Preparation element set, preparation, manufacturing method of preparation, imaging apparatus, and imaging method

Patent metadata

Field	Value
Publication number	US-9778449-B2
Application number	US-201514741708-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jun 27, 2014
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A preparation element set including an image sensor including a sensor surface, a sensor back surface, and a board; a package including a front surface, a back surface, and terminals on the back surface, the front surface touching or facing the sensor back surface; and a transparent plate facing the sensor surface with a subject placed therebetween, wherein the board includes a board surface and a board back surface, a distance between the board surface and the sensor surface is less than a distance between the board back surface and the sensor surface, a distance between the board surface and the sensor back surface is more than a distance between the board back surface and the sensor back surface, conductive holes pierce the board from the board surface to the board back surface, and conductors on the board surface are electrically connected to terminals by using the conductive holes.

First claim

What is claimed is:

1. A preparation element set, comprising:
an image sensor including a sensor surface, a sensor back surface opposite to the sensor surface, and a board;
a package including a front surface, a back surface opposite to the front surface, and a plurality of terminals on the back surface, the front surface touching or facing the sensor back surface; and
a transparent plate facing the sensor surface with a subject placed therebetween,
wherein the board includes a board surface and a board back surface opposite to the board surface,
wherein a distance between the board surface and the sensor surface is less than a distance between the board back surface and the sensor surface,
wherein a distance between the board surface and the sensor back surface is more than a distance between the board back surface and the sensor back surface,
wherein a plurality of conductive holes pierces the board from the board surface to the board back surface, and
wherein a plurality of conductors on the board surface is electrically connected to the plurality of terminals by using the plurality of conductive holes.

2. The preparation element set according to claim 1 , wherein the board is manufactured of a semiconductor, and includes a plurality of electrodes on the board back surface connected to the plurality of conductors on the board surface, and
wherein the electrodes are electrically connected to the terminals of the package.

3. The preparation element set according to claim 2 , wherein the image sensor has a through silicon via (TSV) structure.

4. The preparation element set according to claim 2 , wherein the electrodes are covered with an insulator disposed on the front surface of the package.

5. The preparation element set according to claim 1 , wherein the transparent plate is a slide glass plate having a size of 76 mm in a first direction and 26 mm in a second direction perpendicular to the first direction.

6. A preparation comprising:
an image sensor including a sensor surface, a sensor back surface opposite to the sensor surface, and a board;
a package including a front surface, a back surface opposite to the front surface, and a plurality of terminals on the back surface, the front surface touching or facing the sensor back surface; and
a transparent plate facing the sensor surface with a subject placed therebetween,
wherein the board includes a board surface and a board back surface opposite to the board surface,
wherein a distance between the board surface and the sensor surface is less than a distance between the board back surface and the sensor surface,
wherein a distance between the board surface and the sensor back surface is more than a distance between the board back surface and the sensor back surface,
wherein a plurality of conductive holes pierces the board from the board surface to the board back surface, and
wherein a plurality of conductors on the board surface is electrically connected to the plurality of terminals by using the plurality of conductive holes.

7. The preparation according to claim 6 , wherein the board is manufactured of a semiconductor, and includes a plurality of electrodes on the board back surface connected to the conductors on the board surface, and
wherein the electrodes are electrically connected to the terminals of the package.

8. The preparation according to claim 7 , wherein the image sensor has a through silicon via (TSV) structure.

9. The preparation according to claim 7 , wherein the electrodes are covered with an insulator disposed on the front surface of the package.

10. The preparation according to claim 6 , wherein the transparent plate is a slide glass plate having a size of 76 mm in a first direction and 26 mm in a second direction perpendicular to the first direction.

11. A manufacturing method of a preparation, comprising:
making a front surface of a package including the front surface, a back surface opposite to the front surface, and a plurality of terminals on the back surface be in touch with or face a sensor back surface of an image sensor including a sensor surface, the sensor back surface opposite to the sensor surface, and a board;
placing a subject on a transparent plate or the sensor surface; and
fixing the transparent plate and the image sensor in a manner such that the transparent plate faces the sensor surface with the subject placed therebetween,
wherein the board includes a board surface and a board back surface opposite to the board surface,
wherein a distance between the board surface and the sensor surface is less than a distance between the board back surface and the sensor surface,
wherein a distance between the board surface and the sensor back surface is more than a distance between the board back surface and the sensor back surface,
wherein a plurality of conductive holes pierces the board from the board surface to the board back surface, and
wherein a plurality of conductors on the board surface is electrically connected to the plurality of terminals by using the plurality of conductive holes.

12. The manufacturing method according to claim 11 , wherein the fixing includes dipping the image sensor into a liquid, and placing the subject onto the sensor surface, wherein the manufacturing method further comprises pulling the image sensor with the subject placed on the sensor surface out of the liquid.

13. The manufacturing method according to claim 11 , further comprising, subsequent to placing the subject on the transparent plate or the sensor surface, staining the subject; and
drying the subject.

14. An imaging apparatus comprising:
a socket that is loaded with the preparation according to claim 6 , and is electrically connected to the image sensor via the plurality of terminals;
a light source unit that emits light on the image sensor via the transparent plate; and
a control device that causes the image sensor to photograph the subject by controlling the light source unit and the image sensor on the preparation loaded in the socket.

15. The imaging apparatus according to claim 14 , wherein the light source unit comprises a plurality of light sources or a moving light source, and
wherein the control device emits the light onto the subject with an angle of the light changed by plural times to photograph the subject at different angles.

16. An imaging method comprising:
loading the preparation according to claim 6 into a socket of an imaging apparatus and electrically connecting the socket to the image sensor via the plurality of terminals;
emitting light from a light source unit to the image sensor through the transparent plate; and
causing the image sensor to photograph the subject by controlling the light source unit and the mage sensor on the preparation loaded in the socket.

17. The imaging method according to claim 16 , wherein the light source unit comprises a plurality of light sources or a moving light source, and
wherein the causing includes emitting the light onto the subject with an angle of the light changed by plural times to photograph the subject at different angles.

18. A preparation element set comprising:
an image sensor chip including a semiconductor board having a plurality of through-holes, a plurality of photoelectric converters disposed on a front side of the semiconductor board, and a signal pickup unit disposed on a back surface of the semiconductor board opposite to the front side and electrically connected to a circuit disposed on the front side via the through-holes; and
a transparent preparation, th

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Motomura Hideto
• Kato Yoshihisa
• Tanaka Tsuyoshi
• Tamaki Tokuhiko

Classifications

• G02B21/06 Primary

  Means for illuminating specimens · CPC title

• G02B21/362

  Mechanical details, e.g. mountings for the camera or image sensor, housings (G02B21/364 takes precedence) · CPC title