Thick film paste and use thereof

Patent metadata

Field	Value
Publication number	US-9783874-B2
Application number	US-201213532903-A
Country	US
Kind code	B2
Filing date	Jun 26, 2012
Priority date	Jun 30, 2011
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO 2 , RuO 2 , Rh 2 O 3 , IrO 2 , Cu 2 O, CuO, TiO 2 , ZrO 2 , PbO, SnO 2 , CeO 2 , Al 2 O 3 , MgO, MnO 2 and MoO 2 , and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO 2 , RuO 2 , Rh 2 O 3 , IrO 2 , Cu 2 O, CuO, TiO 2 , ZrO 2 , PbO, SnO 2 , CeO 2 , Al 2 O 3 , MgO, MnO 2 and MoO 2 .

First claim

What is claimed is:

1. A thick film paste comprising inorganic constituents that consist of: at least one particulate platinum (alloy), at least one metal compound, and, optionally, at least one particulate platinum (alloy)/metal oxide composite; and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO2, RuO2, Rh2O3, IrO2, Cu20, CuO, TiO2, ZrO2, PbO, SnO2, Al2O3, MgO, MnO2 and MoO2, and the proportion of the at least one metal compound in the thick film paste is 0.001 to 1 wt. %, based on the total thick film paste composition, and wherein the thick film paste is capable of being fired to form an electrically conductive metallization that is electrically connected with an electrode on a ceramic sensor substrate.

2. The thick film paste of claim 1 , wherein the at least one particulate platinum (alloy) powder comprises spherical-shaped platinum (alloy) powder.

3. The thick film paste of claim 1 , wherein the inorganic constituents consist of: the at least one particulate platinum (alloy), the at least one metal compound, and the at least one particulate platinum (alloy)/metal oxide composite.

4. The thick film paste of claim 3 , wherein the total proportion of the at least one particulate platinum (alloy) plus the at least one particulate platinum (alloy)/metal oxide composite in the thick film paste is 84 to 95 wt. %, based on total thick film paste composition.

5. The thick film paste of claim 3 , wherein the at least one particulate platinum (alloy)/metal oxide composite has a weight ratio of elemental platinum plus optionally present alloying metal(s):metal oxide of 100:1 to 1000:1.

6. The thick film paste of claim 3 , wherein the metal oxide of the at least one particulate platinum (alloy)/metal oxide composite is selected from the group consisting of NiO, SiO 2 , RuO 2 , Rh 2 O 3 , IrO 2 , Cu 2 O, CuO, TiO 2 , ZrO 2 , PbO, SnO 2 , CeO 2 , Al 2 O 3 , MgO, MnO 2 and MoO 2 .

7. The thick film paste of claim 3 , wherein the weight ratio of particulate platinum (alloy):particulate platinum (alloy)/metal oxide composite is in the range of 20:80 to 99.9:0.1.

8. The thick film paste of claim 1 , wherein “platinum (alloy)” is elemental platinum without an alloyed metal.

9. The thick film paste of claim 1 , wherein the organic vehicle content is in the range of 4.9 to 15.9 wt. %.

10. A method for the manufacture of electrically conductive metallizations of sensors comprising the steps:
(1) applying the thick film paste of claim 1 to a sensor substrate which is provided with an electrode,
(2) drying the thick film paste so applied, and
(3) firing the dried thick film paste to form an electrically conductive metallization on the sensor substrate, wherein the metallization is electrically connected with the electrode on the sensor substrate.

11. The method of claim 10 , wherein firing is performed for a period of 16 to 24 hours with the sensor substrate reaching a peak temperature in the range of 1200 to 1350° C.

12. The method of claim 10 , wherein the step sequence (1) to (3) is repeated 1 to 4 times.

13. The thick film paste of claim 1 , wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO 2 , RuO2, Rh2O3, IrO2, TiO2, ZrO2, PbO, SnO2, Al2O3, MgO, MnO2 and MoO 2 .

14. The thick film paste of claim 1 , wherein the particles of the at least one metal compound have a surface area of 1 to 25 m 2 /g, as measured by the BET method.

15. The thick film paste of claim 1 , wherein the at least one metal compound is selected from the group consisting of in each case particulate RuO2, TiO 2 , ZrO 2 , MgO, MnO 2 .

16. The thick film paste of claim 15 , wherein the particles of the at least one metal compound have a surface area of 1 to 25 m 2 /g, as measured by the BET method.

Assignees

• Glicksman Howard David
• Pliscott Adele Amelia
• Du Pont

Inventors

• Glicksman Howard David
• Pliscott Adele Amelia

Classifications

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H05K3/1291

  Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets · CPC title

• H05K3/1216

  by screen printing or stencil printing · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title