Light emitting device

Patent metadata

Field	Value
Publication number	US-9786637-B2
Application number	US-201514966160-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Apr 16, 2010
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

There is presented a light emitting device, having plural light emitting elements disposed on a substrate, in which a protection element, such as a zener diode, can be disposed at an appropriate position. The light emitting device includes: a substrate; a light emitting section having plural light emitting elements disposed in a mounting area on the substrate; a positive electrode and negative electrode each having a pad section and wiring section to apply voltage to the light emitting section through the wiring sections; a protection element disposed at one of the positive electrode and negative electrode and electrically connected with the other one electrode; and a light reflecting resin formed on the substrate such as to cover at least the wiring sections and the protection element, wherein the wiring sections are formed along the periphery of the mounting area such that one end portions thereof are adjacent to each other.

First claim

What is claimed is:

1. A light emitting device, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
a positive electrode and a negative electrode each having a pad section and a wiring section;
a plurality of light emitting elements disposed on the first surface of the substrate;
wires connecting the light emitting elements and the wiring sections of the positive and negative electrodes; and
a light reflecting resin having a ring shape including an inner boundary and an outer boundary, and covering portions where the wires and the wiring sections are connected,
wherein the positive and negative electrodes and the light reflecting resin are disposed on the first surface of the substrate,
wherein the inner boundary and the outer boundary are defined in plan view, and
in the plan view, the pad sections of the positive and negative electrodes and a part of each of the wiring sections are disposed outside of the outer boundary of the ring of the light reflecting resin on the first surface of the substrate,
wherein, in the plan view, the pad section of the positive electrode and the pad section of the negative electrode are located at diagonal positions on the substrate, and
wherein, in the plan view, an entirety of the light reflecting resin is located between the pad section of the positive electrode and the pad section of the negative electrode.

2. The light emitting device according to claim 1 , wherein the light reflecting resin has a rectangular ring shape.

3. The light emitting device according to claim 1 , wherein the light reflecting resin has a circular ring shape.

4. The light emitting device according to claim 1 , wherein the plurality of light emitting elements are electrically connected to each other both serially and in parallel.

5. The light emitting device according to claim 1 , wherein a material of the substrate is selected from a group consisting of Al 2 O 3 , AlN, phenol resin, epoxy resin, polyimide resin, BT resin and polyphthalamide.

6. The light emitting device according to claim 1 , wherein the light emitting elements are nitride semiconductors.

7. The light emitting device according to claim 1 , wherein a material of an area in which the light emitting elements are disposed on the substrate is the same as that of the substrate.

8. The light emitting device according to claim 1 , wherein a material of an area in which the light emitting elements are disposed on the substrate is a metal film.

9. The light emitting device according to claim 1 , wherein the pad sections are formed extending out from the light reflecting resin.

10. The light emitting device according to claim 1 , wherein a material of both the positive electrode and the negative electrode is Au.

11. The light emitting device according to claim 1 , wherein a material of the wires is selected from a group consisting of Au or an alloy thereof, Cu or an alloy thereof, Pt or an alloy thereof, and Al or an alloy thereof.

12. The light emitting device according to claim 1 , wherein a material of the light reflecting resin is a thermo-setting resin.

13. The light emitting device according to claim 1 , wherein a material of the light reflecting resin is a thermo-plastic resin.

14. The light emitting device according to claim 1 , wherein the light reflecting resin includes a material selected from a group consisting of TiO 2 , Al 2 O 3 , ZrO 2 , and MgO.

15. The light emitting device according to claim 1 , wherein between 20 and 150 of the light emitting elements are disposed on the first surface of the substrate.

16. The light emitting device according to claim 1 , further comprising a sealing member enclosed by the light reflecting resin.

17. The light emitting device according to claim 16 , wherein the sealing member is formed in a shape of a convex lens.

Assignees

• Nichia Corp

Inventors

• Sasano Haruaki

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L2224/48137

  Electricity · mapped topic

• H01L33/32

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic