Molded LED light sheet

Patent metadata

Field	Value
Publication number	US-9780270-B2
Application number	US-201414292069-A
Country	US
Kind code	B2
Filing date	May 30, 2014
Priority date	Jun 4, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

An initially flat light sheet is formed by printing conductor layers and microscopic LEDs over a flexible substrate to connect the LEDs in parallel. The light sheet is then subjected to a molding process which forms 3-dimensional features in the light sheet, such as bumps of any shape. The features may be designed to create a desired light emission profile, increase light extraction, and/or create graphical images. In one embodiment, an integrated light sheet and touch sensor is formed, where the molded features convey touch positions of the sensor. In one embodiment, a curable resin is applied to the light sheet to fix the molded features. In another embodiment, optical features are molded over the flat light sheet. In another embodiment, each molded portion of the light sheet forms a separate part that is then singulated from the light sheet.

First claim

What is claimed is:

1. An illumination structure comprising:
a layer of light emitting diodes (LEDs) provided over a flexible substrate;
a first conductor layer and a second conductor layer sandwiching the LEDs to connect the LEDs in parallel,
the layer of LEDs, the first conductor layer, the second conductor layer, and the substrate comprising a flexible light sheet, wherein the LEDs are substantially randomly distributed on the first conductor layer; and
an array of repeated molded 3-dimensional features in the light sheet achieving an optical effect, the molded features forming first 3-dimensional features on one side of the flexible light sheet and opposite 3-dimensional features on a reverse side of the flexible light sheet, wherein the features are not aligned with the LEDs,
wherein portions of the light sheet that are distorted to have the 3-dimensional features contain a plurality of the LEDs, causing the LEDs within the 3-dimensional features to follow contours of the 3-dimensional features, such that the LEDs within the 3-dimensional features are not planar with respect to each other.

2. The structure of claim 1 wherein the features comprise a concave portion of the light sheet and an opposing convex portion of the light sheet.

3. The structure of claim 2 wherein light is emitted from the convex portion of the light sheet.

4. The structure of claim 2 wherein light is emitted from the concave portion of the light sheet.

5. The structure of claim 1 wherein an array of the features are formed by distorting the light sheet under pressure.

6. The structure of claim 1 wherein the features comprise bumps that widen a light emission profile of the light sheet.

7. The structure of claim 1 wherein the features comprise bumps that collimate light emitted by the light sheet.

8. The structure of claim 1 wherein the features comprise bumps that increase light extraction of the light sheet.

9. The structure of claim 1 wherein the features comprise a concave portion of the light sheet and an opposing convex portion of the light sheet, wherein the substrate is on the convex side and the layer of LEDs is on the concave side.

10. The structure of claim 1 wherein the features comprise a concave portion of the light sheet and an opposing convex portion of the light sheet, wherein the substrate is on the concave side and the layer of LEDs is on the convex side.

11. The structure of claim 1 wherein the features comprise a plurality of bumps formed in the light sheet.

12. The structure of claim 1 further comprising an opaque layer within the features, wherein the opaque layer is patterned to let light pass through openings in the opaque layer.

13. The structure of claim 12 wherein the openings form an alpha-numeric design.

14. The structure of claim 1 further comprising a capacitive touch sensor integrated with the light sheet.

15. The structure of claim 14 wherein the features correspond with touch sensor positions in the touch sensor.

16. The structure of claim 15 wherein the features identify the touch sensor positions.

17. The structure of claim 1 wherein the features are molded over the light sheet.

18. The structure of claim 1 further comprising a hardened material that covers at least a portion of the one or more features to retain a shape of the features.

19. A method for forming a light emitting structure comprising:
providing a layer of light emitting diodes (LEDs) over a flexible substrate;
providing a first conductor layer and a second conductor layer sandwiching the LEDs to connect the LEDs in parallel,
the layer of LEDs, the first conductor layer, the second conductor layer, and the substrate comprising a flexible light sheet, wherein the LEDs are substantially randomly distributed on the first conductor layer; and
distorting the light sheet by a mold to form 3-dimensional features in the light sheet to achieve an optical effect, the step of distorting the light sheet forming an array of repeated 3-dimensional features in the light sheet, the molded features forming first 3-dimensional features on one side of the flexible light sheet and opposite 3-dimensional features on a reverse side of the flexible light sheet, wherein the features are not aligned with the LEDs,
wherein portions of the light sheet that are distorted to have the 3-dimensional features contain a plurality of the LEDs, causing the LEDs within the 3-dimensional features to follow contours of the 3-dimensional features, such that the LEDs within the 3-dimensional features are not planar with respect to each other.

20. The method of claim 19 wherein the step of distorting the light sheet by the mold forms a concave portion of the light sheet and an opposing convex portion of the light sheet.

Assignees

• Nthdegree Tech Worldwide Inc

Inventors

• Kahrs Eric William
• Oraw Bradley Steven

Classifications

• F21K9/65

  specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts · CPC title

• F21V33/0052

  Audio or video equipment, e.g. televisions, telephones, cameras or computers; Remote control devices therefor · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/0753

  Electricity · mapped topic