Methods of manufacturing electronic display devices employing nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances
US-9224952-B2 · Dec 29, 2015 · US
US9780306B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9780306-B2 |
| Application number | US-201414557493-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 2, 2014 |
| Priority date | Nov 28, 2007 |
| Publication date | Oct 3, 2017 |
| Grant date | Oct 3, 2017 |
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This invention relates to a supported polymer heterostructure and methods of manufacture. The heterostructure is suitable for use in a range of applications which require semiconductor devices, including photovoltaic devices and light-emitting diodes.
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The invention claimed is: 1. A method of making a supported polymer heterostructure comprising an abrupt or diffuse interface, the method comprising the steps of: i) depositing on a substrate a first material and a phase control material and wherein the first material and the phase control material phase separate; ii) removing of the phase control material by a selective solvent; iii) crosslinking the remaining deposited first material; and iv) depositing a further material on at least the crosslinked deposited first material to form the supported polymer heterostructure, wherein the supported polymer heterostructure is a phase separated nanostructure with a length scale between 10 nm and 1000 nm. 2. The method of claim 1 , wherein the first material is a polymer. 3. The method of claim 2 , wherein the polymer is radiatively crosslinked. 4. The method of claim 2 , wherein the polymer is thermally crosslinked. 5. The method of claim 1 , wherein the phase control material comprises at least one of; a low molecular weight polymer, an oligomer, a polyelectrolyte, an ionomer, a solvent which does not dissolve the polymer. 6. The method of claim 1 , comprising a subsequent phase separation step. 7. The method of claim 6 , wherein the subsequent phase separation is self-aligned to the first determined pattern. 8. The method of claim 1 , wherein the substrate is pre-patterned. 9. The method of claim 1 , comprising the further steps of incorporating the supported heterostructure in a semiconductor device. 10. The method according to claim 1 , wherein the device is a photovoltaic device. 11. The method according to claim 1 , wherein the device is a light-emitting diode.
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