Method of preparing quantum dot layer, QLED display device having the quantum dot layer and method of preparing the same

US9780257B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9780257-B1
Application numberUS-201615224234-A
CountryUS
Kind codeB1
Filing dateJul 29, 2016
Priority dateMar 16, 2016
Publication dateOct 3, 2017
Grant dateOct 3, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of preparing a quantum dot layer, including: placing an anodic aluminum oxide sheet with a plurality of through holes on a substrate; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of preparing a quantum dot light emitting diode display device, comprising: forming a hole transport layer; placing an anodic aluminum oxide sheet with a plurality of through holes on the hole transport layer, wherein a diameter of each through hole is larger than a thickness of a partition wall between any two adjacent through holes; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer on the hole transport layer. 2. The method according to claim 1 , before forming the hole transport layer, further comprising: providing a substrate; and forming an anode and a hole blocking layer on the substrate in that order. 3. The method according to claim 2 , after forming the quantum dot layer, further comprising: forming an electron transport layer, an electron blocking layer and a cathode on the quantum dot layer in that order. 4. A method of preparing a quantum dot light emitting diode display device, comprising: forming a hole transport layer; forming a protective layer on the hole transport layer; placing an anodic aluminum oxide sheet with a plurality of through holes on the protective layer, wherein a diameter of each through hole is larger than a thickness of a partition wall between any two adjacent through holes; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer on the protective layer. 5. The method according to claim 4 , wherein, the protective layer is one selected from p-type doping protective layer, n-type doping protective layer and anisotropic conductive layer. 6. The method according to claim 4 , before forming the hole transport layer, further comprising: providing a substrate; and forming an anode and a hole blocking layer on the substrate in that order. 7. The method according to claim 6 , after forming the quantum dot layer, further comprising: forming an electron transport layer, an electron blocking layer and a cathode on the quantum dot layer in that order. 8. A quantum dot light emitting diode display device, which is prepared by the method according to claim 7 . 9. The method according to claim 1 , wherein the anodic aluminum oxide sheet is removed by dissolution. 10. The method according to claim 9 , wherein the anodic aluminum oxide sheet is removed by being immersed in an acid or alkali solution of a low concentration. 11. The method according to claim 10 , wherein: the low concentration comprises a concentration range of from 5 wt. % to 10 wt. %; the acid solution is selected from hydrochloric acid solution or phosphoric acid solution; and the alkali solution is NaOH solution. 12. The method according to claim 1 , wherein the anodic aluminum oxide sheet is prepared by using a method comprising: S1. cleaning an aluminum sheet and placing the cleaned aluminum sheet into a first mixed solution to electropolish it; S2. placing the electropolished aluminum sheet into oxalic acid solution to conduct a first anodic oxidation, so as to form a first sheet; S3. placing the first sheet into a second mixed solution to conduct a water bath, so as to remove an aluminum oxide film formed on a first surface of the first sheet, and then placing the first sheet into oxalic acid solution to conduct a second anodic oxidation, so as to form a second sheet; S4. placing a second surface of the second sheet, on which aluminum is not oxidized, into a saturated copper chloride solution to conduct a replacement reaction so as to remove the aluminum completely, to form a third sheet; and S5. forming the through holes in the third sheet by using phosphoric acid to form the anodic aluminum oxide sheet. 13. The method according to claim 12 , wherein, in the step S1, the first mixed solution is prepared by mixing absolute ethanol and perchloric acid with 4 to 1:1 by volume, and the electropolishing is conducted at a voltage in a range of from 15V to 18V. 14. The method according to claim 12 , wherein, in the step S2, the oxalic acid solution has a concentration range of 0.3 mM to 1 mM, and the first anodic oxidation is conducted at a voltage in a range of from 40V to 50V and lasts for 3 to 4 hours. 15. The method according to claim 12 , wherein, in the step S3, the second mixed solution is prepared by mixing 1.8 wt. % chromic acid and 6 wt. % phosphoric acid. 16. The method according to claim 12 , wherein, in the step S3, the second anodic oxidation is conducted at a voltage in a range of from 20V to 50V and lasts for 20 minutes to 48 hours. 17. The method according to claim 12 , wherein, in the step S5, the phosphoric acid has a concentration range of 5 wt. % to 10 wt. %, and the through holes are formed within a time range of from 4 to 10 hours. 18. The method according to claim 12 , wherein, in the step S5, diameters of the through holes are controlled to be within a range of from 5 nm to 200 nm. 19. The method according to claim 1 , wherein, the quantum dots are dispersed into the plurality of through holes of the anodic aluminum oxide sheet by drop-in or spin-coating.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9780257B1 cover?
A method of preparing a quantum dot layer, including: placing an anodic aluminum oxide sheet with a plurality of through holes on a substrate; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer.
Who is the assignee on this patent?
Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01L33/06. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).