Wafer transport system and method for operating the same

Patent metadata

Field	Value
Publication number	US-9786535-B2
Application number	US-201414556233-A
Country	US
Kind code	B2
Filing date	Nov 30, 2014
Priority date	May 23, 2014
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.

First claim

What is claimed is:

1. A wafer transport system, comprising:
a semiconductor apparatus;
a track, located along the semiconductor apparatus;
a carrier, riding on the track, for housing a wafer and transporting the wafer along the track, wherein the carrier comprises a first air valve;
a positioning device, connected to the track, for identifying and controlling the position of the carrier on the track;
a transfer device, located between the semiconductor apparatus and the track, for transferring the wafer between the semiconductor apparatus and the track; and
a cleaning device, comprising a pipe and a pump, for cleaning the internal environment of the carrier, wherein the pipe is configured to provide a connection between the pump and the first air valve.

2. The wafer transport system as claimed in claim 1 , wherein the carrier is a side-opening carrier, a hinged carrier, or a two-piece carrier.

3. The wafer transport system as claimed in claim 1 , wherein the carrier comprises a second air valve.

4. The wafer transport system as claimed in claim 1 , wherein the positioning device is a sensor positioning controller or a mechanical positioning controller.

5. The wafer transport system as claimed in claim 1 , wherein the transfer device is a robot arm.

6. The wafer transport system as claimed in claim 1 , wherein the transfer device comprises a nozzle for purging the wafer with gas.

7. The wafer transport system as claimed in claim 1 , wherein the connection between the pipe and the first valve is fixed or removable.

8. A wafer transport system, comprising:
at least one semiconductor apparatus;
an entry port;
an exit port;
a track, located along the at least one semiconductor apparatus, the entry port, and the exit port;
a carrier, riding on the track, for housing a wafer and transporting the wafer along the track, wherein the carrier comprises a first air valve;
at least one positioning device, connected to the track, for identifying and controlling the position of the carrier on the track;
at least three transfer devices, located between the at least one semiconductor apparatus and the track, the entry port and the track, and the exit port and the track respectively, wherein the at least three transfer devices are configured for transferring the wafer between the at least one semiconductor apparatus, the track, the entry port and the exit port; and
a cleaning device, comprising a pipe and a pump, for cleaning the internal environment of the carrier, wherein the pipe is configured to provide a connection between the pump and the first air valve.

9. The wafer transport system as claimed in claim 8 , wherein the carrier is a side-opening carrier, a hinged carrier, or a two-piece carrier.

10. The wafer transport system as claimed in claim 8 , wherein the carrier comprises a second air valve.

11. The wafer transport system as claimed in claim 8 , wherein the at least one positioning device is a sensor positioning controller or a mechanical positioning controller.

12. The wafer transport system as claimed in claim 8 , wherein one of the at least three transfer devices is a robot arm.

13. The wafer transport system as claimed in claim 8 , wherein one of the at least three transfer devices comprises a nozzle for purging the wafer with gas.

14. The wafer transport system as claimed in claim 8 , wherein the connection between the pipe and the first valve is fixed or removable.

Assignees

• Gudeng Prec Ind Co Ltd

Inventors

• Pao Hui-Ming
• Chen Cheng-Hsin
• Lee Po-Ting
• Chiu Ming-Chien
• Lin Tien-Jui

Classifications

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3222

  Loading to or unloading from a conveyor · CPC title

• H10P72/3218

  Conveying cassettes, containers or carriers · CPC title

• H10P72/1926

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/1902

  specially adapted for a single substrate · CPC title