Spin coating method and manufacturing method of electronic component

Patent metadata

Field	Value
Publication number	US-9793111-B2
Application number	US-201615066815-A
Country	US
Kind code	B2
Filing date	Mar 10, 2016
Priority date	Sep 10, 2015
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A spin coating method according to an embodiment includes forming a first material film on an underlying material. The underlying material is rotated while a solution of a second material film is supplied onto an upper surface of the first material film to make the solution stay on the upper surface of the first material film. Rotating of the underlying material is stopped or a rotational speed of the underlying material is reduced to 10 rpm or less. The underlying material is rotated after a first period elapses after the stopping of the rotating of the underlying material, or the rotational speed of the underlying material is increased after the first period elapses after the reducing of the rotational speed of the underlying material to spin off the solution from the upper surface of the first material film.

First claim

The invention claimed is:

1. A spin coating method comprising:
forming a first material film on an underlying material;
rotating the underlying material while a solution of a second material film is supplied onto an upper surface of the first material film, to make the solution stay on the upper surface of the first material film;
stopping the rotating of the underlying material or reducing a rotational speed of the underlying material to 10 rpm or less; and
spinning off the solution from the upper surface of the first material film by rotating the underlying material after a first period elapses after the stopping of the rotating of the underlying material, or by increasing the rotational speed of the underlying material after the first period elapses after the reducing of the rotational speed of the underlying material,
wherein when the solution is spun off, the solution is supplied onto the upper surface of the first material film, the supplying of the solution is stopped and rotation is then performed for a certain period of time, and thereafter the solution is spun off.

2. The method of claim 1 , wherein
before the solution is made to stay, the solution is supplied onto the upper surface of the first material film while the underlying material is rotated at a first rotational speed, to make an entire upper surface of the first material film wet with the solution, and
when the solution is made to stay, the underlying material is rotated at a second rotational speed slower than the first rotational speed while the solution is supplied onto the upper surface of the first material film, to make the solution stay on the entire upper surface of the first material film.

3. The method of claim 2 , wherein the underlying material is rotated at a third rotational speed that is faster than the second rotational speed, when the solution is spun off.

4. The method of claim 2 , wherein a cleaning liquid for dissolving the solution is supplied to an end portion and a back surface of the underlying material, when the solution is spun off.

5. The method of claim 2 , wherein the first material film is formed of a fine particle material or a porous material that allows penetration of the solution thereinto.

6. The method of claim 1 , further comprising heating after the solution on the upper surface of the first material film is spun off, to harden the solution that has penetrated an inside of the first material film.

7. The method of claim 1 , wherein a cleaning liquid for dissolving the solution is supplied to an end portion and a back surface of the underlying material, when the solution is spun off.

8. The method of claim 1 , wherein the first material film is formed of a fine particle material or a porous material that allows penetration of the solution thereinto.

9. A manufacturing method of an electronic component, comprising:
forming a first material film on an underlying material;
rotating the underlying material while a solution of a second material film is supplied onto an upper surface of the first material film, to make the solution stay on the upper surface of the first material film;
stopping the rotating of the underlying material or reducing a rotational speed of the underlying material to 10 rpm or less; and
spinning off the solution on the upper surface of the first material film by rotating the underlying material or increasing the rotational speed of the underlying material after a first period elapses after the stopping of the rotating of the underlying material, or after the first period elapses after the reducing of the rotational speed of the underlying material,
wherein when the solution is spun off, the solution is supplied onto the upper surface of the first material film, the supplying of the solution is stopped and rotation is then performed for a certain period of time, and thereafter the solution is spun off.

10. The method of claim 9 , wherein
before the solution is made to stay, the solution is supplied onto the upper surface of the first material film while the underlying material is rotated at a first rotational speed, to make an entire upper surface of the first material film wet with the solution, and
when the solution is made to stay, the underlying material is rotated at a second rotational speed slower than the first rotational speed while the solution is supplied onto the upper surface of the first material film, to make the solution stay on the entire upper surface of the first material film.

11. The method of claim 10 , wherein the underlying material is rotated at a third rotational speed that is faster than the second rotational speed, when the solution is spun off.

12. The method of claim 10 , wherein the underlying material is rotated at the second rotational speed that is slower than the first rotational speed, when the solution is spun off.

13. The method of claim 10 , wherein a cleaning liquid for dissolving the solution is supplied to an end portion and a back surface of the underlying material, when the solution is spun off.

14. The method of claim 10 , wherein the first material film is formed of a fine particle material or a porous material that allows penetration of the solution thereinto.

15. The method of claim 9 , wherein a cleaning liquid for dissolving the solution is supplied to an end portion and a back surface of the underlying material, when the solution is spun off.

16. The method of claim 9 , wherein the first material film is formed of a fine particle material or a porous material that allows penetration of the solution thereinto.

Assignees

• Toshiba Kk
• Toshiba Memory Corp

Inventors

• Nakazawa Keisuke

Classifications

• H10P14/6322

  Formation by thermal treatments (formation by plasma treatment H10P14/6319) · CPC title

• H10P14/6342 Primary

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H01L21/02255

  Electricity · mapped topic

• H01L21/02282 Primary

  Electricity · mapped topic