Method of manufacturing a board-to-board connector for electrically connecting two circuit boards

US9787044B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9787044-B2
Application numberUS-201514944274-A
CountryUS
Kind codeB2
Filing dateNov 18, 2015
Priority dateSep 17, 2013
Publication dateOct 10, 2017
Grant dateOct 10, 2017

How to read this patent

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a board-to-board connector capable of preventing a short-circuit from occurring between contacts when connectors are fitted to each other. Pin-shaped male-side contact portions protrude from one surface of a male-side insulating film, and male-side terminal portions are provided on the other surface of said male-side insulating film. This makes it possible to prevent a short-circuit from occurring between adjacent female-side contacts by the male-side contacts.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a male connector of a board-to-board connector that comprises a male connector which is mounted on a first substrate, and a female connector which is mounted on a second substrate and which can be fitted to the male connector, the board-to-board connector electrically connecting between the first substrate and the second substrate, the male connector having: a male-side insulating film; a plurality of male-side contacts which are provided on said male-side insulating film; and a male-side reinforcing member which is provided on said male-side insulating film, each of the male-side contacts having a male-side terminal portion which is connected to the first substrate, and a pin-shaped male-side contact portion which is formed continuously with said male-side terminal portion such that said male-side contact portion protrudes from one surface of said male-side insulating film and can be brought into contact with a corresponding one of female-side contacts of the female connector, a plurality of said male-side contact portions being arrayed on the one surface of said male-side insulating film, a plurality of said male-side terminal portions being arrayed on the other surface of said male-side insulating film, and said male-side reinforcing member having a male-side reinforcing member main body portion which is arranged along the plurality of said male-side terminal portions on the other surface; wherein the method includes: a thin film processing step for providing a metal thin film on the other surface of said male-side insulating film; a patterning step for etching said metal thin film and forming the plurality of said male-side terminal portions and said male-side reinforcing member main body portion after said thin film processing step; a through-hole-forming step for forming, on said male-side insulating film by performing an etching process, through-holes which pass through to said male-side terminal portions after said patterning step; and a contact-portion-forming step for forming said pin-shaped male-side contact portions at the positions of said through-holes after said through-hole-forming step. 2. The method for manufacturing a male connector of a board-to-board connector according to claim 1 , wherein: the female connector has a female-side insulating film, and a plurality of said female-side contacts provided on said female-side insulating film; each of the female-side contacts has a female-side contact portion which is provided on one surface of said female-side insulating film and which can be brought into contact with a corresponding one of said male-side contact portions, and a female-side terminal portion which is formed continuously with said female-side contact portion such that said female-side terminal portion protrudes from the other surface of said female-side insulating film, said female-side terminal portion being connected to the second substrate; a plurality of said female-side contact portions are arrayed on the one surface of said female-side insulating film; and a plurality of said female-side terminal portions are arrayed on the other surface of said female-side insulating film. 3. The method for manufacturing a male connector of a board-to-board connector according to claim 2 , said male-side reinforcing member having: fixing portions that are formed continuously with said male-side reinforcing member main body portion, and that are arranged on both end portions of the other surface of said male-side insulating film in the direction in which the plurality of said male-side contact portions are arrayed; and protruding portions that are formed continuously with said fixing portions, and that are arranged on both end portions of the one surface of said male-side insulating film in the direction in which the plurality of said male-side contact portions are arrayed, and the female connector having protruding-portion-supporting members that are arranged on both end portions of the one surface of said female-side insulating film in the direction in which the plurality of said female-side contact portions are arrayed, and that have protruding-portion-receiving holes for guiding said protruding portions toward the second substrate, wherein the method includes: a thin film processing step for providing a metal thin film on the other surface of said male-side insulating film; a patterning step for etching said metal thin film and forming the plurality of said male-side terminal portions, said male-side reinforcing member main body portion, and said fixing portions after said thin film processing step; a through-hole-forming step for forming, on said male-side insulating film by performing an etching process, through-holes which pass through to said male-side terminal portions and protruding-portion through-holes which pass through to said fixing portions after said patterning step; and a contact-portion-forming step for forming said pin-shaped male-side contact portions at the positions of said through-holes, and forming said protruding portions at the positions of said protruding-portion through-holes, after said through-hole-forming step. 4. The method for manufacturing a male connector of a board-to-board connector according to claim 3 , each of the female-side contact portions being elastically deformed, when said protruding portions are inserted in said protruding-portion-receiving holes of the female connector, to thereby sandwich each of the corresponding male-side contact portions in a prescribed direction orthogonal to the thickness direction of said female-side insulating film, whereby a prescribed contact force is generated between said female-side contact portion and said male-side contact portion, wherein the method includes: a thin film processing step for providing a metal thin film on the other surface of said male-side insulating film; a patterning step for etching said metal thin film and forming the plurality of said male-side terminal portions, said male-side reinforcing member main body portion, and said fixing portions after said thin film processing step; a through-hole-forming step for forming, on said male-side insulating film by performing an etching process, through-holes which pass through to said male-side terminal portions and protruding-portion through-holes which pass through to said fixing portions after said patterning step; and a contact-portion-forming step for forming said pin-shaped male-side contact portions at the positions of said through-holes, and forming said protruding portions at the positions of said protruding-portion through-holes, after said through-hole-forming step. 5. The method for manufacturing a male connector of a board-to-board connector according to claim 1 , the board-to-board connector comprising a male connector which is mounted on a first substrate, and a female connector which is mounted on a second substrate and which can be fitted to the male connector, the board-to-board connector electrically connecting between the first substrate and the second substrate, the male connector having: a male-side insulating film; a plurality of male-side contacts which are provided on said male-side insulating film; and a male-side reinforcing member which is provided on said male-side insulating film, each of the male-side contacts having a male-side terminal portion which is connected to the first substrate, and a pin-shaped male-side contact portion which is formed continuously with said male-side terminal portion such that said male-side contact portion protrudes from one surface of said male-side insulating film and can be brought into contact with a corresponding one of female-side contacts of the female connector, a plurality of said male-side c

Assignees

Inventors

Classifications

  • Printed circuits · CPC title

  • H01R43/205Primary

    with a panel or printed circuit board · CPC title

  • Contact or terminal manufacturing · CPC title

  • H01R12/73Primary

    connecting to other rigid printed circuits or like structures · CPC title

  • Pins or blades for co-operation with sockets · CPC title

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What does patent US9787044B2 cover?
A method of manufacturing a board-to-board connector capable of preventing a short-circuit from occurring between contacts when connectors are fitted to each other. Pin-shaped male-side contact portions protrude from one surface of a male-side insulating film, and male-side terminal portions are provided on the other surface of said male-side insulating film. This makes it possible to prevent a…
Who is the assignee on this patent?
Japan Aviation Electronics Ind Ltd
What technology area does this patent fall under?
Primary CPC classification H01R43/205. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).