Method and structure for soldering a laser submount to a mounting face of a slider
US-9202478-B1 · Dec 1, 2015 · US
US9786308B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9786308-B1 |
| Application number | US-201615175327-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jun 7, 2016 |
| Priority date | Jun 7, 2016 |
| Publication date | Oct 10, 2017 |
| Grant date | Oct 10, 2017 |
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A slider of a magnetic recording head comprises a media-facing surface, an upper surface opposing the media-facing surface, a leading edge, and a trailing edge. A plurality of electrical bond pads is disposed in a spaced-apart relationship on the trailing edge of the slider. An interconnect interposer is connected to the trailing edge of the slider. The interposer comprises a back side comprising a plurality of electrical contacts in contact with the plurality of bond pads on the trailing edge of the slider. The interposer also comprises a front side comprising a plurality of electrical interposer pads corresponding in number to the plurality of electrical contacts on the back side. The interposer further comprises a plurality of conductors each of which electrically couples one of the plurality of electrical contacts on the back side with one of the plurality of interposer pads on the front side.
Opening claim text (preview).
What is claimed is: 1. An apparatus, comprising: a slider of a magnetic recording head, the slider comprising a media-facing surface, an upper surface opposing the media-facing surface, a leading edge, and a trailing edge; a plurality of electrical bond pads disposed in a spaced-apart relationship on the trailing edge of the slider; and an interconnect interposer connected to the trailing edge of the slider, the interposer comprising: a back side comprising a plurality of electrical contacts in contact with the plurality of bond pads on the trailing edge of the slider; a front side comprising a plurality of electrical interposer pads corresponding in number to the plurality of electrical contacts on the back side; and a plurality of conductors each of which electrically couples one of the plurality of electrical contacts on the back side with one of the plurality of interposer pads on the front side; wherein the slider has a width in a cross-track direction, and the interposer has a width in the cross-track direction that is greater than the width of the slider. 2. The apparatus of claim 1 , wherein: the bond pads are spaced apart by a first spacing dimension; the interposer pads are spaced apart by a second spacing dimension; and the second spacing dimension is greater than the first spacing dimension. 3. The apparatus of claim 1 , wherein: the bond pads have a surface area; the interposer pads have a surface area; and the surface area of the interposer pads is greater than that of the bond pads. 4. The apparatus of claim 1 , wherein the width of the interposer is greater than the width of the slider by a factor of between about 1.5 and 3. 5. The apparatus of claim 1 , wherein: the slider has a thickness, an upper region defining an upper half of the slider thickness, and a lower region defining a lower half of the slider thickness; and the interposer pads are situated on the interposer to align with the upper region of the slider. 6. The apparatus of claim 1 , wherein: the slider has a thickness, an upper region defining an upper third of the slider thickness, and a lower region defining a lower two-thirds of the slider thickness; and the interposer pads are situated on the interposer to align with the upper region of the slider. 7. The apparatus of claim 1 , wherein: the slider comprises first and second opposing edge surfaces between the media-facing surface and the upper surface; a first end portion of the interposer is parallel to the first edge surface; and a second end portion of the interposer is parallel to the second edge surface. 8. The apparatus of claim 1 , wherein one or more portions of the interposer extend over the upper surface of the slider. 9. The apparatus of claim 1 , wherein the interposer is attached to the trailing edge of the slider via solder between the interposer pads and the bond pads. 10. An apparatus, comprising: a slider of a magnetic recording head, the slider comprising a media-facing surface, an upper surface opposing the media-facing surface, a leading edge, and a trailing edge; a plurality of electrical bond pads disposed in a spaced-apart relationship on the trailing edge of the slider, at least some of the bonds pads situated in an upper region of the trailing edge and at least some of the bond pads situated in a lower region of the trailing edge; and an interconnect interposer connected to the trailing edge of the slider, the interposer comprising: a back side comprising a plurality of electrical contacts in contact with the plurality of bond pads in the upper and lower regions of the trailing edge of the slider; a front side comprising a plurality of electrical interposer pads corresponding in number to the plurality of electrical contacts on the back side; and a plurality of conductors each of which electrically couples one of the plurality of electrical contacts on the back side with one of the plurality of interposer pads on the front side; wherein the slider has a width in a cross-track direction, and the interposer has a width in the cross-track direction that is greater than the width of the slider. 11. The apparatus of claim 10 , wherein: the slider has a thickness, an upper region defining an upper half of the slider thickness, and a lower region defining a lower half of the slider thickness; and the interposer pads are situated on the interposer to align with the upper region of the slider. 12. The apparatus of claim 10 , wherein: the slider has a thickness, an upper region defining an upper third of the slider thickness, and a lower region defining a lower two-thirds of the slider thickness; and the interposer pads are situated on the interposer to align with the upper region of the slider. 13. The apparatus of claim 10 , wherein: the bond pads are spaced apart by a first spacing dimension; the interposer pads are spaced apart by a second spacing dimension; and the second spacing dimension is greater than the first spacing dimension. 14. The apparatus of claim 10 , wherein: the bond pads have a surface area; the interposer pads have a surface area; and the surface area of the interposer pads is greater than that of the bond pads. 15. The apparatus of claim 10 , wherein the width of the interposer is greater than the width of the slider by a factor of between about 1.5 and 3. 16. The apparatus of claim 10 , wherein: the slider comprises first and second opposing edge surfaces between the media-facing surface and the upper surface; a first end portion of the interposer is parallel to the first edge surface; and a second end portion of the interposer is parallel to the second edge surface. 17. The apparatus of claim 10 , wherein one or more portions of the interposer extend over the upper surface of the slider. 18. The apparatus of claim 10 , wherein the interposer is attached to the trailing edge of the slider via solder between the interposer pads and the bond pads.
where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title
Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive (G11B5/484 takes precedence; details of head housings or structures G11B5/10, G11B5/127; adjustment relative to the record carrier G11B5/56) · CPC title
Constructional details of the electrical connection between head and arm · CPC title
using thermal means · CPC title
Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title
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