Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly

Patent metadata

Field	Value
Publication number	US-9793011-B2
Application number	US-201214646223-A
Country	US
Kind code	B2
Filing date	Nov 21, 2012
Priority date	Nov 21, 2012
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Provided is a structure including a first member ( 2 ); a second member ( 3 ) disposed opposite to the first member ( 2 ); and a glass layer ( 4 ) disposed between the first member ( 2 ) and the second member ( 3 ) so as to bond the first member ( 2 ) and the second member ( 3 ). A glass transition point of the glass layer ( 4 ) is lower than a temperature of the glass layer ( 4 ) under operation. In the glass layer ( 4 ), at least either of ceramic and metallic particles 4 b, 4 c is dispersed. In a temperature region lower than the glass transition point of the glass layer ( 4 ), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member ( 2 ) and the second member ( 3 ). This allows thermal strain caused within the structure ( 1 ) to be reduced when the structure ( 1 ) is operated at a higher temperature than a room temperature.

First claim

The invention claimed is:

1. A structure comprising:
a first member;
a second member disposed opposite to the first member; and
a glass layer disposed between the first member and the second member and so as to bond the first member and the second member,
wherein a glass transition point of the glass layer is lower than a temperature of the glass layer when the structure is operated; and
a softening point of the glass layer is higher than the temperature of the glass layer when the structure is operated.

2. The structure according to claim 1 , wherein at least either of ceramic and metallic particles is dispersed in the glass layer.

3. The structure according to claim 1 ,
wherein a material of the glass layer is at least one member selected from a PbO—B 2 O 3 based glass material; a Bi 2 O 3 —B 2 O 3 based glass material; a Na 2 O—BaO—SiO 2 based glass material; an Al 2 O 3 —B 2 O 3 —SiO 2 based glass material; a Na 2 O—Al 2 O 3 —B 2 O 3 —SiO 2 based glass material; a Na 2 O—Al 2 O 3 —B 2 O 3 —ZnO—SiO 2 based glass material; a PbO—ZnO—B 2 O 3 based glass material; a PbO—Al 2 O 3 —SiO 2 based glass material; a PbO—B 2 O 3 —Al 2 O 3 —SiO 2 based glass material; a PbO—ZnO—B 2 O 3 —SiO 2 based glass material; a ZnO—B 2 O 3 —SiO 2 based glass material; a V 2 O 5 —P 2 O 5 —Sb 2 O 3 —BaO based glass material; a V 2 O 5 —P 2 O 5 —BaO—MnO—Fe 2 O 3 —WO 3 —Na 2 O—K 2 O based glass material; a V 2 O 5 —P 2 O 5 —TeO 2 —Fe 2 O 3 based glass material; a V 2 O 5 —P 2 O 5 —BaO—TeO 2 —Fe 2 O 3 —WO 3 based glass material; a V 2 O 5 —P 2 O 5 —BaO—TeO 2 —Fe 2 O 3 —WO 3 —K 2 O based glass material; and a V 2 O 5 —TeO 2 —Ag 2 O based glass material.

4. The structure according to claim 1 , wherein the first member is a film formed on the glass layer.

5. The structure according to claim 4 , wherein the film is formed by means of at least one of a sputtering method, a vapor deposition method, a plating method and a coating method.

6. The structure according to claim 1 , wherein a thermal expansion coefficient of the glass layer has a value between thermal expansion coefficients of the first and second members in a temperature region lower than the glass transition point.

7. An electronic element module including the structure according to claim 1 ,
wherein the first member is either an electronic element or a support member for supporting the electronic element;
the second member is a substrate; and
ceramic and metallic particles are dispersed in the glass layer such that thermal conductivity of the glass layer is equal to 25 W/mK or higher and electric resistance of the glass layer is equal to 0.1 mΩ/cm 2 or lower.

8. A heat exchanger including the structure according to claim 1 , through the heat exchanger first and second fluids at different temperatures to each other flowing while isolated by the structure,
wherein the first member is disposed on the glass layer at a side of the first fluid;
the second member is disposed on the glass layer at a side of the second fluid;
at least either of ceramic and metallic particles is dispersed in the glass layer; and
thermal expansion conductivity of the glass layer is equal to 22 W/mK or higher.

9. A fuel rod including the structure according to claim 1 as a cladding tube that stores pellets, wherein
the first member is a ceramic tube disposed on an outer circumferential side of the cladding tube;
the second member is a metallic tube disposed on an inner circumferential side of the cladding tube; and
at least either of ceramic and metallic particles is dispersed in the glass layer such that thermal expansion conductivity of the glass layer is equal to 10 W/mK or higher.

10. A fuel assembly storing a plurality of the fuel rods according to claim 9 .

Assignees

• Hitachi Ltd

Inventors

• ISHIBASHI Ryou
• Naitou Takashi
• Kodama Motomune
• Aoyagi Takuya
• Hino Tetsushi
• Aoyama Motoo
• Hashimoto Tsuneyuki
• Takahashi Katsuhito
• Sakano Junichi
• Nakano Hiroshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title