Socket contact techniques and configurations

Patent metadata

Field	Value
Publication number	US-9780510-B2
Application number	US-201414764931-A
Country	US
Kind code	B2
Filing date	Sep 26, 2014
Priority date	Sep 26, 2014
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a socket substrate having a first side and a second side disposed opposite to the first side;
a first opening formed through the socket substrate;
an electrical contact disposed in the first opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side;
a cover having a first side and a second side disposed opposite to the first side, the cover positioned on the first side of the socket substrate;
a spring to maintain the cover at a distance from the socket substrate in an unloaded state, and to compress and allow the cover to be pressed against the first side of the socket substrate in a loaded state; and
a second opening formed through the cover and configured to accommodate the cantilever portion such that a first portion of the cover is configured to contact the cantilever portion and a second portion of the cover serves as a barrier to prevent overdeflection of the cantilever portion when loading a die package on the cover, the second portion of the cover to contact a portion of the electrical contact other than the cantilever portion to prevent overdeflection of the cantilever portion.

2. The apparatus of claim 1 , wherein the cover includes:
alignment features to facilitate alignment between the cover and the socket substrate; and
alignment features to facilitate alignment between the cover and the die package.

3. The apparatus of claim 1 , wherein the cover is composed of a unitary, molded body of polymer.

4. The apparatus of claim 1 , wherein the first side and surfaces of the socket substrate in the first opening are plated with a metal.

5. A method comprising:
providing a socket assembly including:
a socket substrate having a first side and a second side disposed opposite to the first side,
a first opening formed through the socket substrate,
an electrical contact disposed in the first opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side,
a cover having a first side and a second side disposed opposite to the first side,
a spring to maintain a distance between the cover and the socket substrate in an unloaded state; and
a second opening formed through the cover and configured to accommodate the cantilever portion such that a first portion of the cover is configured to contact the cantilever portion and a second portion of the cover serves as a barrier to prevent overdeflection of the cantilever portion when loading a die package on the cover, the second portion of the cover to contact a portion of the electrical contact other than the cantilever portion to prevent overdeflection of the cantilever portion; and

coupling the electrical contact with a circuit board by transitioning to a loaded state via compressing the spring and allowing the cover to be pressed against the socket substrate, wherein the electrical contact is configured to electrically couple with a die package.

6. The method of claim 5 , wherein the cover includes:
alignment features to facilitate alignment between the cover and the socket substrate; and
alignment features to facilitate alignment between the cover and the die package.

7. The method of claim 5 , wherein the cover is composed of a unitary, molded body of polymer.

8. The method of claim 5 , wherein the first side and surfaces of the socket substrate in the first opening are plated with a metal.

9. The method of claim 5 , further comprising:
coupling the die package with the electrical contact.

10. The apparatus of claim 1 , wherein the spring includes a spring structure.

11. The apparatus of claim 1 , wherein the spring includes the cantilever portion of the electrical contact.

Assignees

• Intel Corp

Inventors

• Athreya Dhanya
• Chawla Gaurav
• Aygun Kemal
• Gordon Glen P
• Canny Sarah M
• Smalley Jeffory L
• Nekkanty Srikant
• Garcia Michael
• Heppner Joshua D

Classifications

• H10W78/00 Primary

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/644

  Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads · CPC title

• H01L23/32

  Electricity · mapped topic

• H01R33/7685 Primary

  having internal socket contact by abutting · CPC title