Component mounting method

Patent metadata

Field	Value
Publication number	US-9780514-B2
Application number	US-201314422512-A
Country	US
Kind code	B2
Filing date	Aug 16, 2013
Priority date	Aug 22, 2012
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

First claim

The invention claimed is:

1. A component mounting method operatively associated with a component mounting device said component mounting method comprising: a component loading operation unit that performs an operation for loading components on a substrate, a first component crimping operation unit and a second component crimping operation unit that are disposed at positions pinching the component loading operation unit from both sides and crimp the component loaded by the component loading operation unit on the substrate where the operation for loading the component is performed by the component loading operation unit, a first substrate transport unit disposed to be movable in a horizontal direction between the component loading operation unit and the first component crimping operation unit, and a second substrate transport unit disposed to be movable in the horizontal direction between the component loading operation unit and the second component crimping operation unit,
a step of crimping one of the components on the substrate by the first component crimping operation unit by transporting the substrate in a state of remaining placed on a substrate placement stage to the first component crimping operation unit by moving the first substrate transport unit to the first component crimping operation unit side after transporting the substrate to the component loading operation unit in a state where the substrate is placed on the substrate placement stage of the first substrate transport unit and performing the operation for loading the component on the substrate by the component loading operation unit; and
a step of crimping one of the components on the substrate by the second component crimping operation unit by transporting the substrate in a state of remaining placed on the substrate placement stage to the second component crimping operation unit by moving the second substrate transport unit to the second component crimping operation unit side after transporting the substrate to the component loading operation unit in a state where the substrate is placed on the substrate placement stage of the second substrate transport unit and performing the operation for loading the component on the substrate by using the component loading operation unit.

2. The component mounting method according to claim 1 further comprising:
an information acquiring step of acquiring information relating to a position of the substrate by recognizing the substrate that is placed on the substrate placement stage;
a first substrate positioning step of performing positioning of the substrate with respect to the component loading operation unit by moving the substrate placement stage based on the information that is acquired in the information acquiring step; and
a second substrate positioning step of performing the positioning of the substrate with respect to the first component crimping operation unit by moving the substrate placement stage to the first component crimping operation unit after the loading operation and moving the substrate placement stage based on the information that is acquired in the information acquiring step.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Mimura Yoshihiro
• Hamada Ryuji
• Kameda Akira

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07323

  Active alignment, e.g. using optical alignment using marks or sensors · CPC title