Dual sided latching retainer for computer modules

Patent metadata

Field	Value
Publication number	US-9778708-B1
Application number	US-201615212620-A
Country	US
Kind code	B1
Filing date	Jul 18, 2016
Priority date	Jul 18, 2016
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Dual sided latching retainers including a latching mechanism fixing the dual sided latching retainer to a computer board assembly; a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly; a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly.

First claim

What is claimed is:

1. A dual sided latching retainer comprising:
a latching mechanism fixing the dual sided latching retainer to a computer board assembly;
a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly;
a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly;
wherein the first computer module is operatively connected to the first side of the computer board assembly via a first module connector, and wherein the second computer module is operatively connected to the second side of the computer board assembly via a second module connector.

2. The dual sided latching retainer of claim 1 , wherein the latching mechanism enables the dual side latching retainer to be removed from the computer board assembly.

3. The dual sided latching retainer of claim 1 , wherein the latching mechanism comprises:
a retaining pin configured for insertion into a retaining pin cavity on the computer board assembly; and
a latch release tab configured to release the retaining pin from the retaining pin cavity.

4. The dual sided latching retainer of claim 1 , further comprising:
a keyhole setting configured to receive a narrow end of a keyhole cavity of the computer board assembly.

5. The dual sided latching retainer of claim 1 , wherein the computer module is an M.2 module.

6. An injection mold comprising:
a cavity configured to receive liquid, injected material, the cavity having a shape defined by a dual sided latching retainer, the dual sided latching retainer comprising:
a latching mechanism fixing the dual sided latching retainer to a computer board assembly;
a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly;
a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly;
wherein the first computer module is operatively connected to the first side of the computer board assembly via a first module connector, and wherein the second computer module is operatively connected to the second side of the computer board assembly via a second module connector.

7. The injection mold of claim 6 , wherein the latching mechanism enables the dual side latching retainer to be removed from the computer board assembly.

8. The injection mold of claim 6 , wherein the latching mechanism comprises:
a retaining pin configured for insertion into a retaining pin cavity on the computer board assembly; and
a latch release tab configured to release the retaining pin from the retaining pin cavity.

9. The injection mold of claim 6 , wherein the dual sided latching retainer further comprises:
a keyhole setting configured to receive a tapered end of a keyhole cavity of the computer board assembly.

10. The injection mold of claim 6 , wherein the computer module is an M.2 module.

11. A computer board assembly comprising:
a first module connector attached to a first side of the computer board assembly, wherein the first module connector is configured to receive a first computer module;
a second module connector attached to a second side of the computer board assembly, wherein the second module connector is configured to receive a second computer module;
at least two keyhole cavities configured to receive a dual sided latching retainer configured to:
hold the first computer module against the first side of the computer board assembly; and
hold the second computer module against the second side of the computer board assembly.

12. The computer board assembly of claim 11 , further comprising one or more retaining pin cavities configured to receive a retaining pin of the dual sided latching retainer.

13. The computer board assembly of claim 11 , wherein the first module connector and the second module connector are placed in a same location on opposite sides of the computer board assembly and oriented in the same direction.

14. The computer board assembly of claim 11 , further comprising a board connector configured to communicatively couple the computer board assembly to a computer system.

15. The computer board assembly of claim 11 , wherein a first keyhole cavity of the at least two keyhole cavities is configured for a first size of the first computer module and the second computer module, and wherein a second keyhole cavity of the at least two keyhole cavities is configured for a second size of the second computer module and the second computer module.

Assignees

• Lenovo Entpr Solutions Singapore Pte Ltd

Inventors

• Meserth Timothy A
• Wormsbecher Paul A
• Wu Yi-Lung

Classifications

• H01R12/732

  Printed circuits being in the same plane · CPC title

• G06F1/185 Primary

  Mounting of expansion boards · CPC title

• H01R12/83

  connected with pivoting of printed circuits or like after insertion · CPC title

• H01R12/7029

  not integral with the coupling device · CPC title

• H01R12/721

  cooperating directly with the edge of the rigid printed circuits · CPC title