Electronic device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9789637-B2
Application number	US-201314414831-A
Country	US
Kind code	B2
Filing date	Jul 10, 2013
Priority date	Jul 16, 2012
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

First claim

The invention claimed is:

1. An electronic device, comprising:
a first molded product integrated with an electronic component; and
a second molded product secondarily molded outside of the first molded product, wherein
the first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin,
the thermosetting resin of the first molded product includes a ratio of a base material and a curing agent that is shifted from an equivalent ratio, and a surplus material of the base material and the curing agent that shifts the ratio from the equivalent ratio is the first additive,
the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group or a skeleton that can joining-react with the first additive, and
an interface between the first molded product and the second molded product attaches the first molded product to the second molded product at the first additive and the second additive located at the interface, the first additive and the second additive are attached to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion.

2. The electronic device according to claim 1 ,
wherein the second additive has a reactive group or a skeleton that can joining-react with the first additive as the surplus material.

3. The electronic device according to claim 1 , wherein the first molded product is disposed to seal the electronic component.

4. A method for manufacturing an electronic device that includes:
a first molded product integrated with an electronic component; and
a second molded product secondarily molded outside of the first molded product,
the method comprising:
preparing a first molding material including a thermosetting resin, and a first additive contained in the thermosetting resin as a raw material of the first molded product, the thermosetting resin of the first molded product includes a ratio of a base material and a curing agent that is shifted from an equivalent ratio, and a surplus material of the base material and the curing agent that shifts the ratio from the equivalent ratio is the first additive;
preparing a second molding material including a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group or a skeleton that can joining-react with the first additive as a raw material of the second molded product;
thermally curing the first molding material to form the first molded product; and
arranging the second molding material outside of the first molded product, and joining the first additive and the second additive on an interface between the first molded product and the second molded product to attach the first molded product to the second molded product at the first additive and the second additive located at the interface by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion due to a molding heat of the second molded product, to form the second molded product.

5. The method for manufacturing the electronic device according to claim 4 , wherein in the thermally curing, the first molding material is thermally cured so as to seal the electronic component to form the first molded product.

6. An electronic device, comprising:
a first molded product integrated with an electronic component; and
a second molded product including a thermoplastic resin which is secondarily molded outside of the first molded product, wherein
the first molded product includes a thermosetting resin, and a first additive resin dispersed in the thermosetting resin and made of a thermoplastic resin,
the first additive resin has a glass transition temperature or a softening point lower than a molding temperature of the second molded product, and a pyrolysis temperature higher than the molding temperature of the second molded product,
the first additive resin has compatibility with a thermoplastic resin of the second molded product, and
an interface between the first molded product and the second molded product is attached together via the first additive resin of the first molded product being integrated with the thermoplastic resin of the second molded product.

7. The electronic device according to claim 6 ,
wherein the second molded product includes a base resin made of a thermoplastic resin which is a base, and a second additive resin dispersed in the base resin and made of the same thermoplastic resin as that of the first additive resin, and
wherein the first additive resin and the second additive resin are melted and integrated together on the interface between the first molded product and the second molded product.

8. The electronic device according to claim 6 , wherein the first molded product is disposed to seal the electronic component.

9. A method for manufacturing an electronic device that includes:
a first molded product integrated with an electronic component; and
a second molded product including a thermoplastic resin which is secondarily molded outside of the first molded product,
the method comprising:
preparing a first molding material including a thermosetting resin, and a first additive resin dispersed in the thermosetting resin and made of a thermoplastic resin as a raw material of the first molded product, in which the first additive resin has a glass transition temperature or a softening point lower than a molding temperature of the second molded product, and a pyrolysis temperature higher than the molding temperature of the second molded product, the first additive resin has compatibility with a thermoplastic resin of the second molded product;
preparing a second molding material including a thermoplastic resin as a raw material of the second molded product;
thermally curing the first molding material to form the first molded product; and
arranging the second molding material outside of the first molding material, and integrally melting the first additive resin and the thermoplastic resin forming the second molded product on an interface between the first molded product and the second molded product due to a molding heat of the second molded product, to form the second molded product.

10. The method for manufacturing the electronic device according to claim 9 , wherein in the thermally curing, the first molding material is thermally cured so as to seal the electronic component to form the first molded product.

11. A method for manufacturing an electronic device including
a first molded product that is integrated with an electronic component, that is molded with a thermosetting resin, and that includes a photoresponsive compound on a surface of the first molded product, and
a second molded product joined to at least a part of the first molded product, and molded with a thermoplastic resin,
the method comprising:
preparing the first molded product on the surface of which a photoresponsive compound that phase transitions from a solid phase or a liquid crystal phase to a liquid phase due to ultraviolet ray irradiation, and phase transitions from the liquid phase to a phase before the ultraviolet ray irradiation due to visible light irradiation or heating is present, in which the photoresponsive compound is phase transitioned to the liquid phase by the ultraviolet ray irradiation; molding the second molded product by injecting a liquid thermoplastic resin into a mold die, and bringing the liquid thermoplastic resin into contact with a surface of the first molded product in a state where the first molded

Assignees

• Denso Corp

Inventors

• Izumi Ryosuke
• Saito Takashige
• Okuhira Hiroyuki
• Ikuno Yuuichi
• Yamamoto Kouji

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title