Passive alignment of polymer waveguides

Patent metadata

Field	Value
Publication number	US-9791642-B2
Application number	US-201715436934-A
Country	US
Kind code	B2
Filing date	Feb 20, 2017
Priority date	Sep 9, 2015
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

First claim

The invention claimed is:

1. A chip packaging comprising a first part and a second part, wherein
the first part comprises:
a support;
a core polymer layer extending over an inner region and an outer region of the support, the core polymer layer transversally structured so as to exhibit distinct residual portions, each having a same first height, which corresponds to a thickness of the core polymer layer, the residual portions comprising:
first waveguide cores disposed within said inner region,
one or more first alignment structures disposed within said outer region; and

wherein the support comprises one or more additional polymer cladding portions extending over a polymer cladding layer, the outer region defined on the one or more additional polymer cladding portions, so as for the inner region to be recessed with respect to the outer region;

the second part comprises:
second waveguide cores, each having a same second height; and
one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures;

wherein the first part is structured such that said inner region is recessed with respect to the outer region, to enable:
the second waveguide cores to contact the first waveguide cores;
the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures; and

wherein the inner region and the outer region are each planar and structurally contiguous.

2. A method for passively aligning two parts of a chip packaging, the method comprising:
providing a first part comprising:
a support;
a core polymer layer extending over an inner region and an outer region of the support, the core polymer layer transversally structured so as to exhibit distinct residual portions, each having a same first height, which corresponds to a thickness of the core polymer layer, the residual portions comprising:
first waveguide cores disposed within said inner region,
one or more first alignment structures disposed within said outer region; and

wherein the support comprises one or more additional polymer cladding portions extending over a polymer cladding layer, the outer region defined on the one or more additional polymer cladding portions, so as for the inner region to be recessed with respect to the outer region;

providing a second part comprising:
second waveguide cores, each having a same second height; and
one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures;

wherein the first part is structured such that said inner region is recessed with respect to the outer region, to enable:
the second waveguide cores to contact the first waveguide cores;
the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures; and

bringing together the first part and the second part such that the second waveguide cores respectively contact the first waveguide cores and the one or more second alignment structures respectively receive, at least partly, the one or more first alignment structures.

3. The method of claim 2 , wherein providing the first part comprises:
depositing a core polymer layer onto both the one or more additional polymer cladding portions and an exposed inner region of the polymer cladding layer,
transversally structuring the deposited core polymer layer, and
curing the structured core polymer layer to obtain said first waveguide cores and said one or more first alignment structures.

4. The method of claim 3 , wherein transversally structuring the core polymer layer comprises patterning said first waveguide cores and said one or more first alignment structures, during a same patterning process step.

Assignees

• IBM

Inventors

• Dangel Roger F
• Jubin Daniel S
• La Porta Antonio
• Offrein Bert J

Classifications

• G02B6/4257

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• G02B6/1221

  made from organic materials · CPC title

• G02B6/4228 Primary

  Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements (G02B6/4234 takes precedence) · CPC title

• G02B2006/12147

  Coupler · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title