Component supply device

Patent metadata

Field	Value
Publication number	US-9788470-B2
Application number	US-201214438452-A
Country	US
Kind code	B2
Filing date	Oct 29, 2012
Priority date	Oct 29, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.

First claim

The invention claimed is:

1. A component supply device arranged adjacent to a mounter having a mounting head that mounts components on a board, the component supply device supplying the components to the mounter, comprising:
a wafer sheet replenishment section which replenishes a wafer sheet on which multiple components are arranged; and
a wafer sheet conveyance section which conveys a wafer sheet supplied from the wafer sheet replenishment section, the wafer sheet conveyance section including a table on which the wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table;
wherein the pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which a respective tip of the multiple component supply side suction nozzles faces down and between a transfer position at which the respective tip of the multiple component supply side suction nozzles faces up;
wherein the switching mechanism includes a pinion gear fixed to a rotation axis around which the multiple component supply side suction nozzles rotate, the pinion gear engaged with a rack which is movable to rotate the pinion gear; and
wherein an arrangement of the multiple component supply side suction nozzles corresponds to an arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.

2. The component supply device according to claim 1 ,
wherein the pickup head is attached movably in a level plane with respect to the table;
wherein the wafer sheet conveyance section is provided with a mechanism which raises and lowers the table to which the pickup head is attached between a direct supply position and an indirect supply position which is below the direct supply position; and
wherein a height of the table when the table is positioned at the direct supply position and when the pickup head is positioned above the pickup table, matches a height of the component supply side suction nozzles when the table is positioned at the indirect supply position and when the component supply side suction nozzles are positioned at the transfer position.

3. The component supply device according to claim 1 ,
wherein the pickup head further includes a first housing and a second housing which is rotatably supported around the rotation axis with respect to the first housing and to which the multiple component supply side suction nozzles are attached.

4. The component supply device according to claim 3 wherein the switching mechanism further includes a rotation speed adjusting mechanism which decreases the rotation speed of the second housing in an area near the pickup position and near the transfer position, slower than the rotation speed of the second housing in other areas.

5. The component supply device according to claim 1 , wherein the switching mechanism includes a cam follower attached to an end of the rack, the cam follower including a groove in which a pin is engaged.

6. The component supply device according to claim 5 , wherein the pin is fixed to a rotation member, and rotation by the rotation member moves the pin moves the pin in the groove to move the rack.

Assignees

• Fuji Machine Mfg

Inventors

• Shimizu Toshinori
• Ohashi Hiroyasu
• Yamasaki Toshihiko
• Murai Masaki

Classifications

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10P72/3408

  Docking arrangements · CPC title

• H10P72/3214

  by means of a cart or a vehicle · CPC title

• H10P72/3212 Primary

  the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title