Lead frame, electronic control device using lead frame, and lead-frame mounting method

Patent metadata

Field	Value
Publication number	US-9780016-B2
Application number	US-201414913010-A
Country	US
Kind code	B2
Filing date	Feb 3, 2014
Priority date	Sep 19, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Conventional lead frames could neither be self-supporting nor be picked up by an automatic mounter through suction and mounted on a circuit board. Lead frame 15 is equipped with a plurality of leads 15 d , each lead having a land-connection section 15 c formed on one end of a pin-shaped terminal 15 a with a bent section therebetween 15 b ; and a joining section 15 e joining the plurality of leads 15 d . The joining section 15 e is formed by joining a base plate to the ends of land-connection sections 15 c . This base plate makes the leads 15 d stand upright and/or has a suction surface 15 f which may be picked up by an automatic lead frame mounting device via suction.

First claim

The invention claimed is:

1. A lead frame for achieving an electrical connection between first and second circuit boards, comprising:
a plurality of leads having a land-connection section formed on one end of each of a plurality of pin-shaped terminals with a bent section therebetween, another end of each of the plurality of the pin-shaped terminals being connected with the first circuit board, and
a plate-like joining section that joins a lower end of each of the plurality of leads,
wherein, in the plurality of leads, the land-connection section has one end connected to the joining section and another end from which a respective terminal of the plurality of terminals is formed so as to stand upright via the bent section,
wherein the joining section maintains each terminal of the plurality of terminals in an upright standing condition via the bent section,
wherein the joining section has a first portion that is adapted to be positioned and mounted on a top surface of a side edge of the second circuit board when the land-connection section of the lead frame is disposed on a land formed on the second circuit board, and
wherein the joining section has a second portion that is adapted to outwardly protrude from the side edge of the second circuit board when the land-connection section of the lead frame is disposed on the land formed on the second circuit board.

2. An electronic control device, comprising:
a lead frame for achieving an electrical connection between first and second circuit boards, the lead frame including:
a plurality of leads having a land-connection section formed on one end of a plurality of pin-shaped terminals with a bent section therebetween, another end of each of the plurality of the pin-shaped terminals being connected with the first circuit board, and
a plate-like joining section that joins a lower end of each of the plurality of leads,

wherein, in the plurality of leads, the land-connection section has one end connected to the joining section and another end from which a respective terminal of the plurality of terminals is formed so as to stand upright via the bent section,
wherein the joining section maintains each terminal of the plurality of terminals in an upright standing condition via the bent section,
wherein the joining section has a first portion that is adapted to be positioned and mounted on a top surface of a side edge of the second circuit board when the land-connection section of the lead frame is disposed on a land formed on the second circuit board,
wherein the joining section has a second portion that is adapted to outwardly protrude from the side edge of the second circuit board when the land-connection section of the lead frame is disposed on the land formed on the second circuit board, and
wherein the lower end of each of the plurality of leads has a cross section that is adapted to be formed by cutting the joining section from the lead frame, the cross section facing an outside of the second circuit board.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Hagiwara Katsumasa
• Motoda Haruaki

Classifications

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/421

  Shapes or dispositions · CPC title

• H10W70/464 Primary

  Additional interconnections in combination with leadframes · CPC title

• H05K2201/10318

  Surface mounted metallic pins · CPC title