Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

Patent metadata

Field	Value
Publication number	US-9786576-B2
Application number	US-74185408-A
Country	US
Kind code	B2
Filing date	Nov 7, 2008
Priority date	Nov 12, 2007
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

First claim

The invention claimed is:

1. A positive-type photosensitive resin composition comprising:
a phenol resin modified by a drying oil, wherein the drying oil has an iodine number of not less than 130, and the drying oil includes an ester of at least one saturated fatty acid including 8 to 30 carbon atoms with glycerol;
a photo acid generator;
a thermal crosslinking agent; and
a solvent,
wherein the phenol resin modified by the drying oil obtained by
(i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and the drying oil with (b) aldehydes, or
(ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil.

2. The positive-type photosensitive resin composition according to claim 1 , wherein the photo acid generator is an o-quinone diazide compound.

3. The positive-type photosensitive resin composition according to claim 1 , containing 3 to 100 parts by mass of the photo acid generator based on 100 parts by mass of the phenol resin modified by the drying oil.

4. The positive-type photosensitive resin composition according to claim 1 , further comprising an elastomer.

5. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and the drying oil with (b) aldehydes.

6. The positive-type photosensitive resin composition according to claim 5 , wherein the ester has 2-30 unsaturated bonds.

7. The positive-type photosensitive resin composition according to claim 1 , wherein in (i), the phenol resin modified by the drying oil is by combining (a) a compound obtained by reacting phenol or a derivative thereof and the drying oil with a compound other than phenol, and then polycondensing with (b) aldehydes.

8. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil.

9. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil, and the phenol resin modified by the drying oil is acid-modified by reacting the phenol resin modified by the drying oil with a polybasic acid anhydride.

10. The positive-type photosensitive resin composition according to claim 1 , wherein the thermal crosslinking agent includes at least one compound selected from the group consisting of a compound having a phenolic hydroxyl group, a compound having a hydroxyl methylamino group, and a compound having an epoxy group.

11. A positive-type photosensitive resin composition comprising:
a modified phenol resin;
a photo acid generator;
a thermal crosslinking agent; and
a solvent,
wherein the modified phenol resin is obtained by
(i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and an ester with (b) aldehydes, or
(ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) an ester,
wherein the ester is an ester of at least one unsaturated fatty acid including 8 to 30 carbon atoms with a monohydric, dihydric, or trihydric alcohol including 1 to 10 carbon atoms.

Assignees

• Matsutani Hiroshi
• Ueno Takumi
• Nicolas Alexandre
• Nanaumi Ken
• Hitachi Chemical Co Ltd

Inventors

• Matsutani Hiroshi
• Ueno Takumi
• Nicolas Alexandre
• Nanaumi Ken

Classifications

• Y10T428/24479

  including variation in thickness · CPC title

• G03F7/022

  Quinonediazides (G03F7/075 takes precedence) · CPC title

• G03F7/0236

  Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title