23. The wafer holder and temperature conditioning arrangement of claim 22 , further comprising a gas outlet and a gas diverting system with gas distribution grooves provided in a substantially plane surface of the metal circular wafer carrier plate, wherein the driver shaft comprises a coaxial gas feed line operationally connected to a gas source arrangement, said coaxial gas feed line abutting in the gas outlet and the gas diverting system.

Assignees

• Kielwein Juergen
• Scholte Von Mast Bart
• Lodder Rogier
• Evatec Ag

Inventors

• Kielwein Juergen
• Scholte Von Mast Bart
• Lodder Rogier

Classifications

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic