Semiconductor device and a method for manufacturing a semiconductor device

Patent metadata

Field	Value
Publication number	US-9786620-B2
Application number	US-201514809296-A
Country	US
Kind code	B2
Filing date	Jul 27, 2015
Priority date	Jul 27, 2015
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

According to various embodiments, a semiconductor device may include: at least one first contact pad on a front side of the semiconductor device; at least one second contact pad on the front side of the semiconductor device; a layer stack disposed at least partially over the at least one first contact pad, wherein the at least one second contact pad is at least partially free of the layer stack; wherein the layer stack includes at least an adhesion layer and a metallization layer; and wherein the metallization layer includes a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad.

First claim

What is claimed is:

1. A semiconductor device, comprising:
at least one first contact pad on a front side of the semiconductor device;
at least one second contact pad on the front side of the semiconductor device;
a layer stack disposed at least partially over the at least one first contact pad, wherein a surface of the at least one second contact pad facing away from the semiconductor device is at least partially free of and uncovered by the layer stack;
wherein the layer stack comprises at least an adhesion layer and a metallization layer; and
wherein the metallization layer comprises a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad,
wherein the semiconductor device further comprises a front surface on the front side of the semiconductor device and wherein the at least one first contact pad and the at least one second contact pad directly contact the front surface,
wherein the layer stack further comprises a barrier layer disposed between the adhesion layer and the at least one first contact pad.

2. The semiconductor device of claim 1 , further comprising:
at least one electrical circuit component which is electrically connected to the at least one first contact pad and/or to the at least one second contact pad.

3. The semiconductor device of claim 1 , further comprising:
a bonding wire, wherein the at least one second contact pad is electrically contacted by the bonding wire.

4. The semiconductor device of claim 1 , further comprising:
a solder material disposed at least partially over the metallization layer.

5. The semiconductor device of claim 4 , further comprising:
wherein the solder material is substantially free of Pb.

6. The semiconductor device of claim 4 ,
wherein the solder material and the metal alloy of the metallization layer comprise at least a first metal.

7. The semiconductor device of claim 6 ,
wherein a concentration of the first metal in the metallization layer is smaller than or equal to about 80 at. %.

8. The semiconductor device of claim 6 ,
wherein the first metal is Sn.

9. The semiconductor device of claim 6 ,
wherein the metal alloy of the metallization layer comprises at least a second metal different from the first metall.

10. The semiconductor device of claim 9 ,
wherein the second metal is Cu.

11. The semiconductor device of claim 4 , further comprising a bonding wire directly contacting and electrically connected to the at least one second contact pad.

12. The semiconductor device of claim 1 ,
wherein the adhesion layer comprises at least one material selected from a group of materials, the group consisting of: a third metal and/or a third metal based alloy.

13. The semiconductor device of claim 12 ,
wherein a concentration of the third metal in the adhesion layer is greater than about 50 at. %.

14. The semiconductor device of claim 12 ,
wherein the third metal is Ti.

15. The semiconductor device of claim 1 , wherein the at least one first contact pad is disposed on a same level as the at least one second contact pad.

16. A method for manufacturing a semiconductor device, the method comprising:
forming at least one first contact pad on a front side of the semiconductor device and at least one second contact pad on the front side of the semiconductor device;
forming a layer stack at least partially over the at least one first contact pad, so that a surface of the at least one second contact pad facing away from the semiconductor device is free of and uncovered by the layer stack;
wherein the layer stack comprises at least a barrier layer, an adhesion layer and a metallization layer and wherein forming the layer stack comprises structuring the adhesion layer using a first etching agent, the first etching agent comprising at least HF; and
wherein the metallization layer comprises a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad,
wherein the semiconductor device further comprises a front surface on the front side of the semiconductor device and wherein the at least one first contact pad and the at least one second contact pad directly contact the front surface.

17. The method of claim 16 ,
wherein the barrier layer is used as an etch stop for the first etching agent.

18. The method of claim 17 , further comprising:
structuring the barrier layer using a second etching agent different from the first etching agent.

19. The method of claim 18 ,
wherein the at least one second contact pad is used as an etch stop for the second etching agent.

20. The method of claim 18 ,
wherein the second etching agent comprises H 2 O 2 .

21. The method of claim 16 , further comprising:
forming solder material on the metallization layer.

22. A semiconductor device, comprising:
at least one first contact pad on a front side of the semiconductor device;
at least one second contact pad on the front side of the semiconductor device;
a layer stack disposed at least partially over the at least one first contact pad, wherein the at least one second contact pad is at least partially free of the layer stack;
a solder material disposed at least partially over the metallization layer;
wherein the solder material and the metal alloy of the metallization layer comprise at least a first metal and wherein a concentration of the first metal in the metallization layer is smaller than or equal to about 80 at. %;
wherein the layer stack comprises at least an adhesion layer and a metallization layer; and
wherein the metallization layer comprises a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad.

23. A semiconductor device, comprising:
at least one first contact pad on a front side of the semiconductor device;
at least one second contact pad on the front side of the semiconductor device;
a layer stack disposed at least partially over the at least one first contact pad, wherein a surface of the at least one second contact pad facing away from the semiconductor device is at least partially free of and uncovered by the layer stack; and
at least one rear metallization layer on a rear side of the semiconductor device opposite to the front side of the semiconductor
wherein the layer stack comprises at least an adhesion layer and a metallization layer; and
wherein the metallization layer comprises a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad,
wherein the semiconductor device further comprises a front surface on the front side of the semiconductor device and wherein the at least one first contact pad and the at least one second contact pad directly contact the front surface.

24. A method for manufacturing a semiconductor device, the method comprising:
forming at least one first contact pad on a front side of the semiconductor device and at least one second contact pad on the front side of the semic

Assignees

• Infineon Technologies Ag
• Infineon Technolgies Ag

Inventors

• Kramp Stefan

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/859

  Bump connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title