Evaporator, cooling device, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9778709-B2
Application number	US-201514922235-A
Country	US
Kind code	B2
Filing date	Oct 26, 2015
Priority date	Nov 4, 2014
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

There is provided an evaporator including: a container including a top plate, and a bottom plate configured to be heated by an electronic component; a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member; a side opening formed in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate; and a discharge port provided in the top plate outside the reinforcing member, and configured to discharge vapor from the container, the vapor being generated by the coolant contacting the bottom plate.

First claim

What is claimed is:

1. An evaporator comprising:
a container including a top plate, and a bottom plate configured to be heated by an electronic component;
a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member;
a first side opening formed at a lower level in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate;
a second side opening formed at an upper level in the side portion of the reinforcing member than a level of the first side opening, having an opening shape different from that of the first side opening, and configured to allow vapor to flow out into the container, the vapor being generated by the coolant contacting the bottom plate;
a discharge port provided in the top plate outside the reinforcing member, and configured to discharge the vapor from the container; and
a plurality of protrusions provided on a bottom surface of the bottom plate in the container, the plurality of protrusions arranged in a grid pattern in a plan view at regular intervals over a length and breadth of the bottom surface.

2. The evaporator according to claim 1 , wherein the reinforcing member has a cylindrical shape.

3. The evaporator according to claim 1 , wherein the reinforcing member has a conical shape with a diameter increasing from the top plate toward the bottom plate.

4. The evaporator according to claim 1 , wherein the reinforcing member has a polygonal shape in a top view.

5. The evaporator according to claim 1 , wherein a plurality of the side openings are disposed at equal intervals around a center of the reinforcing member.

6. The evaporator according to claim 1 , wherein the bottom plate is thinner than the top plate.

7. The evaporator according to claim 1 , further comprising:
a supply port provided in the top plate inside the reinforcing member, and configured to supply the coolant inside the reinforcing member,
wherein the supply port and the discharge port are disposed in close proximity to each other in a central portion of the top plate.

8. The evaporator according to claim 1 , wherein an opening area of the first side opening is equal to or larger than a surface area of the side portion of the reinforcing member.

9. A cooling device comprising:
an evaporator configured to evaporate a coolant;
a condenser configured to condense vapor of the coolant;
a liquid pipe configured to connect the evaporator and the condenser so as to supply the coolant in liquid phase from the condenser to the evaporator; and
a vapor pipe configured to connect the evaporator and the condenser so as to supply the vapor from the evaporator to the condenser, the evaporator comprises
a container including a top plate, and a bottom plate configured to be heated by an electronic component,
a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant supplied through the liquid pipe is introduced inside the reinforcing member,
a first side opening formed at a lower level in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate,
a second side opening formed at an upper level in the side portion of the reinforcing member than a level of the first side opening, having an opening shape different from that of the first side opening, and configured to allow vapor to flow out into the container, the vapor being generated by the coolant contacting the bottom plate,
a discharge port provided in the top plate outside the reinforcing member, and configured to discharge the vapor to the vapor pipe, and
a plurality of protrusions provided on a bottom surface of the bottom plate in the container, the plurality of protrusions are arranged in a grid pattern in a plan view at regular intervals over a length and breadth of the bottom surface.

10. The cooling device according to claim 9 , wherein an opening area of the first side opening is equal to or larger than a surface area of the side portion of the reinforcing member.

11. An electronic apparatus comprising:
an electronic component;
an evaporator configured to evaporate a coolant by heat of the electronic component;
a condenser configured to condense vapor of the coolant;
a liquid pipe configured to connect the evaporator and the condenser so as to supply the coolant in liquid phase from the condenser to the evaporator; and
a vapor pipe configured to connect the evaporator and the condenser so as to supply the vapor from the evaporator to the condenser, the evaporator comprises
a container including a top plate, and a bottom plate configured to be heated by the electronic component,
a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant supplied through the liquid pipe is introduced inside the reinforcing member,
a first side opening formed at a lower level in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate,
a second side opening formed at an upper level in the side portion of the reinforcing member than a level of the first side opening, having an opening shape different from that of the first side opening, and configured to allow vapor to flow out into the container, the vapor being generated by the coolant contacting the bottom plate;
a discharge port provided in the top plate outside the reinforcing member, and configured to discharge the vapor to the vapor pipe, and
a plurality of protrusions provided on a bottom surface of the bottom plate in the container, the plurality of protrusions are arranged in a grid pattern in a plan view at regular intervals over a length and breadth of the bottom surface.

12. The electronic apparatus according to claim 11 , further comprising:
a circuit board having the electronic component, the electronic component being fixed to the circuit board, wherein the evaporator is mechanically fixed to the circuit board with the electronic component sandwiched between the circuit board and the evaporator.

13. The electronic apparatus according to claim 11 , wherein an opening area of the first side opening is equal to or larger than a surface area of the side portion of the reinforcing member.

Assignees

• Fujitsu Ltd

Inventors

• So Tsuyoshi
• Kubo Hideo

Classifications

• F28F2225/04

  for conduits · CPC title

• F28F3/048

  in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• G06F1/20 Primary

  Cooling means · CPC title