Method for manufacturing a three dimensional stretchable electronic device

Patent metadata

Field	Value
Publication number	US-9782940-B2
Application number	US-201514596073-A
Country	US
Kind code	B2
Filing date	Jan 13, 2015
Priority date	Oct 17, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

First claim

The invention claimed is:

1. A manufacturing method of a three-dimensional stretchable electronic device, comprising:
(1) preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof;
(2) inserting a wire into the aluminum mold to form a path for a connection line for connecting the protrusions of the substrate using a wire;
(3) introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold, semi-curing the first polymer, introducing a second polymer having lower hardness than the first polymer into a remaining portion of the aluminum mold, and curing the second polymer, thus forming a three-dimensional stretchable substrate having the wire in the aluminum mold;
(4) removing the wire from the path for the connection line formed in the three-dimensional stretchable substrate and the three-dimensional stretchable substrate from the aluminum mold;
(5) injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and
(6) transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

2. The manufacturing method of claim 1 , wherein a surface of the aluminum mold is coated with Teflon™.

3. The manufacturing method of claim 1 , wherein the wire has a diameter of 200 to 300 μm.

4. The manufacturing method of claim 1 , wherein the first polymer and the second polymer introduced into the aluminum mold in the Step (2) comprise one or more selected from the group consisting of PDMS (poly-dimethyl siloxane), Ecoflex®, PVA (poly-vinyl alcohol) and Dragon Skin® 10 SLOW.

5. The manufacturing method of claim 4 , wherein the first polymer introduced into inner recesses of the aluminum mold is PDMS, and the second polymer introduced into the remaining portion of the aluminum mold is a mixture of PDMS and Ecoflex®.

6. The manufacturing method of claim 5 , wherein the mixture of PDMS and Ecoflex® has a mass ratio of 5:5 to 2:8.

7. The manufacturing method of claim 1 , wherein in the Step (6), the elements are transferred to both sides of the three-dimensional stretchable substrate.

Assignees

• Univ Korea Res & Bus Found

Inventors

• Ha Jeong Sook
• Yoon Jangyeol
• Lim Yein
• Hong Sooyeong

Classifications

• H05K1/036

  Multilayers with layers of different types · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title

• H05K2201/09118

  Moulded substrate · CPC title