Method for manufacturing magnet-conductive device and glue-injectable punch structure thereof

US9780629B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9780629-B2
Application numberUS-201414200174-A
CountryUS
Kind codeB2
Filing dateMar 7, 2014
Priority dateMar 21, 2013
Publication dateOct 3, 2017
Grant dateOct 3, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates.

First claim

Opening claim text (preview).

What is claimed is: 1. A glue-injectable punch structure includes: a punch head for punching a plate having an accommodating cavity, an injection hole, and an inlet, wherein a supply channel is formed by the accommodating cavity, the injection hole and the inlet; and a control member having a plug portion and a contact portion connected to the plug portion, the plug portion is disposed at the accommodating cavity, the contact portion is movably disposed at the injection hole, and the control member selectively obstructs the supply channel or permits the supply channel into conduction, wherein the punch head further comprises a surface, the inlet is recessed to the surface, and the contact portion of the control member protrudes from the surface, wherein the punch head further comprises a riveting protrusion disposed at the surface of the punch head, the riveting protrusion comprises a touching surface and an outlet communicated with the injection hole, the contact portion of the control member comprises a contact surface, wherein a first interval is formed between the contact surface and the surface, a second interval is formed between the touching surface and the surface, and the first interval is larger than the second interval. 2. The glue-injectable punch structure in accordance with claim 1 further includes an elastic member and a blocking member, the elastic member is disposed at the accommodating cavity and contacts against the control member, the blocking member is disposed at the accommodating cavity, and the elastic member comprises a first end portion and a second end portion, the first end portion contacts against the control member, the second end portion contacts against the blocking member, and the elastic member is located between the blocking member and the control member. 3. The glue-injectable punch structure in accordance with claim 1 further includes a seal ring, the control member comprises an outer lateral wall, the accommodating cavity comprises an inner lateral wall, and the seal ring contacts against the outer lateral wall and the inner lateral wall.

Assignees

Inventors

Classifications

  • H02K15/02Primary

    of stator or rotor bodies · CPC title

  • Magnetic cores comprising laminations characterised by being fastened by caulking · CPC title

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What does patent US9780629B2 cover?
A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the i…
Who is the assignee on this patent?
Metal Ind Res & Dev Ct
What technology area does this patent fall under?
Primary CPC classification H02K15/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).