Addition-curable silicone resin composition, addition-curable silicone resin cured product, and sealed optical semiconductor element

Patent metadata

Field	Value
Publication number	US-9783717-B2
Application number	US-201414911412-A
Country	US
Kind code	B2
Filing date	Jun 27, 2014
Priority date	Aug 19, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The invention aims to provide an addition curable silicone resin composition with excellent interfacial adhesion properties, storage stability and transparency. The addition curable silicone resin mixtures has a refractive index of 1.35 to 1.45 and includes a silicone compound having at least one group of the following formula:

First claim

The invention claimed is:

1. An addition-curable silicone resin composition comprising:
an addition-curable silicone resin mixture; and
an adhesion-imparting agent,
the addition-curable silicone resin mixture having a refractive index of 135 to 1.45,
the adhesion-imparting agent including a compound that includes a structural unit represented by the formula (1-3) and/or a structural unit represented by the formula (1-4) between a structural unit represented by the formula (1-1) and a structural unit represented by the formula (1-2), the compound having a refractive index of 1.35 to 1.45:

wherein R 1a 's in the formulas (1-1) and (1-2) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; R 1b 's in the formulas (1-3) and (1-4) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; m in the formula (1-3) is an integer of 1 to 50; n in the formula (1-4) is an integer of 1 to 1500; and A's in the formulas (1-1) to (1-3) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or a group represented by the formula (2), provided that at least one of A's in the formulas (1-1) to (1-3) is a group represented by the formula (2):

wherein R 2a represents a C1-C8 alkylene group in which a carbon atom other than a carbon atom bonded to a silicon atom is optionally partially substituted with an oxygen atom; R 2b 's each independently represent a C1-C3 alkylene group; R 3 's each independently represent a C1-C3 alkylene group; R 4 's each independently represent a hydrogen atom, a C1-C3 alkyl group, an OH group-containing C1-C3 alkyl group, or a halogeno group; and x is an integer of 0 to 2.

2. The addition-curable silicone resin composition according to claim 1 ,
wherein, in the formula (2), R 3 represents methylene and R 4 's each independently represent a hydrogen atom or hydroxymethyl.

3. The addition-curable silicone resin composition according to claim 1 ,
wherein the adhesion-imparting agent is contained in an amount of 0.01% to 15% by mass.

4. The addition-curable silicone resin composition according to claim 1 ,
wherein the addition-curable silicone resin mixture comprises a polyorganosiloxane having at least two substituents each containing a carbon-carbon double bond that is bonded to a silicon atom, a polyorganohydrogensiloxane having at least two hydrogen atoms each bonded to a silicon atom, and a hydrosilylation reaction catalyst.

5. The addition-curable silicone resin composition according to claim 1 ,
wherein the substituents each containing a carbon-carbon double bond that is bonded to a silicon atom, in the polyorganosiloxane, are vinyl.

6. An addition-curable silicone resin cured product prepared by curing the addition-curable silicone resin composition according to claim 1 .

7. A sealed optical semiconductor element in which an optical semiconductor device is sealed with the addition-curable silicone resin cured product according to claim 6 .

Assignees

• Sumitomo Seika Chemicals

Inventors

• Fukuda Noriaki
• SANADA Shohei
• Yamamoto Katsumasa

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C09K2003/1059

  Heat-curable materials · CPC title

• H01L33/56

  Electricity · mapped topic

• C09J183/08

  containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen · CPC title