Biometric recognition apparatus with reflection-shielding electrode

Patent metadata

Field	Value
Publication number	US-9785822-B2
Application number	US-201615147502-A
Country	US
Kind code	B2
Filing date	May 5, 2016
Priority date	May 21, 2015
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A biometric recognition apparatus with reflection-shielding electrode includes a substrate, a sensing electrode layer arranged on one side of the substrate, the sensing electrode layer including a plurality of sensing electrodes and at least one suppressing electrode. The biometric recognition apparatus further includes a plurality of selection switches and conductive wires, at least a part of the selection switches and the conductive wires are electrically connected to the sensing electrodes. The biometric recognition apparatus further includes a reflection-shielding electrode layer with at least one reflection-shielding electrode and arranged on one side of the sensing electrode layer. By incorporating the reflection-shielding electrode and the suppressing electrode, the sensing sensibility and signal to noise ration can be enhanced, thus increasing the sensing distance between sensing electrode and user finger.

First claim

What is claimed is:

1. A biometric recognition apparatus with reflection-shielding electrode, comprising:
a substrate;
a sensing electrode layer arranged on one side of the substrate, the sensing electrode layer comprising a plurality of sensing electrodes and at least one suppressing electrode;
a plurality of selection switches and conductive wires, at least a part of the selection switches and a part of the conductive wires electrically connected to the corresponding sensing electrodes;
a reflection-shielding electrode layer arranged on one side of the sensing electrode layer, the reflection-shielding electrode layer having at least one reflection-shielding electrode.

2. The biometric recognition apparatus in claim 1 , wherein each of the sensing electrodes is surrounded by the suppressing electrode and has a gap with the suppressing electrode.

3. The biometric recognition apparatus in claim 1 , wherein the selection switches are arranged into a plurality of switch sets, each of the selection switches in one switch set is corresponding to at least one of the sensing electrodes.

4. The biometric recognition apparatus in claim 3 , wherein each of the conductive wires electrically couples to at least one of the switch sets.

5. The biometric recognition apparatus in claim 1 , further comprising an insulating layer arranged between the sensing electrode layer and the reflection-shielding electrode layer.

6. The biometric recognition apparatus in claim 1 , wherein the selection switches and the conductive wires are arranged on one side of the reflection-shielding electrode layer and away from the sensing electrode layer; the biometric recognition apparatus further comprises an insulating layer arranged between the reflection-shielding electrode layer and the selection switches.

7. The biometric recognition apparatus in claim 1 , wherein the selection switches and the conductive wires are arranged on the reflection-shielding electrode layer.

8. The biometric recognition apparatus in claim 1 , wherein the selection switch is field effect transistor (FET) switch.

9. The biometric recognition apparatus in claim 8 , wherein the FET switch is arranged on the substrate.

10. The biometric recognition apparatus in claim 9 , further comprising a biometric controller formed atop the substrate.

11. The biometric recognition apparatus in claim 1 , wherein the selection switch is thin film transistor (TFT) switch.

12. The biometric recognition apparatus in claim 11 , wherein the TFT switch is arranged on the substrate.

13. The biometric recognition apparatus in claim 1 , further comprising a biometric controller packaged into an integrated circuit (IC) chip, the IC chip is bonded or press-welded on the substrate.

14. The biometric recognition apparatus in claim 1 , further comprising a biometric controller packaged into an integrated circuit (IC) chip, the IC chip is bonded or press-welded on a circuit board and the IC chip electrically connects with the substrate through a flexible circuit board.

15. The biometric recognition apparatus in claim 1 , wherein the substrate is made from glass, polymer thin film, metal, silicon or silicon compound.

16. The biometric recognition apparatus in claim 1 , wherein the sensing electrode is of circular, rhombic, square, rectangular or polygonal shape.

17. A sensing method for a biometric recognition apparatus, the biometric recognition apparatus comprising a plurality of sensing electrodes, at least one suppressing electrode, at least one reflection-shielding electrode, a plurality of selection switches and at least one signal processing circuit, the method comprising:
controlling the selection switches to sequentially or randomly set at least one of the sensing electrode as a detecting electrode;
generating a periodic or non-periodic fingerprint sensing signal and sending the fingerprint sensing signal to the selected detecting electrode to generate a sensed signal;
using the signal processing circuit to process the sensed signal into a reflection-deflection signal having a same phase with the sensed signal and coupling the reflection-deflection signal to the at least one reflection-shielding electrode; and
coupling a suppressing signal to the suppressing electrode.

18. The method in claim 17 , wherein the suppressing signal is generated by processing the sensed signal with another signal processing circuit and has inverted phase with the sensed signal.

19. The method in claim 17 , wherein the suppressing signal is a predetermined-level signal.

20. The method in claim 17 , further comprising: periodically or randomly coupling predetermined-level signals to the sensing electrodes, the reflection-shielding electrode and the suppressing electrode.

Assignees

• Superc Touch Corp

Inventors

• Lee Hsiang-Yu
• Chin Shang
• Lin Ping-Tsun

Classifications

• H03K2217/96023

  Details of electro-mechanic connections between different elements, e.g.: sensing plate and integrated circuit containing electronics · CPC title

• H03K17/9622 Primary

  using a plurality of detectors, e.g. keyboard · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H03K2217/960765

  Details of shielding arrangements · CPC title