Electromagnetic dipole for plasma density tuning in a substrate processing chamber

US9779953B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9779953-B2
Application numberUS-201414491729-A
CountryUS
Kind codeB2
Filing dateSep 19, 2014
Priority dateSep 25, 2013
Publication dateOct 3, 2017
Grant dateOct 3, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Methods and apparatus for plasma-enhanced substrate processing are provided herein. In some embodiments, an apparatus for processing a substrate includes: a process chamber having an internal processing volume disposed beneath a dielectric lid of the process chamber; a substrate support disposed in the process chamber; two or more concentric inductive coils disposed above the dielectric lid to inductively couple RF energy into the processing volume above the substrate support; and an electromagnetic dipole disposed proximate a top surface of the dielectric lid between two adjacent concentric inductive coils of the two or more concentric inductive coils.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus for processing a substrate, comprising: a process chamber having an internal processing volume disposed beneath a dielectric lid of the process chamber; a substrate support disposed in the process chamber; two or more concentric inductive coils disposed above the dielectric lid to inductively couple RF energy into the processing volume above the substrate support; and an electromagnetic dipole disposed proximate a top surface of the dielectric lid between two adjacent concentric inductive coils of the two or more concentric inductive coils, wherein the electromagnetic dipole includes at least two electromagnets comprising: a first electromagnetic coil of one or more wires wrapped in a first plurality of layers and having a first polarity; and a second electromagnetic coil of one or more wires wrapped in a second plurality of layers having a second polarity opposite the first polarity, wherein the second electromagnetic coil is disposed radially outward of the first electromagnetic coil at a first distance; and an actuator configured to move at least one of the at least two electromagnets from a first position above the dielectric lid to a second position above the dielectric lid. 2. The apparatus of claim 1 , wherein the first distance is about 0.5 inches to about 5 inches. 3. The apparatus of claim 1 , wherein the first distance is 1 inch. 4. The apparatus of claim 1 , wherein the electromagnetic dipole is configured to form a magnetic field in an area proximate to and below the dielectric lid to enable plasma density tuning. 5. The apparatus of claim 1 , wherein the electromagnetic dipole is configured to adjust an impedance in an area proximate to and below the dielectric lid to enable plasma density tuning.

Assignees

Inventors

Classifications

  • H10P50/242Primary

    of Group IV materials · CPC title

  • Particular magnets or magnet arrangements for controlling the discharge · CPC title

  • Antennas, e.g. particular shapes of coils · CPC title

  • Electricity · mapped topic

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What does patent US9779953B2 cover?
Methods and apparatus for plasma-enhanced substrate processing are provided herein. In some embodiments, an apparatus for processing a substrate includes: a process chamber having an internal processing volume disposed beneath a dielectric lid of the process chamber; a substrate support disposed in the process chamber; two or more concentric inductive coils disposed above the dielectric lid to …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P50/242. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).