Fall impact reducing apparatus for chip component and wire jig

US9783374B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9783374-B2
Application numberUS-201615192467-A
CountryUS
Kind codeB2
Filing dateJun 24, 2016
Priority dateDec 26, 2013
Publication dateOct 10, 2017
Grant dateOct 10, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.

First claim

Opening claim text (preview).

The invention claimed is: 1. A fall impact reducing apparatus for reducing an impact on a falling chip component, the fall impact reducing apparatus comprising a wire assembly formed by stacking a plurality of wire jigs, and each of the wire jigs including a plurality of wires arranged parallel to each other at intervals which allows the chip component to pass through the plurality of wires, and each of the wire jigs being formed of an integral body by working a base material having a predetermined thickness, the integral body being constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. 2. The fall impact reducing apparatus according to claim 1 , wherein each of the wire jigs is formed by etching a metal plate. 3. The fall impact reducing apparatus according to claim 1 , wherein the wires are arranged in a slackened state by fixing the frame portions of each of the wire jigs to support members which are arranged in a spaced-apart manner with a predetermined distance therebetween in a length direction of the wires. 4. The fall impact reducing apparatus according to claim 1 , wherein the wires extending between the frame portions of each of the wire jigs are formed into a curved or bent shape in a plane direction of the base material. 5. The fall impact reducing apparatus according to claim 1 , wherein a predetermined gap is formed between the wire jigs by stacking the plurality of wire jigs with a spacer between the frame portions, and by fastening the frame portions and the spacer to each other using a fastening jig. 6. The fall impact reducing apparatus according to claim 1 , wherein an elongated hole extending in a direction orthogonal to a length direction of the wires is formed in the frame portions of each of the wire jigs, and positions of the wires of any pair of upper and lower wire jigs are displaced from each other in a direction orthogonal to the length direction of the wires by inserting a fastening jig into the elongated hole at the time of fastening the frame portions to a support member using the fastening jig. 7. The fall impact reducing apparatus according to claim 1 , wherein a plurality of insertion holes arranged in a direction orthogonal to a length direction of the wires are formed in the frame portions of each of the wire jigs, and positions of the wires of any pair of upper and lower wire jigs are displaced from each other in a direction orthogonal to the length direction of the wires by inserting a fastening jig into any one of the plurality of insertion holes at the time of fastening the frame portions to a support member using the fastening jig. 8. A wire jig used in a fall impact reducing apparatus for reducing an impact on a falling chip component, the wire jig comprising a plurality of wires arranged parallel to each other at intervals which allow the chip component to pass through the plurality of wires, and an integral body formed by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. 9. The fall impact reducing apparatus according to claim 1 , wherein the plurality of wires are arranged to directly contact the falling chip component. 10. The fall impact reducing apparatus according to claim 8 , wherein the plurality of wires are arranged to directly contact the falling chip component.

Assignees

Inventors

Classifications

  • Impact protection · CPC title

  • Soft elements to prevent damage to articles, e.g. bristles, foam · CPC title

  • for preventing breakage, pulverisation or damage to materials · CPC title

  • B65G47/52Primary

    Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices (loading or unloading by means not incorporated in, or not operatively associated with, conveyors B65G65/00; transfer of workpieces during metal rolling B21B41/00) · CPC title

  • for articles · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9783374B2 cover?
A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification B65G47/52. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).