System for manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-9793093-B2
Application number	US-201615185166-A
Country	US
Kind code	B2
Filing date	Jun 17, 2016
Priority date	Jan 10, 2014
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A semiconductor device manufacturing system includes: a PL evaluation apparatus that evaluates wavelengths of photoluminescent light produced by individual optical modulators on a single semiconductor wafer; an electron beam drawing apparatus that draws patterns of diffraction gratings of laser sections that adjoin respective optical modulators on the wafer; and a calculation section that receives the wavelengths of the photoluminescent light from the PL evaluation apparatus, calculates densities of respective diffraction gratings so that differences between the wavelengths of the photoluminescent light and oscillating wavelengths of the laser sections become a constant, and sends the densities calculated to the electron beam drawing apparatus for drawing respective diffraction grating patterns on the respective laser sections.

First claim

What is claimed is:

1. A semiconductor device manufacturing system comprising:
a PL evaluation apparatus that evaluates wavelengths of photoluminescent light produced by individual optical modulators of a plurality of optical modulators on a wafer;
an electron beam drawing apparatus that draws patterns of diffraction gratings of laser sections adjoining respective optical modulators of the plurality of optical modulators; and
a calculation section that receives the wavelengths of the photoluminescent light from the PL evaluation apparatus, calculates densities of respective diffraction gratings so that difference values between the wavelengths of the photoluminescent light and oscillating wavelengths of the laser sections become predetermined values, and sends the densities calculated to the electron beam drawing apparatus for drawing respective diffraction grating patterns on the respective laser sections.

Assignees

• Mitsubishi Electric Corp

Inventors

• Morita Daisuke
• Kawahara Hiroyuki
• Kimura Shinji

Classifications

• H01S5/3054

  p-doping · CPC title

• H01S2301/173

  The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction · CPC title

• H01S5/34326

  with a well layer based on InGa(Al)P, e.g. red laser · CPC title

• H01S5/0014 Primary

  Measuring characteristics or properties thereof (measuring techniques per se G01J, G01K, G01N, G01R) · CPC title

• H01J37/3056

  for microworking, e. g. etching of gratings or trimming of electrical components · CPC title