Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Patent metadata

Field	Value
Publication number	US-9781325-B1
Application number	US-201715473573-A
Country	US
Kind code	B1
Filing date	Mar 29, 2017
Priority date	Mar 12, 2016
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

First claim

What is claimed is:

1. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses, comprising:
at least a circuit board having one or more electronic elements electrically coupled at said circuit board;
at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area, wherein one or more connecting elements are electrically connected to said two non-photosensitive areas of said two photosensitive units and said circuit board; and
a molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said molded base is molded to have a flat top side adapted for installing the optical lenses thereon locating along said two photosensitive paths of said photosensitive units respectively such that said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively, wherein said molded base comprises at least two outer annular bodies molded on said circuit board to encircle said at least two photosensitive units respectively and at least a connecting body integrally extended between said at least two outer annular bodies, wherein said at least two optical window are defined at said at least two outer annular bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively, wherein said top side of said molded base is molded to have at least one flat outer lateral top surface and at least one flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base; and
at least one light filter, which is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said optical window and said photosensitive unit, wherein said light filter, said molded base and said circuit board form a sealed enclosure for said photosensitive unit.

2. The molded photosensitive assembly, as recited in claim 1 , wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said respective inner lateral top surface and said respective outer lateral top surface for blocking adhesive applied on said outer lateral top surface of said molded base to adhere the respective optical lens from entering into said inner lateral top surface.

3. The molded photosensitive assembly, as recited in claim 1 , further comprising an enclosing film provided at a mold engaging surface of said circuit board that is substantially the surface being molded by said molded base on said circuit board, so that when a first mold body and a second mold body are coupled with each other in a mold closing state, said enclosing film is sandwiched between said mold engaging surface of said first mold body and said circuit board to prevent said first mold body from direct contacting with said circuit board so as to provide a buffering and sealing effect between said mold engaging surface and said circuit board to ensure a sealing engagement that prevents a fluid state mold material flowing to said coupling areas of said circuit board and ensures a flatness of said coupling areas of said circuit board.

4. The molded photosensitive assembly, as recited in claim 1 , wherein said circuit board has at least a receiving chamber and said photosensitive unit is received in said receiving chamber.

5. The molded photosensitive assembly, as recited in claim 1 , wherein said molded base is formed by a molding process, wherein said molded base is formed by a molding process, wherein, firstly, said circuit board with said electronic element thereon is disposed in a mold, secondly, said mold is operated to couple a first mold body and a second mold body with each other that a mold cavity is formed at a peripheral portion and a center portion of said circuit board between said first mold body and said second mold body, and, thirdly, a mold material in fluid state is intruded into said mold cavity, wherein when said mold material is solidified, said molded base with said optical window is formed.

6. A The molded photosensitive assembly, as recited in claim 2 , further comprising an enclosing film provided at a mold engaging surface of said circuit board that is substantially the surface being molded by said molded base on said circuit board, so that when a first mold body and a second mold body are coupled with each other in a mold closing state to form said molded base, said enclosing film is sandwiched between said mold engaging surface of said first mold body and said circuit board to prevent said first mold body from direct contacting with said circuit board so as to provide a buffering and sealing effect between said mold engaging surface and said circuit board to ensure a sealing engagement that prevents a fluid state mold material flowing to said coupling areas of said circuit board and ensures a flatness of said coupling areas of said circuit board.

7. The molded photosensitive assembly, as recited in claim 6 , wherein said circuit board has at least a receiving chamber and said photosensitive unit is received in said receiving chamber.

8. The molded photosensitive assembly, as recited in claim 7 , wherein said receiving chamber is a receiving through hole and said photosensitive unit is disposed in aid receiving chamber, wherein said circuit board further comprises an reinforcing layer coupled at a bottom side of said circuit board.

9. The molded photosensitive assembly, as recited in claim 8 , wherein said molded base is formed by a molding process, wherein said molded base is formed by a molding process, wherein, firstly, said circuit board with said electronic element thereon is disposed in a mold, secondly, said mold is operated to couple a first mold body and a second mold body with each other that a mold cavity is formed at a peripheral portion and a center portion of said circuit board between said first mold body and said second mold body, and, thirdly, a mold material in fluid state is intruded into said mold cavity, wherein when said mold material is solidified, said molded base with said optical window is formed.

10. The molded photosensitive assembly, as recited in claim 6 , wherein said molded base is formed by a molding process, wherein said molded base is formed by a molding process, wherein, firstly, said circuit board with said electronic element thereon is disposed in a mold, secondly, said mold is operated to couple a first mold body and a second mold body with each other that a mold cavity is formed at a peripheral portion and a center portion of said circuit board between said first mold body and said second mold body, and, thirdly, a mold material in fluid state is intruded into said mold cavity, wherein when said mold material is solidified, said molded base with said optical window is formed.

11. The molded photosensitive assembly, as recited in

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Guo Nan
• Chen Zhenyu
• Jiang Heng
• Luan Zhongyu
• Xi Fengsheng
• Chen Feifan
• Ding Liang

Classifications

• H10W90/00

  Package configurations · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title