Light Emitting Diode Epitaxial Structure and Light Emitting Diode
US-2024297271-A1 · Sep 5, 2024 · US
US9780257B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9780257-B1 |
| Application number | US-201615224234-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jul 29, 2016 |
| Priority date | Mar 16, 2016 |
| Publication date | Oct 3, 2017 |
| Grant date | Oct 3, 2017 |
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A method of preparing a quantum dot layer, including: placing an anodic aluminum oxide sheet with a plurality of through holes on a substrate; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer.
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What is claimed is: 1. A method of preparing a quantum dot light emitting diode display device, comprising: forming a hole transport layer; placing an anodic aluminum oxide sheet with a plurality of through holes on the hole transport layer, wherein a diameter of each through hole is larger than a thickness of a partition wall between any two adjacent through holes; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer on the hole transport layer. 2. The method according to claim 1 , before forming the hole transport layer, further comprising: providing a substrate; and forming an anode and a hole blocking layer on the substrate in that order. 3. The method according to claim 2 , after forming the quantum dot layer, further comprising: forming an electron transport layer, an electron blocking layer and a cathode on the quantum dot layer in that order. 4. A method of preparing a quantum dot light emitting diode display device, comprising: forming a hole transport layer; forming a protective layer on the hole transport layer; placing an anodic aluminum oxide sheet with a plurality of through holes on the protective layer, wherein a diameter of each through hole is larger than a thickness of a partition wall between any two adjacent through holes; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer on the protective layer. 5. The method according to claim 4 , wherein, the protective layer is one selected from p-type doping protective layer, n-type doping protective layer and anisotropic conductive layer. 6. The method according to claim 4 , before forming the hole transport layer, further comprising: providing a substrate; and forming an anode and a hole blocking layer on the substrate in that order. 7. The method according to claim 6 , after forming the quantum dot layer, further comprising: forming an electron transport layer, an electron blocking layer and a cathode on the quantum dot layer in that order. 8. A quantum dot light emitting diode display device, which is prepared by the method according to claim 7 . 9. The method according to claim 1 , wherein the anodic aluminum oxide sheet is removed by dissolution. 10. The method according to claim 9 , wherein the anodic aluminum oxide sheet is removed by being immersed in an acid or alkali solution of a low concentration. 11. The method according to claim 10 , wherein: the low concentration comprises a concentration range of from 5 wt. % to 10 wt. %; the acid solution is selected from hydrochloric acid solution or phosphoric acid solution; and the alkali solution is NaOH solution. 12. The method according to claim 1 , wherein the anodic aluminum oxide sheet is prepared by using a method comprising: S1. cleaning an aluminum sheet and placing the cleaned aluminum sheet into a first mixed solution to electropolish it; S2. placing the electropolished aluminum sheet into oxalic acid solution to conduct a first anodic oxidation, so as to form a first sheet; S3. placing the first sheet into a second mixed solution to conduct a water bath, so as to remove an aluminum oxide film formed on a first surface of the first sheet, and then placing the first sheet into oxalic acid solution to conduct a second anodic oxidation, so as to form a second sheet; S4. placing a second surface of the second sheet, on which aluminum is not oxidized, into a saturated copper chloride solution to conduct a replacement reaction so as to remove the aluminum completely, to form a third sheet; and S5. forming the through holes in the third sheet by using phosphoric acid to form the anodic aluminum oxide sheet. 13. The method according to claim 12 , wherein, in the step S1, the first mixed solution is prepared by mixing absolute ethanol and perchloric acid with 4 to 1:1 by volume, and the electropolishing is conducted at a voltage in a range of from 15V to 18V. 14. The method according to claim 12 , wherein, in the step S2, the oxalic acid solution has a concentration range of 0.3 mM to 1 mM, and the first anodic oxidation is conducted at a voltage in a range of from 40V to 50V and lasts for 3 to 4 hours. 15. The method according to claim 12 , wherein, in the step S3, the second mixed solution is prepared by mixing 1.8 wt. % chromic acid and 6 wt. % phosphoric acid. 16. The method according to claim 12 , wherein, in the step S3, the second anodic oxidation is conducted at a voltage in a range of from 20V to 50V and lasts for 20 minutes to 48 hours. 17. The method according to claim 12 , wherein, in the step S5, the phosphoric acid has a concentration range of 5 wt. % to 10 wt. %, and the through holes are formed within a time range of from 4 to 10 hours. 18. The method according to claim 12 , wherein, in the step S5, diameters of the through holes are controlled to be within a range of from 5 nm to 200 nm. 19. The method according to claim 1 , wherein, the quantum dots are dispersed into the plurality of through holes of the anodic aluminum oxide sheet by drop-in or spin-coating.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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