Insulating thermally conductive resin composition

Patent metadata

Field	Value
Publication number	US-9779853-B2
Application number	US-201414778837-A
Country	US
Kind code	B2
Filing date	Mar 3, 2014
Priority date	Mar 28, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

An insulating thermally conductive resin composition ( 1 ) includes a phase-separated structure including: a first resin phase ( 2 ) in which a first resin continues three-dimensionally; and a second resin phase ( 3 ) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler ( 4 ) unevenly distributed in the first resin phase; and large-diameter inorganic filler ( 5 ) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm.

First claim

The invention claimed is:

1. An insulating thermally conductive resin composition, comprising:
a phase-separated structure including: a first resin phase in which a thermoplastic resin continues three-dimensionally; and a second resin phase different from the first resin phase and formed of a thermosetting resin;
small-diameter inorganic filler unevenly distributed in the first resin phase; and
large-diameter inorganic filler that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler to one another, the small-diameter inorganic filler being unevenly distributed in the first resin phase,
wherein an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm, and an average particle diameter of the large-diameter inorganic filler is twice or more the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm, and
wherein, in the first resin phase, thermal conduction paths are formed by bringing the pieces of the small-diameter inorganic filler in contact with one another.

2. The insulating thermally conductive resin composition according to claim 1 , wherein the small-diameter inorganic filler is present on an interface between the first resin phase and the second resin phase.

3. The insulating thermally conductive resin composition according to claim 1 , wherein the small-diameter inorganic filler is brought into contact with an interface between the first resin phase and the second resin phase, or spans the interface.

4. The insulating thermally conductive resin composition according to claim 1 ,
wherein an amount of a sum of the small-diameter inorganic filler and the large-diameter inorganic filler in the insulating thermally conductive resin composition is 10 to 80% by volume, and
an amount of the large-diameter inorganic filler in the sum of the small-diameter inorganic filler and the large-diameter inorganic filler is 5 to 60% by volume.

5. The insulating thermally conductive resin composition according to claim 1 , wherein the small-diameter inorganic filler and the large-diameter inorganic filler contain at least one selected from the group consisting of MgO, Al 2 O 3 , BN and AlN.

6. The insulating thermally conductive resin composition according to claim 1 ,
wherein
the thermosetting resin is an epoxy resin, and the thermoplastic resin is polyether sulfone.

7. The insulating thermally conductive resin composition according to claim 6 ,
wherein the phase-separated structure is a bicontinuous structure,
the small-diameter inorganic filler and the large-diameter inorganic filler contain at least one of MgO, Al 2 O 3 and BN,
an amount of a sum of the small-diameter inorganic filler and the large-diameter inorganic filler in the insulating thermally conductive resin composition is 20 to 80% by volume, and
thermal conductivity of the insulating thermally conductive resin composition is 3 W/m·K or more.

Assignees

• Panasonic Corp

Inventors

• Kotani Yuki
• Yoden Hiroyoshi
• Kishi Hajime
• Saruwatari Takashi

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K2003/2227

  of aluminium · CPC title

• H01B3/301

  Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302 · CPC title

• H01B3/006

  Other inhomogeneous material · CPC title

• C08K3/28

  Nitrogen-containing compounds · CPC title