Methods and systems for scaffolds comprising nanoelectronic components

Patent metadata

Field	Value
Publication number	US-9786850-B2
Application number	US-201314018075-A
Country	US
Kind code	B2
Filing date	Sep 4, 2013
Priority date	Sep 7, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The present invention generally relates to nanoscale wires and tissue engineering. Systems and methods are provided in various embodiments for preparing cell scaffolds that can be used for growing cells or tissues, where the cell scaffolds comprise nanoscale wires. In some cases, the nanoscale wires can be connected to electronic circuits extending externally of the cell scaffold. Such cell scaffolds can be used to grow cells or tissues which can be determined and/or controlled at very high resolutions, due to the presence of the nanoscale wires, and such cell scaffolds will find use in a wide variety of novel applications, including applications in tissue engineering, prosthetics, pacemakers, implants, or the like. This approach thus allows for the creation of fundamentally new types of functionalized cells and tissues, due to the high degree of electronic control offered by the nanoscale wires and electronic circuits.

First claim

What is claimed is:

1. A method, comprising:
forming a polymeric material on at least a portion of a substrate, wherein the substrate comprises a sacrificial material, wherein the polymeric material comprises one or more polymeric layers that surround one or more nanoscale wires, and wherein forming the polymeric material on the substrate comprising the sacrificial material comprises: depositing one or more bedding polymers on at least a portion of the sacrificial material as one or more layers, and depositing one or more nanoscale wires on at least a portion of the uppermost layer of bedding polymer;
forming one or more metal leads on the polymeric material; and
removing at least a portion of the sacrificial material.

2. The method of claim 1 , further comprising depositing the sacrificial material on the substrate to form the substrate comprising a sacrificial material, prior to forming the polymeric material on the substrate.

3. The method of claim 1 , comprising:
depositing a first bedding polymer on at least a portion of the sacrificial material;
depositing a second bedding polymer on at least a portion of the first bedding polymer; and
depositing one or more nanoscale wires on at least a portion of the second bedding polymer.

4. The method of claim 1 , further comprising aligning the deposited nanoscale wires.

5. The method of claim 1 , wherein forming one or more metal leads comprises:
depositing one or more lead polymers on at least some of the one or more the nanoscale wires;
depositing one or more metals on at least a portion of the one or more lead polymers; and
removing a portion of the one or more metals to form the one or more metal leads.

6. The method of claim 5 , wherein depositing one or more metals on at least a portion of the one or more lead polymers comprises:
depositing a first metal on the one or more lead polymers; and
depositing a second metal on at least a portion of the first metal.

7. The method of claim 6 , further comprising depositing a third metal on at least a portion of the second metal.

8. The method of claim 7 , wherein the first metal, the second metal, and the third metal are deposited in a pre-stressed arrangement.

9. The method of claim 1 , further comprising forming the polymeric material and the one or more metal leads into a 3-dimensional structure.

10. The method of claim 9 , comprising rolling the polymeric material and the one or more metal leads into a 3-dimensional structure.

11. The method of claim 9 , comprising folding the polymeric material and the one or more metal leads into a 3-dimensional structure.

12. The method of claim 9 , wherein upon removing at least a portion of the sacrificial material, the polymeric material and the one or more metal leads spontaneously forms a 3-dimensional structure.

13. The method of claim 1 , wherein the polymeric material comprises a biocompatible polymer layer.

14. The method of claim 1 , further comprising depositing an extracellular matrix protein on at least a portion of the polymeric material.

15. The method of claim 1 , further comprising seeding one or more cells onto the polymeric material.

16. The method of claim 1 , further comprising exposing the polymeric material to a cell growth medium.

17. The method of claim 1 , further comprising connecting the one or more metal leads to an external electrical circuit.

Assignees

• Harvard College

Inventors

• Lieber Charles M
• Tian Bozhi
• Liu Jia

Classifications

• A61L27/40

  Composite materials, i.e. containing one material dispersed in a matrix of the same or different material · CPC title

• H01L51/0575

  Electricity · mapped topic

• H01L51/0504 Primary

  Electricity · mapped topic

• C12N5/0068

  General culture methods using substrates (for specific animal cell type C12N5/06) · CPC title

• C12N2533/30

  Synthetic polymers · CPC title