Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

Patent metadata

Field	Value
Publication number	US-9784605-B2
Application number	US-201214407730-A
Country	US
Kind code	B2
Filing date	Jun 15, 2012
Priority date	Jun 15, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package ( 400 ) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing ( 302 ) having an inlet trench ( 351 ), a bypass passage trench on frontside ( 332 ), an outlet trench ( 353 ), and the like are formed through resin molding, and an outer circumferential surface of the circuit package ( 400 ) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package ( 400 ) to the housing ( 302 ).

First claim

The invention claimed is:

1. A thermal flow meter comprising:
an external connector;
a measuring portion including a first resin having a first thermal expansion coefficient forming integratedly parts of an air flow sensing portion and a connection terminal of the thermal flow meter, and a second resin having a second thermal expansion coefficient different from the first thermal expansion coefficient forming a housing having a bypass passage trench and a fixing portion, the first resin being fixed by the fixing portion to the housing when forming the housing having the bypass passage trench and the fixing portion with the second resin, the fixing portion comprising a band-shaped fixation surface along a flow axis of the measurement target gas and a fixation surface across the flow axis of the measurement target gas; and
a flange disposed between the external connector and the measuring portion to fix the thermal flow meter to an intake body.

2. The thermal flow meter of claim 1 , wherein
a circuit package includes a first exposure portion and a second exposure portion that are exposed from the second resin, and
the first exposure portion and the second exposure portion are separated by the first fixing portion.

3. The thermal flow meter of claim 1 , wherein
a circuit package includes a temperature detection element and a processing unit for processing signals from the temperature detection element and the semiconductor device.

4. The thermal flow meter of claim 3 , wherein
the circuit package further includes a main body package provided with the processing unit and a protrusion from the main body package, and the temperature detection element is arranged at the protrusion.

5. The thermal flow meter of claim 4 , wherein
the housing includes an external terminal, an upstream-side outer wall, and a downstream-side outer wall, and the fixing portion is formed integrally with the upstream-side outer wall.

6. The thermal flow meter of claim 5 , wherein
the fixing portion is provided with a hollow formed along an axis that connects a front side and a back side of the housing.

7. The thermal flow meter of claim 1 , wherein
the fixing portion is formed in a thin band shape.

8. The thermal flow meter of claim 7 , wherein
a circuit package is fixed to the housing only by the portion.

9. The thermal flow meter of claim 1 , wherein
the bypass passage trench is formed in both a front side and a back side of the housing,
an inlet port is formed in a front side or a back side of the bypass passage trench,
an outlet port is formed on a side of the bypass passage trench other than the side in which the inlet port is formed, and
the front side and the back side of the bypass passage are connected to each other.

10. The thermal flow meter of claim 9 , further comprising a cover mounted on the housing, wherein
a bypass passage is formed by the cover and the bypass passage trench.

11. The thermal flow meter of claim 1 , wherein
the bypass passage trench is formed in one of the front side and back side of the housing.

12. The thermal flow meter of claim 11 , wherein
measurement surface is provided inside the bypass passage trench,
a cover facing the measurement surface has a protrusion to the inside of the bypass passage trench to face the heat transfer surface,
an orifice portion is formed in the bypass passage by the protrusion, and
the heat transfer surface is arranged in the orifice portion.

13. The thermal flow meter of claim 12 , wherein
the bypass passage is formed by covering the bypass passage trench with a cover, and
a flow path for a target gas along the measurement surface is formed by the cover and the measurement surface.

14. The thermal flow meter of claim 12 , wherein
a bypass passage is formed by covering the bypass passage trench with a cover, and
the bypass passage is provided with a flow path for a target gas.

15. The thermal flow meter of claim 1 , wherein
a surface of a circuit package enveloped by the fixing portion is provided with a plurality of hollows having a depth of 10 μm or larger.

16. The thermal flow meter of claim 1 , wherein
a circuit package is provided with a plurality of hollows having a depth of 10 μm or larger and 20 μm or smaller.

17. The thermal flow meter of claim 1 , wherein
a surface of a circuit package is provided with a plurality of hollows having a depth of 10 μm or larger and 1000 μm or smaller.

18. The thermal flow meter of claim 1 , wherein
an air flow sensing portion is embedded in a circuit package and has a diaphragm,
a flow rate is measured using the heat transfer surface, which is provided on a surface of the diaphragm,
a gap is provided in a rear surface of the diaphragm, and
the gap is connected to an opening provided on the surface of the circuit package through a communication hole provided inside the circuit package.

19. The thermal flow meter of claim 1 , wherein
a circuit package is embedded with a plate having a communication hole.

20. The thermal flow meter of claim 19 , wherein
the circuit package is embedded with a plate having the communication hole and a diaphragm mounted on the plate.

21. The thermal flow meter of claim 1 , wherein
a circuit package has a first side part with a flow sensor and a second side part opposite to the first side part, wherein the both side parts are molded by the first resin having the first thermal expansion coefficient, and
the housing envelops the circuit package and is formed by the second resin having the second thermal expansion coefficient, and
the housing has a penetration region where the second side part is exposed.

22. A thermal flow meter of claim 1 , wherein
a circuit package further includes a temperature detector.

23. The thermal flow meter of claim 22 , wherein
the circuit package has a protrusion on which the temperature detector is disposed.

24. The thermal flow meter of claim 1 , further including a cover mounted on the housing, wherein
the housing has a bypass passage wall that constitutes a bypass passage by engaging the cover.

25. An air detector having a thermal flow meter according to claim 1 .

Assignees

• Tokuyasu Noboru
• Tashiro Shinobu
• Hanzawa Keiji
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira
• Hitachi Automotive Systems Ltd

Inventors

• Tokuyasu Noboru
• Tashiro Shinobu
• Hanzawa Keiji
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• G01F15/14

  Casings, e.g. of special material · CPC title

• G01F1/6965

  comprising means to store calibration data for flow signal calculation or correction · CPC title

• G01F1/692

  Thin-film arrangements · CPC title

• G01F1/6845

  Micromachined devices · CPC title

• G01F1/6842 Primary

  with means for influencing the fluid flow · CPC title