Conductive paste composition and method for manufacturing electrode

Patent metadata

Field	Value
Publication number	US-9780236-B2
Application number	US-201414553181-A
Country	US
Kind code	B2
Filing date	Nov 25, 2014
Priority date	Dec 17, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.

First claim

What is claimed is:

1. An unsintered conductive paste composition, comprising:
100 parts by weight of uncoated copper powder;
40 to 150 parts by weight of silver powder;
0.1 to 3 parts by weight of carbon powder;
1 to 5 parts by weight of glass powder; and
5 to 15 parts by weight of binder,
wherein the uncoated copper powder has a particle size greater than that of the silver powder, and
wherein the carbon powder is carbon nanotube or graphene with a specific surface area of 200 m 2 /g to 1000 m 2 /g.

2. The unsintered conductive paste composition as claimed in claim 1 , wherein the uncoated copper powder has a particle size of 1 μm to 10 μm.

3. The unsintered conductive paste composition as claimed in claim 1 , wherein the silver power has a particle size of 0.1 μm to 2 μm.

4. The unsintered conductive paste composition as claimed in claim 1 , wherein the binder comprises epoxy resin.

5. A method for manufacturing an electrode, comprising:
applying the unsintered conductive paste composition as claimed in claim 1 onto a substrate; and
sintering the unsintered conductive paste composition under a normal atmosphere to form an electrode on the substrate.

6. The method as claimed in claim 5 , wherein the unsintered conductive paste composition is sintered at a temperature of 600° C. to 900° C.

Assignees

• Ind Tech Res Inst

Inventors

• Chiu Chun-Yi
• Chiou Kuo-Chan
• Hsiao Wei-Han

Classifications

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• C08K2003/0806

  Silver · CPC title

• C08K3/04

  Carbon · CPC title

• B22F2201/50

  air · CPC title